P/N 411320B02500
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411320B02500 (pdf) |
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Board Level Heat Sinks P/N 411320B02500 TO-218, TO-220 & TO-247 Temp Rise Above Ambient - oC Mounting Surface Thermal Resistance - oC / Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-218, TO-220 & TO-247 • Size x mm • Material Aluminum • Weight g • Type Stamped • Finish Black Anodized • PCB Mounting Solderable Pins • Package Bulk • Accessories Hardware & Thermal Interface Material • Hole for Device Attachment • Dual Device Cooling Heat Sink • Vertical Mounting via Solderable Pins • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 Air Velocity - LFM Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: 1000 5 |
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