76650-0192

76650-0192 Datasheet

Datasheet for 76650-0192

Part	Datasheet
76650-0192	76650-0192 (pdf)

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1801 Morgan Street Rockford, Illinois 61102 800-435-2931 Datasheet for 76650-0192 General Information Part Number: 76650-0192 Manufacturer: Molex / Waldom Title Description Product Family: Deluxe Board Stacking Application Kit Includes KK100, HDM, EBBI 50D, SEARAY, Plateau HS Mezz, IEEE1386, SlimStack Product Families. Pitches range 0.635mm - 2.54mm Mezzanine IEEE 1386, SlimStack , 100, EBBI 50D, Plateau HS Mezz , and SEARAY* Certificates: Molex Parts within this kit - EU RoHS and RoHS by Exempt Compliant Country of Origin Kit assembled in U.S.A. Specifications Design Configuration: Pitch Connector Type Circuit Sizes Current Rating Voltage: Board-to-Board 0.635mm 1.0mm 1.20mm 1.27mm [1.27mm .050" ]sq. , 2mm and 2.54mm Receptacles and Headers/Plugs 2, 3, 4, 6, 8, 12, 20, 50, 64, 72 and 200 and 4 Amps 30, 100 and 240 Volts Product Highlights The SEARAY board-to-board connector is designed for computer, networking, telecom, storage and general market applications with high pin-count devices or memory modules that are mounted on mezzanine or module PC Boards PCBs . The design of our SEARAY has superior electrical and mechanical features that are cost competitive. The unique, Molex-patented, solder charge technology results in better process yields and a lower applied cost versus equivalent BGA connector products. Circuit sizes range from 160 through 500 positions, and mated stack heights cover 7mm to 13mm Molex's SlimStack connectors are tested to accommodate frequency rates up to 3 GHz for various high-speed applications. With a broad range of circuit sizes and stack heights, SlimStack offers an economical way to achieve high-speed performance in both 50 and 100 Ohm systems. Utilizes proprietary Plateau Technology plated gold housing to provide a highspeed high-density mezzanine connector system for differential and single-ended signal applications. The gold-plated plastic shields each differential pair from neighboring pairs, lowering crosstalk and improving signal clarity. Different stack heights and circuit sizes provide flexibility in design and grounding the conductive housing eliminates the need for individual ground pin designations within the connector. * SEARAY is a trademark of Samtec, Inc. is a registered trademark of Amphenol Corporation For additional Molex / Waldom Design and Solution Kits please go to Page 1 of 6 1801 Morgan Street Rockford, Illinois 61102 800-435-2931 Datasheet for 76650-0192 Product Highlights continued The High Density Metric HDM connector system is designed for applications that require high interconnect density and high-speed signal integrity. Signal modules of 72 and 144 contacts are available. Daughtercard modules are combined on a metal stiffener so that they are handled as one connector. Special modules are available for power, guidance, mounting and coding functions. These building blocks can be combined to create very large connectors. Connectors of above 1000 circuits are not unusual. The power contacts can handle 15A of current per power blade, efficiently delivering hundreds of watts in multiple voltage levels, even in hot plug applications. The IEEE 1386 standard contains the details for adding standardized PCI mezzanine cards PMC to VMEbus and Multibus host boards. There are also many LAN, WAN, telecommunications, PC and workstation users who want a standardized mezzanine scheme and see the IEEE 1386 as the best approach. The fully shrouded leaf-style design minimizes the chance of damaging plug contacts. Our receptacle contacts feature a low mating force that reduces PCB stress. Gold over Nickel contact plating enhances long-term reliability, while the UL94V-0 LCP housings withstand SMT reflow processes. Excellent tolerance absorption allows the connector to be used in combinations of one to four mated pairs for up to 256 circuits. The connector design is hard-metric, easy-mating, robust, surface-mounted and features high circuit density, with excellent electrical performance. Along with that, it comes in a range of stacking heights from through 15.00mm through for optimizing system function. The proven KK system of "building block" connectors can be used to create thousands of different configurations. The Molex KK interconnection system can provide all the options necessary to complement PC board interconnection design requirements. For this reason, KK has become known as a versatile interconnecting system developed to meet the challenge of modularization. The Molex EBBI 50D series meets the market demand for low-cost, unshielded, high density, leaf-style connectors. Several configurations are available including vertical, right angle and blind-mating to provide valuable design flexibility and expandability. Leaf-style terminals are arranged in two rows on spacing within a polarized "D"shaped housing for rugged mechanical protection. Housings are made of high temperature, UL 94V-0 thermoplastic. Terminals are plated with 30 micro-inches min. gold in the mating area for long term reliability and durability. is a registered trademark of Amphenol Corporation • Unique patented solder attach is more cost effective and reliable than BGA • SEARAY footprint is compatible with other 1.27mm .050" by 1.27mm .050" products • Robust guidance and polarization aligns connectors to mate in correct position • High and Mid-Range Computers and Servers • Medical Scanning Equipment • Military • Network Routers and Switches • Mobile Base Stations For additional Molex / Waldom Design and Solution Kits please go to Page 2 of 6 1801 Morgan Street Rockford, Illinois 61102 800-435-2931 Datasheet for 76650-0192 Features and Benefits continued Applications continued • 3 GHz performance • Cross Talk < 7% • to 16.00mm stack heights • Economical design • For 50 and 100 Ohm applications • Anti-flux design • Metal solder tabs provide PCB hold down and strain relief for SMT tails • Polarizing pegs assist placement • Housing lock on 20 to 60 circuits • Superior terminal design/wipe length • Easy board processing • Advanced gold-plated housings with integrated shielding system • Two points of contact on each signal • Multiple stack heights from 10 to25mm to • Available in 6, 12, 24, and 36 differential pair sizes 12, 24, 48 and 72 contacts

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1801 Morgan Street Rockford, Illinois 61102 800-435-2931

Datasheet for 76650-0192

General Information

Part Number:
76650-0192

Manufacturer:

Molex / Waldom

Title Description Product Family:

Deluxe Board Stacking Application Kit

Includes KK100, HDM, EBBI 50D, SEARAY, Plateau HS Mezz, IEEE1386, SlimStack Product Families. Pitches range 0.635mm - 2.54mm Mezzanine IEEE 1386, SlimStack , 100, EBBI 50D, Plateau HS Mezz , and SEARAY*

Certificates:

Molex Parts within this kit - EU RoHS and RoHS by Exempt Compliant

Country of Origin Kit assembled in U.S.A.

Specifications

Design Configuration:

Pitch Connector Type Circuit Sizes Current Rating Voltage:

Board-to-Board 0.635mm 1.0mm 1.20mm 1.27mm [1.27mm .050" ]sq. , 2mm and 2.54mm Receptacles and Headers/Plugs 2, 3, 4, 6, 8, 12, 20, 50, 64, 72 and 200 and 4 Amps 30, 100 and 240 Volts

Product Highlights

The SEARAY board-to-board connector is designed for computer, networking, telecom, storage and general market applications with high pin-count devices or memory modules that are mounted on mezzanine or module PC Boards PCBs . The design of our SEARAY has superior electrical and mechanical features that are cost competitive. The unique, Molex-patented, solder charge technology results in better process yields and a lower applied cost versus equivalent BGA connector products. Circuit sizes range from 160 through 500 positions, and mated stack heights cover 7mm to 13mm Molex's SlimStack connectors are tested to accommodate frequency rates up to 3 GHz for various high-speed applications. With a broad range of circuit sizes and stack heights, SlimStack offers an economical way to achieve high-speed performance in both 50 and 100 Ohm systems. Utilizes proprietary Plateau Technology plated gold housing to provide a highspeed high-density mezzanine connector system for differential and single-ended signal applications. The gold-plated plastic shields each differential pair from neighboring pairs, lowering crosstalk and improving signal clarity. Different stack heights and circuit sizes provide flexibility in design and grounding the conductive housing eliminates the need for individual ground pin designations within the connector.
* SEARAY is a trademark of Samtec, Inc. ** is a registered trademark of Amphenol Corporation

For additional Molex / Waldom Design and Solution Kits please go to Page 1 of 6
1801 Morgan Street Rockford, Illinois 61102 800-435-2931

Datasheet for 76650-0192

Product Highlights continued

The High Density Metric HDM connector system is designed for applications that require high interconnect density and high-speed signal integrity. Signal modules of 72 and 144 contacts are available. Daughtercard modules are combined on a metal stiffener so that they are handled as one connector. Special modules are available for power, guidance, mounting and coding functions. These building blocks can be combined to create very large connectors. Connectors of above 1000 circuits are not unusual. The power contacts can handle 15A of current per power blade, efficiently delivering hundreds of watts in multiple voltage levels, even in hot plug applications. The IEEE 1386 standard contains the details for adding standardized PCI mezzanine cards PMC to VMEbus and Multibus host boards. There are also many LAN, WAN, telecommunications, PC and workstation users who want a standardized mezzanine scheme and see the IEEE 1386 as the best approach. The fully shrouded leaf-style design minimizes the chance of damaging plug contacts. Our receptacle contacts feature a low mating force that reduces PCB stress. Gold over Nickel contact plating enhances long-term reliability, while the UL94V-0 LCP housings withstand SMT reflow processes. Excellent tolerance absorption allows the connector to be used in combinations of one to four mated pairs for up to 256 circuits. The connector design is hard-metric, easy-mating, robust, surface-mounted and features high circuit density, with excellent electrical performance. Along with that, it comes in a range of stacking heights from through 15.00mm through for optimizing system function. The proven KK system of "building block" connectors can be used to create thousands of different configurations. The Molex KK interconnection system can provide all the options necessary to complement PC board interconnection design requirements. For this reason, KK has become known as a versatile interconnecting system developed to meet the challenge of modularization. The Molex EBBI 50D series meets the market demand for low-cost, unshielded, high density, leaf-style connectors. Several configurations are available including vertical, right angle and blind-mating to provide valuable design flexibility and expandability. Leaf-style terminals are arranged in two rows on spacing within a polarized "D"shaped housing for rugged mechanical protection. Housings are made of high temperature, UL 94V-0 thermoplastic. Terminals are plated with 30 micro-inches min. gold in the mating area for long term reliability and durability.
** is a registered trademark of Amphenol Corporation
• Unique patented solder attach is more cost effective and reliable than BGA
• SEARAY footprint is compatible with other 1.27mm .050" by 1.27mm .050" products
• Robust guidance and polarization aligns connectors to mate in correct position
• High and Mid-Range Computers and Servers
• Medical Scanning Equipment
• Military
• Network Routers and Switches
• Mobile Base Stations

For additional Molex / Waldom Design and Solution Kits please go to Page 2 of 6
1801 Morgan Street Rockford, Illinois 61102 800-435-2931

Datasheet for 76650-0192

Features and Benefits continued

Applications continued
• 3 GHz performance
• Cross Talk < 7%
• to 16.00mm stack heights
• Economical design
• For 50 and 100 Ohm applications
• Anti-flux design
• Metal solder tabs provide PCB hold down
and strain relief for SMT tails
• Polarizing pegs assist placement
• Housing lock on 20 to 60 circuits
• Superior terminal design/wipe length
• Easy board processing
• Advanced gold-plated housings with integrated shielding system
• Two points of contact on each signal
• Multiple stack heights from 10 to25mm
to
• Available in 6, 12, 24, and 36 differential
pair sizes 12, 24, 48 and 72 contacts

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 76650-0192 Datasheet file may be downloaded here without warranties.

Datasheet ID: 76650-0192 649863