MX25L3236DM2I-10G

MX25L3236DM2I-10G Datasheet

MX25L3236D

Part	Datasheet
MX25L3236DM2I-10G	MX25L3236DM2I-10G (pdf)

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MX25L3236D MX25L3236D DATASHEET P/N PM1486 MX25L3236D Contents 5 SOFTWARE 5 HARDWARE 6 GENERAL 7 Table Additional Feature 7 PIN CONFIGURATIONS 8 PIN 8 BLOCK 9 DATA 10 Table Protected Area 11 Table 4K-bit Secured OTP 11 Memory 12 Table Memory Organization 12 DEVICE 14 Figure Serial Modes 14 COMMAND 15 Table Command 15 1 Write Enable 17 2 Write Disable 17 3 Read Identification 17 4 Read Status Register 18 5 Write Status Register 19 Table Protection 19 6 Read Data Bytes 20 7 Read Data Bytes at Higher Speed 20 8 Dual Read Mode 20 9 2 x I/O Read Mode 21 10 Quad Read Mode 21 11 4 x I/O Read Mode 21 12 Sector Erase 22 13 Block Erase 22 14 Chip Erase 22 15 Page Program 23 16 4 x I/O Page Program 23 17 Continuously program mode CP 23 18 Deep Power-down 24 19 Release from Deep Power-down RDP , Read Electronic Signature 25 20 Read Electronic Manufacturer ID & Device ID REMS , REMS2 , 25 P/N PM1486 MX25L3236D Table ID Definitions 26 21 Enter Secured OTP 26 22 Exit Secured OTP 26 23 Read Security Register 26 Table Security Register 27 24 Write Security Register 27 POWER-ON 28 ELECTRICAL 29 ABSOLUTE MAXIMUM 29 Figure 2.Maximum Negative Overshoot 29 CAPACITANCE TA = 25°C, f = 29 Figure Maximum Positive Overshoot 29 Figure INPUT TEST WAVEFORMS AND MEASUREMENT 30 Figure OUTPUT 30 Table DC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 31 Table AC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V Timing 33 Figure Serial Input 33 Figure Output 33 Figure WP# Setup Timing and Hold Timing during WRSR when 34 Figure Write Enable WREN Sequence Command 34 Figure Write Disable WRDI Sequence Command 34 Figure Read Identification RDID Sequence Command 35 Figure Read Status Register RDSR Sequence Command 35 Figure Write Status Register WRSR Sequence Command 35 Figure Read Data Bytes READ Sequence Command 36 Figure Read at Higher Speed FAST_READ Sequence Command 36 Figure Dual Read Mode Sequence Command 37 Figure 2 x I/O Read Mode Sequence Command 37 Figure Quad Read Mode Sequence Command 38 Figure 4 x I/O Read Mode Sequence Command 38 Figure 4 x I/O Read enhance performance Mode Sequence Command 39 Figure Page Program PP Sequence Command 40 Figure 4 x I/O Page Program 4PP Sequence Command 40 Figure Continously Program CP Mode Sequence with Hardware Detection Command AD .................. 41 Figure Sector Erase SE Sequence Command 41 Figure Block Erase BE Sequence Command 41 Figure Chip Erase CE Sequence Command 60 or 42 Figure Deep Power-down DP Sequence Command 42 Figure Release from Deep Power-down and Read Electronic Signature RES Sequence Command AB . 42 Figure Release from Deep Power-down RDP Sequence Command 43 P/N PM1486 MX25L3236D P/N PM1486 MX25L3236D 32M-BIT [x 1/x 2/x 4] CMOS MXSMIOTM SERIAL MULTI I/O FLASH MEMORY GENERAL • Serial Peripheral Interface compatible -- Mode 0 and Mode 3 • 32M:33,554,432 x 1 bit structure or 16,772,216 x 2 bits two I/O read mode structure or 8,388,608 x 4 bits four I/O read mode structure • 1024 Equal Sectors with 4K byte each 32Mb - Any Sector can be erased individually • 64 Equal Blocks with 64K byte each 32Mb - Any Block can be erased individually • Power Supply Operation - to volt for read, erase, and program operations • Latch-up protected to 100mA from -1V to Vcc +1V PERFORMANCE • High Performance - Fast read - 1 I/O 104MHz with 8 dummy cycles - 4 I/O 75MHz with 6 dummy cycles - 2 I/O 75MHz with 4 dummy cycles - Fast access time 104MHz serial clock - Serial clock of four I/O read mode 75MHz, which is equivalent to 300MHz - Fast program time 1.4ms typ. and 5ms max. /page 256-byte per page - Byte program time 9us typical - Continuously program mode automatically increase address under word program mode - Fast erase time 60ms typ. /sector 4K-byte per sector 0.7s typ. /block 64K-byte per block 25s typ. /chip • Low Power Consumption - Low active read current 25mA max. at 104MHz and 10mA max. at 33MHz - Low active programming current 20mA max. - Low active erase current 20mA max. - Low standby current 20uA max. • Typical 100,000 erase/program cycles • 20 years data retention SOFTWARE FEATURES • Input Data Format - 1-byte Command code • Advanced Security Features - Block lock protection The BP0-BP3 status bit defines the size of the area to be software protection against program and erase instructions - Additional 4K bit secured OTP for unique identifier • Auto Erase and Auto Program Algorithm - Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algorithm that automatically times the program pulse widths Any page to be programed should have page in the erased state first P/N PM1486 MX25L3236D • Status Register Feature • Electronic Identification - JEDEC 1-byte manufacturer ID and 2-byte device ID - RES command for 1-byte Device ID - Both REMS,REMS2 and REMS4 commands for 1-byte manufacturer ID and 1-byte device ID HARDWARE FEATURES • SCLK Input - Serial clock input • SI/SIO0 - Serial Data Input or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode • SO/SIO1 - Serial Data Output or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode • WP#/SIO2 - Hardware write protection or serial data Input/Output for 4 x I/O read mode • NC/SIO3 - NC pin or serial data Input/Output for 4 x I/O read mode • PACKAGE - 8-pin SOP 200mil - All Pb-free devices are RoHS Compliant P/N PM1486 MX25L3236D MX25L3236D is a 32,554,432 bit serial Flash memory, which is configured as 4,194,304 x 8 internally. When it is in two or four I/O read mode, the structure becomes 16,777,216 bits x 2 or 8,388,608 bits x MX25L3236D features a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus. The three bus signals are a clock input SCLK , a serial data input SI , and a serial data output SO . Serial access to the device is enabled by CS# input. When it is in two I/O read mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for address/dummy bits input and data output. When it is in four I/O read mode, the SI pin, SO pin, WP# pin and NC pin become SIO0 pin, SIO1 pin, SIO2 pin and SIO3 pin for address/dummy bits input and data output. MX25L3236D provides sequential read operation on whole chip. ORDERING INFORMATION PART NO. MX25L3236DM2I-10G CLOCK MHz OPERATING CURRENT MAX. mA STANDBY CURRENT MAX. uA TEMPERATURE PACKAGE -40°C~85°C 8-SOP 200mil Remark Pb-free P/N PM1486 MX25L3236D PART NAME DESCRIPTION MX 25 L 3236D M2 I OPTION G Pb-free SPEED 10 104MHz TEMPERATURE RANGE I Industrial -40C to 85C PACKAGE M2 200mil 8-SOP DENSITY & MODE 3236D 32Mb standard type TYPE L 3V DEVICE 25 Serial Flash P/N PM1486 PACKAGE INFORMATION MX25L3236D P/N PM1486 MX25L3236D Removed 16-pin SOP description Removed "Advanced Information" Added fR=33MHz for tCH, tCL value Deleted fSCLK/fTSCLK Figure 5 condition Corrected Device ID Corrected chip erase cycle time Added wording "Vcc and CS# ramp up simultaneously" under Device Power-Up Changed Note 4 of Erase and Programming Performance Page P6,8,47,49 P48 P5 P32 P5,30-32 P26 P17,26 P32,46 P48 P45 Date APR/20/2009 MAY/27/2009 JUN/17/2009 OCT/02/2009 P/N PM1486 MX25L3236D Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure of a single component could cause death, personal injury, severe physical damage, or other substantial harm to persons or property, such as life-support systems, high temperature automotive, medical, aircraft and military application. Macronix and its suppliers will not be liable to you and/or any third party for any claims, injuries or damages that may be incurred due to use of Macronix's products in the prohibited applications.

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MX25L3236D

MX25L3236D DATASHEET

P/N PM1486

MX25L3236D

Contents
5 SOFTWARE 5 HARDWARE 6

GENERAL 7 Table Additional Feature 7

PIN CONFIGURATIONS 8 PIN 8 BLOCK 9 DATA 10

Table Protected Area 11 Table 4K-bit Secured OTP 11 Memory 12 Table Memory Organization 12 DEVICE 14 Figure Serial Modes 14 COMMAND 15 Table Command 15 1 Write Enable 17 2 Write Disable 17 3 Read Identification 17 4 Read Status Register 18 5 Write Status Register 19 Table Protection 19 6 Read Data Bytes 20 7 Read Data Bytes at Higher Speed 20 8 Dual Read Mode 20 9 2 x I/O Read Mode 21 10 Quad Read Mode 21 11 4 x I/O Read Mode 21 12 Sector Erase 22 13 Block Erase 22 14 Chip Erase 22 15 Page Program 23 16 4 x I/O Page Program 23 17 Continuously program mode CP 23 18 Deep Power-down 24 19 Release from Deep Power-down RDP , Read Electronic Signature 25 20 Read Electronic Manufacturer ID & Device ID REMS , REMS2 , 25

P/N PM1486

MX25L3236D

Table ID Definitions 26 21 Enter Secured OTP 26 22 Exit Secured OTP 26 23 Read Security Register 26 Table Security Register 27 24 Write Security Register 27 POWER-ON 28 ELECTRICAL 29 ABSOLUTE MAXIMUM 29 Figure 2.Maximum Negative Overshoot 29 CAPACITANCE TA = 25°C, f = 29 Figure Maximum Positive Overshoot 29 Figure INPUT TEST WAVEFORMS AND MEASUREMENT 30 Figure OUTPUT 30 Table DC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 31 Table AC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V Timing 33 Figure Serial Input 33 Figure Output 33 Figure WP# Setup Timing and Hold Timing during WRSR when 34 Figure Write Enable WREN Sequence Command 34 Figure Write Disable WRDI Sequence Command 34 Figure Read Identification RDID Sequence Command 35 Figure Read Status Register RDSR Sequence Command 35 Figure Write Status Register WRSR Sequence Command 35 Figure Read Data Bytes READ Sequence Command 36 Figure Read at Higher Speed FAST_READ Sequence Command 36 Figure Dual Read Mode Sequence Command 37 Figure 2 x I/O Read Mode Sequence Command 37 Figure Quad Read Mode Sequence Command 38 Figure 4 x I/O Read Mode Sequence Command 38 Figure 4 x I/O Read enhance performance Mode Sequence Command 39 Figure Page Program PP Sequence Command 40 Figure 4 x I/O Page Program 4PP Sequence Command 40 Figure Continously Program CP Mode Sequence with Hardware Detection Command AD .................. 41 Figure Sector Erase SE Sequence Command 41 Figure Block Erase BE Sequence Command 41 Figure Chip Erase CE Sequence Command 60 or 42 Figure Deep Power-down DP Sequence Command 42 Figure Release from Deep Power-down and Read Electronic Signature RES Sequence Command AB . 42 Figure Release from Deep Power-down RDP Sequence Command 43

P/N PM1486

MX25L3236D
P/N PM1486

MX25L3236D
32M-BIT [x 1/x 2/x 4] CMOS MXSMIOTM SERIAL MULTI I/O FLASH MEMORY

GENERAL
• Serial Peripheral Interface compatible -- Mode 0 and Mode 3
• 32M:33,554,432 x 1 bit structure or 16,772,216 x 2 bits two I/O read mode structure or 8,388,608 x 4 bits four

I/O read mode structure
• 1024 Equal Sectors with 4K byte each 32Mb
- Any Sector can be erased individually
• 64 Equal Blocks with 64K byte each 32Mb
- Any Block can be erased individually
• Power Supply Operation
- to volt for read, erase, and program operations
• Latch-up protected to 100mA from -1V to Vcc +1V

PERFORMANCE
• High Performance
- Fast read - 1 I/O 104MHz with 8 dummy cycles - 4 I/O 75MHz with 6 dummy cycles - 2 I/O 75MHz with 4 dummy cycles
- Fast access time 104MHz serial clock - Serial clock of four I/O read mode 75MHz, which is equivalent to 300MHz - Fast program time 1.4ms typ. and 5ms max. /page 256-byte per page - Byte program time 9us typical - Continuously program mode automatically increase address under word program mode - Fast erase time 60ms typ. /sector 4K-byte per sector 0.7s typ. /block 64K-byte per block 25s typ. /chip
• Low Power Consumption
- Low active read current 25mA max. at 104MHz and 10mA max. at 33MHz - Low active programming current 20mA max. - Low active erase current 20mA max. - Low standby current 20uA max.
• Typical 100,000 erase/program cycles
• 20 years data retention

SOFTWARE FEATURES
• Input Data Format
- 1-byte Command code
• Advanced Security Features
- Block lock protection The BP0-BP3 status bit defines the size of the area to be software protection against program and erase instructions
- Additional 4K bit secured OTP for unique identifier
• Auto Erase and Auto Program Algorithm
- Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algorithm that automatically times the
program pulse widths Any page to be programed should have page in the erased state first

P/N PM1486

MX25L3236D
• Status Register Feature
• Electronic Identification
- JEDEC 1-byte manufacturer ID and 2-byte device ID
- RES command for 1-byte Device ID - Both REMS,REMS2 and REMS4 commands for 1-byte manufacturer ID and 1-byte device ID

HARDWARE FEATURES
• SCLK Input
- Serial clock input
• SI/SIO0
- Serial Data Input or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode
• SO/SIO1
- Serial Data Output or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode
• WP#/SIO2
- Hardware write protection or serial data Input/Output for 4 x I/O read mode
• NC/SIO3
- NC pin or serial data Input/Output for 4 x I/O read mode
• PACKAGE
- 8-pin SOP 200mil
- All Pb-free devices are RoHS Compliant

P/N PM1486

MX25L3236D

MX25L3236D is a 32,554,432 bit serial Flash memory, which is configured as 4,194,304 x 8 internally. When it is in two or four I/O read mode, the structure becomes 16,777,216 bits x 2 or 8,388,608 bits x MX25L3236D features a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus. The three bus signals are a clock input SCLK , a serial data input SI , and a serial data output SO . Serial access to the device is enabled by CS# input.

When it is in two I/O read mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for address/dummy bits input and data output. When it is in four I/O read mode, the SI pin, SO pin, WP# pin and NC pin become SIO0 pin, SIO1 pin, SIO2 pin and SIO3 pin for address/dummy bits input and data output.

MX25L3236D provides sequential read operation on whole chip.
ORDERING INFORMATION

PART NO. MX25L3236DM2I-10G

CLOCK MHz

OPERATING CURRENT MAX. mA

STANDBY CURRENT MAX. uA

TEMPERATURE PACKAGE
-40°C~85°C
8-SOP 200mil

Remark Pb-free

P/N PM1486

MX25L3236D

PART NAME DESCRIPTION

MX 25 L 3236D M2 I

OPTION G Pb-free

SPEED 10 104MHz

TEMPERATURE RANGE I Industrial -40C to 85C

PACKAGE M2 200mil 8-SOP

DENSITY & MODE 3236D 32Mb standard type

TYPE L 3V

DEVICE 25 Serial Flash

P/N PM1486

PACKAGE INFORMATION

MX25L3236D

P/N PM1486

MX25L3236D

Removed 16-pin SOP description

Removed "Advanced Information"

Added fR=33MHz for tCH, tCL value

Deleted fSCLK/fTSCLK Figure 5 condition

Corrected Device ID

Corrected chip erase cycle time

Added wording "Vcc and CS# ramp up simultaneously" under

Device Power-Up

Changed Note 4 of Erase and Programming Performance

Page P6,8,47,49 P48 P5 P32 P5,30-32 P26 P17,26 P32,46 P48 P45

Date APR/20/2009

MAY/27/2009 JUN/17/2009

OCT/02/2009

P/N PM1486

MX25L3236D

Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure of a single component could cause death, personal injury, severe physical damage, or other substantial harm to persons or property, such as life-support systems, high temperature automotive, medical, aircraft and military application. Macronix and its suppliers will not be liable to you and/or any third party for any claims, injuries or damages that may be incurred due to use of Macronix's products in the prohibited applications.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived MX25L3236DM2I-10G Datasheet file may be downloaded here without warranties.

Datasheet ID: MX25L3236DM2I-10G 646930