PGD050S030CSF01

PGD050S030CSF01 Datasheet


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Instant Protection From ESD Threats

Given uncontrollable operating environments and costly equipment returns, the dilemma facing circuit designers today is not Do I need to protect against ESD transients? Rather, the question is What is the best available solution for ESD transient protection?

The need for better ESD protection is evident with the changing characteristics of modern integrated circuitry. Physical geometries are
becoming more dense, operating voltages are decreasing, and operating speeds are increasing. All of these have contributed to the establishment of strict standards that must be met relative to ESD withstand capabilities IEC

In response to these issues, Littelfuse introduces the PulseGuard suppressor line providing the ultimate ESD protection for the sensitive integrated circuitry used in today’s electronic equipment.

WORLDWIDE LEADER IN CIRCUIT PROTECTION TECHNOLOGIES

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Figure 1 PulseGuard Suppressor Response Curve

Resistance

The Need for Better ESD Protection

Historically, transient voltage protection for electronic systems evolved with changing electronic technology. Prior to the use of solid state components, vacuum tubes were used as the building blocks of electronic systems. These devices exhibited substantial survivability to high voltage events such as ESD, indirect lightning, electrical fast transients EFT , and system-generated transients. The need for additional protection devices was low. However, as transistors became the building blocks of electronic systems, equipment such as modern data processing equipment became increasingly vulnerable to common ESD events.

This increased sensitivity of electronic systems can be correlated to the decreasing size of their circuitry. Simply put, as the physical geometry of the circuitry decreased, so too did the amount of energy needed to destroy the circuit’s components e.g., transistors, interconnects, insulators, etc. . As a result, the need for a new generation of products to protect extremely vulnerable circuitry has never been greater.

Resistance vs. Voltage

Voltage V

While electronic components were evolving toward their current state, a similar progression was taking place with electronic signals and the methods of information transmission. This has resulted in increased signal bandwidths, higher data transmission rates, and more complex signal waveforms. In order to maintain the integrity of these data transmissions, it is vital for new circuit protection devices to remain electrically transparent by not interfering with, or degrading, the signals.

The first generation of transient protection products was designed to mitigate the effects of the direct lightning threat. However, the source of today’s high voltage transients has expanded beyond lightning to include such threats as electrostatic discharge ESD and electrical fast transients EFT . Correspondingly, the parameters of the new threats have changed as well. For example, the current and voltage rise time of lightning transients are orders of magnitude slower than those experienced during electrostatic discharge.

The fundamental question which now needs to be asked is Can the circuit protection devices of the past provide optimal protection for the circuits of today?

The Littelfuse Solution

The suppressor line from Littelfuse employs a voltage variable material VVM that has a non-linear resistivity response to voltage see Figure While the circuit is operating normally, the ESD suppressor is electrically transparent. When an ESD event occurs, the VVM becomes conductive, shunting the ESD energy away from the circuitry. After the ESD energy has been dissipated, the suppressor returns to a consistent high off-state resistance.

PulseGuard suppressors also offer very low capacitance, assuring they will not cause degradation to, or attenuation of, data signals. This is vital given they will primarily be protecting high-speed digital data lines. Typical effects of higher capacitance when protecting with alternate technologies include distortion of the digital waveform, as seen in Figure

Voltage V

Figure 3 Digital Waveform Distortion due to Capacitance

Desired Digital Wave Shape

Distorted Wave Shape

Time s

When considering the use of ESD protection components, it is important that lead inductance be taken into account. Given the fast rise time of typical ESD events, high frequency design rules must be applied. The length of wire leads and printed circuit board traces must be minimized to reduce inductive isolation of the ESD suppressor and chassis ground. Also, suppression components constructed with lead frames and wire bonds can allow induced voltages to be experienced by the protected circuitry due to package inductance.

By using a polymer VVM, Littelfuse is able to offer suppressors in a wide range of sizes and configurations, each optimized to your specific design needs. Ideally, we recommend our connector-based products to effectively create a “leadless” installation. The ESD pulse is simply shunted to chassis ground at the outside of the equipment case. Connector configurations are also suitable in applications where board space is at a premium, or where an ESD problem was not identified until after the board design had been completed. In this case, using an ESD suppressor package that is incorporated at the connector can eliminate costly and time consuming re-design work.

If the connector configuration is not a viable packaging option, Littelfuse also offers a wide variety of surface-mount PulseGuard suppressors. These range from single-line devices to multipleline arrays. The products can also be made to fit industry standard footprints or customized to meet your specific needs. For example, the array devices can be made to fit the SOT23 outline for applications requiring two lines of protection or the S08 outline for applications requiring 7 lines of protection. Smaller nonstandard outlines may be manufactured to save board space.

Once again, it is important to remember discrete and array PulseGuard suppressors should be installed as close to the source of ESD edge of the board as possible. Since they are leadless components and do not employ leadframes or wirebonds, their contribution to voltage “overshoot” is minimized.

Key PulseGuard Features
• Bi-directional
• Fastest response time, less than 1 nanosecond
• Lowest capacitance, less than 1 picofarad
• Clamping voltage, sufficiently low for

ESD energy levels
• 24 VDC rating
• Wide range of configurations board level
and connector-based components
• Low inductance packages
• Flat frequency response from 1Hz to 1GHz Cut-off frequency 3dB point is about 3GHz Assumes source resistance
• Allows equipment compliance to ESD specifications IEC 1000-4-2, MIL-STD 883
• Durable design withstands >10,000 pulses without degradation

NOTE When specifying ESD protection devices, it is important to specify an ESD test waveform. Because rise times for ESD events are orders of magnitude faster sub-nanosecond vs. microsecond than for other overvoltage events lightning, line surge, etc. , the suppressors responses are not the same.

I/O Line ESD Source

PGB0010603 Circuit Electronic Device

PGB002ST23 Same footprint as SOT23
More datasheets: SPP12N50C3XKSA1 | SPI12N50C3XKSA1 | SPI12N50C3HKSA1 | IPP100N06S3-04 | IPI100N06S3-04 | IPB100N06S3-04 | 76650-0204 | MB88154APNF-G-102-JNE1 | MB88154APNF-G-111-JNE1 | IRGBC30UD2


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Datasheet ID: PGD050S030CSF01 646513