SPP12N50C3XKSA1

SPP12N50C3XKSA1 Datasheet


SPP12N50C3 SPI12N50C3, SPA12N50C3

Part Datasheet
SPP12N50C3XKSA1 SPP12N50C3XKSA1 SPP12N50C3XKSA1 (pdf)
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PDF Datasheet Preview
SPP12N50C3 SPI12N50C3, SPA12N50C3

Cool MOS Power Transistor

VDS Tjmax 560 V

RDS on
• Periodic avalanche rated

PG-TO220-F3P-31 PG-TO262- PG-TO220
• Extreme dv/dt rated
• Ultra low effective capacitances
• Improved transconductance
1 23 P-TO220-3-31

P-TO220-3-1
• PG-TO-220-3-31;-3-111 Fully isolated package 2500 VAC 1 minute

Type SPP12N50C3

Package PG-TO220
Ordering Code Q67040-S4579

Marking 12N50C3

SPI12N50C3 SPA12N50C3

PG-TO262 Q67040-S4578 PG-TO220FP SP000216322
12N50C3

Maximum Ratings Parameter

Continuous drain current

TC = 25 °C TC = 100 °C

Pulsed drain current, tp limited by Tjmax Avalanche energy, single pulse

ID=5.5A, VDD=50V

Avalanche energy, repetitive tAR limited by Tjmax2

ID=11.6A, VDD=50V

ID puls EAS

IAR VGS Ptot Tj , Tstg dv/dt

Value

SPP_I
71 340
±20
±20
±30
±30

Unit A

A V W °C V/ns
2009-11-30

SPP12N50C3 SPI12N50C3, SPA12N50C3

Maximum Ratings Parameter Drain Source voltage slope

VDS = 400 V, ID = A, Tj = 125 °C

Symbol dv/dt

Value 50

Unit V/ns

Thermal Characteristics Parameter

Thermal resistance, junction - case Thermal resistance, junction - case, FullPAK Thermal resistance, junction - ambient, leaded Thermal resistance, junction - ambient, FullPAK SMD version, device on PCB min. footprint 6 cm2 cooling area 3 Soldering temperature, wavesoldering mm in. from case for 10s 4

RthJC RthJC_FP RthJA RthJA_FP RthJA

Tsold

Values

Unit
min. typ. max.
1 K/W
- 260 °C

Electrical Characteristics, at Tj=25°C unless otherwise specified

Parameter
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Datasheet ID: SPP12N50C3XKSA1 638664