AUTO-AECQ-HV-KIT45

AUTO-AECQ-HV-KIT45 Datasheet


AUTOAECQ-HVKIT45

Part Datasheet
AUTO-AECQ-HV-KIT45 AUTO-AECQ-HV-KIT45 AUTO-AECQ-HV-KIT45 (pdf)
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MLCC

AEC-Q200 MLCC Capacitors

High Reliability AEC-Q200 Ranges

A range of specialist high reliability MLCCs for use in critical or high reliability environments. All fully tested/approved and available with a range of suitable termination options, including tin/lead plating and Knowles FlexiCap .

AEC-Q200 ranges are also available as X8R high temperature capacitors, 3 Terminal EMI Filters, X2Y Integrated Passive Components and in both Open Mode and Tandem capacitors.

Electrical Details

Capacitance Range
18pF to 4.7µF

Temperature Coefficient of Capacitance TCC

C0G/NP0 0 ±
±15% from to

Dissipation Factor

Cr > 50pF C0G/NP0

Cr 50pF = 0.0015 15÷Cr+0.7

Insulation Resistance IR
or 1000secs whichever is the less

Dielectric Withstand Voltage DWV

Voltage applied for 5 ±1 seconds, 50mA charging current maximum

Ageing Rate

C0G/NP0 Zero
<2% per time decade

Kit Part number

AUTOAECQ-HVKIT45

AECQ200,0805~2220,50V ~2KV,150pF~1uF,±10% X7R Flexicap,±5% C0G, 45 PN, 10~20 per PN, 710pcs total

Typical part list exact part numbers are subject to change from batch to batch 0805Y0500104KST
0805Y2500153KST 0805Y2500223KST 0805Y5000103KST 0805Y1K00221KST 0805Y1K00471KST 0805Y1K00102KST 1206Y1000823KST 1206Y2500104KST
1206Y5000332KST

Part Description Qty

FlexiCapTM
capacitors, 0805,
50V, 100nF±10%

FlexiCapTM
capacitors, 0805,
250V, 15nF±10%

FlexiCapTM
capacitors, 0805,
250V, 22nF±10%

FlexiCapTM
capacitors, 0805,
500V, 10nF±10%

FlexiCapTM
Ordering Information AEC-Q200 Ranges
1210

Chip Size
0603 0805 1206 1210 1812 1825 2220 2225 3640

Termination

Y = FlexiCap termination base with nickel barrier 100%
matte tin plating . RoHS compliant.

H = FlexiCap termination base with
nickel barrier Tin/ lead plating with min. 10% lead . Not RoHS
compliant.

J = Nickel barrier 100% matte tin
plating . RoHS compliant.

A = Nickel barrier Tin/lead plating with min. 10% lead . Not

RoHS compliant. Available in C0G/NP0
only.

Rated Voltage
050 = 50V 063 = 63V 100 = 100V 200 = 200V 250 = 250V 500 = 500V 630 = 630V 1K0 = 1kV 1K2=1.2kV 1K5=1.5kV 2K0=2kV 2K5=2.5kV 3K0=3kV
0103

Capacitance in Pico farads pF

First digit is Second and third digits are
significant figures of capacitance code. The fourth
digit is number of zeros following. Example 0103 = 10nF

Capacitance Tolerance
<10pF B = ±0.1pF C = ±0.25pF D = ±0.5pF
10pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20%

Dielectric Codes

Packaging

Suffix code

S = X7R 2R1 AEC-Q200

T = 178mm 7” reel

E = X7R 2R1 AEC-Q200

R = 330mm 13” reel

A = C0G/NP0 B = Bulk pack 1B/NP0 AEC-Q200 - tubs or trays

Used for specific customer
requirements & variants

WS2 = StackiCap

T=X8R with AECQ200 release

M01 = Open Mode T01 = Tandem

Note AEC-Q200 X7R is only
available in Y or H termination.

E01, E07= 3 terminal EMI
Ordering Information Safety Certified Capacitors Class SPU/SP ranges

Knowles 2017

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1808
0102

Chip size

Termination

Voltage

Capacitance in picofarads

Capacitance tolerance

Dielectric Packaging
codes

Suffix code
1808 2211 2215

J = Nickel barrier 100% matte tin
plating . RoHS compliant.

A25 = 250Vac

Y = FlexiCapTM termination base with Nickel barrier 100%
matte tin plating . RoHS compliant.
2211/2215 only A = Ni barrier Tin/lead plating with min. 10%
lead . Not RoHS compliant.

H = FlexiCapTM termination base with

Ni barrier Tin/lead plating with min. 10%
lead . Not RoHS compliant.

First digit is Second and third digits are significant
figures of capacitance code. The fourth digit is number of zeros
following.

Example 0102 = 1.0nF
<10pF B = ±0.10pF C = ±0.25pF D = ±0.50pF
> 10pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20%

C = C0G/NP0

X = X7R

A = C0G/NP0 1B/NP0 AEC-

Q200

E = X7R 2B1 AEC-Q200

T = 178mm 7” reel

R = 330mm 13” reel

B = Bulk pack tubs or trays

SP = Surge Protection capacitors marked and
approved
Ordering Information Safety Certified Capacitors Class PY2/SY2 ranges
1808

Chip size

J Termination

A25 Voltage
0102

Capacitance in picofarads pF

Capacitance tolerance

Dielectric codes

T Packaging

PY2 Suffix code
1808 1812

J = Nickel barrier 100% matte tin
plating . RoHS compliant.

Y = FlexiCapTM termination base with Ni barrier 100% matte
tin plating . RoHS compliant.

A25 = 250Vac

First digit is Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following.

Example 0102 = 1.0nF
<10pF B = ±0.10pF C = ±0.25pF D = ±0.50pF
> 10pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20%

C = C0G/NP0

X = X7R A = C0G/NP0 1B/NP0 AEC-Q200

E = X7R 2B1 AECQ200

T = 178mm 7” reel

R = 330mm 13” reel

B = Bulk pack tubs or trays

PY2 = Safety tested Surge Protection
capacitors marked and approved

SY2 = Surge Protection capacitors un-marked parts are in accordance with, but not certified

Knowles 2017

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Ordering Information Safety Certified Capacitors Class B16/B17 ranges
2220

Chip size

J Termination

A25 Voltage
0102

Capacitance in picofarads pF

Capacitance tolerance

Dielectric codes

T Packaging

B16 Suffix code
2220

J = Nickel barrier 100% matte tin plating . RoHS
compliant.

Y = FlexiCapTM termination base with

Nickel barrier 100% matte tin plating .

RoHS compliant.

A = Nickel barrier Tin/lead plating with
min. 10% lead . Not RoHS compliant.

H = FlexiCapTM termination base with

Nickel barrier Tin/lead plating with min. 10% lead . Not RoHS
compliant.

A25 = 250Vac

First digit is Second and third digits are significant figures of
capacitance code. The fourth digit is number of zeros
following.

Example 0102 = 1.0nF

J = ±5% K = ±10% M = ±20%

X = X7R

E = X7R 2B1 AEC-Q200

T = 178mm 7” reel
1000 pieces

R = 330mm 13” reel
4000 pieces

B = Bulk pack tubs or trays

B16 = Type A X1/Y2

B17 = Type B X2

Knowles 2017

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| Email |

Performance and Testing
Knowles / Syfer dielectric ordering code

X5R Stable
-55ºC to +85ºC
± 15%

Tangent of loss angle tan

Cr > 50pF Cr 50pF = 15 +

Stable
-55ºC to +125ºC
± 20%
± 15%
± 15%
+20 -30%
+15 -25%

X8R Stable
-55ºC to +150ºC
± 15%

Insulation resistance Ri OR

Time constant Ri*Cr whichever is the least
100G or 1000s
100G or 1000s
100G or 1000s
100G or 1000s

Cr <4.7pF
± 0.05pF H ± 0.10pF B ± 0.25pF C ± 0.50pF D

Capacitance tolerance
ordering code

Cr <10pF
± 0.10pF B ± 0.25pF C ± 0.50pF D
± 5% J ± 10% K ± 20% M
± 5% J ± 10% K ± 20% M

Cr >10p F
± 1% F ± 2% G ± 5% J ± 10% K

Dielectric strength
<200V >200V to <500V to <1000V 500V to <1000V >1kV to <1200V
>1200V >1000V

Chip

Ageing characteristic Typical

Voltage applied for 5 seconds max. Charging current limited to 50mA maximum.
times Rated voltage + 250V
times -
times
times -
times Rated voltage + 250V
times
times
55/125/56 Zero

Climatic category IEC 55/85/56
<2% per time decade
55/125/56 <2% per time decade
± 5% J ± 10% K ± 20% M
times -
55/150/56 <2% per time
decade

Tel +44 1603 723300 | Email |

Page 7 of 13

Soldering Information

Knowles / Syfer MLCCs are compatible with all recognised soldering/mounting methods for chip capacitors. A detailed application note is available at

Reflow Soldering

Knowles recommend reflow soldering as the preferred method for mounting MLCCs. Knowles MLCCs can be reflow soldered using a reflow profile generally defined in IPC/FEDEC J-STD020. Sn plated termination chip capacitors are compatible with both conventional and lead free soldering with peak temperatures of 260ºto 270ºC acceptable.

The heating ramp rate should be such that components see a temperature rise of 1.5ºto 4ºC per second to maintain temperature uniformity through the MLCC.

The time for which the solder is molten should be maintained at a minimum, so as to prevent solder leaching. Extended times above 230ºC can cause problems with oxidation of Sn plating. Use of an inert atmoshere can help if this problem is encountered. Palladium/Silver Pd/Ag terminations can be particularly susceptible to leaching with free lead, tin rich solders and trials are recommended for this combination.

Cooling to ambient temperature should be allowed to occur naturally, particularly if larger chip sizes are being soldered. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Forced cooling should be avoided as this can induce thermal breakage.

Wave Soldering

Wave soldering is generally acceptable, but the thermal stresses caused by the wave have been shown to lead to potential problems with larger or thicker chips. Particular care should be taken when soldering SM chips larger than size 1210 and with a thickness greater than 1.0mm for this reason.

Maximum permissable wave temperature is 270ºC for SM chips.

The total immersion time in solder should be kept to a minimum. It is strongly recommended that Sn/Ni plated terminations are specified for wave soldering applications.
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Datasheet ID: AUTO-AECQ-HV-KIT45 645033