IXGN50N60BD2

IXGN50N60BD2 Datasheet

IXGN 50N60BD2 IXGN 50N60BD3

Part	Datasheet
IXGN50N60BD2	IXGN50N60BD2 (pdf)

Related Parts	Information
IXGN50N60BD3	IXGN50N60BD3

PDF Datasheet Preview
HiPerFASTTM IGBT with HiPerFRED Buck & boost configurations IXGN 50N60BD2 IXGN 50N60BD3 VCES IC25 VCE sat tfi = 600 V = 75 A = V = 150 ns ...BD2 ...BD3 IGBT Symbol Test Conditions V CES VCGR 25°C 150°C TJ = 25°C to 150°C RGE = 1 MW VGES V Continuous Transient IC25 TC = 25°C IC90 TC = 90°C TC = 25°C, 1 ms SSOA VGE= 15 V, TVJ = 125°C, RG = 10 W RBSOA Clamped inductive load, L = 30 mH PC VRRM IFAVM IFRM PD TJ T Tstg M TC = 25°C TC = 70°C rectangular, d = 50% tP z<10 ms pulse width limited by TJ TC = 25°C Mounting torque Terminal connection torque M4 Weight Maximum lead temperature for soldering mm in. from case for 10 s Maximum Ratings ±20 ±30 ICM = 100 VCES -40 +150 -40 +150 Nm/lb.in. Nm/lb.in. Diode Case BVCES VGE th I

PDF Datasheet Preview

HiPerFASTTM IGBT with HiPerFRED

Buck & boost configurations

IXGN 50N60BD2 IXGN 50N60BD3

VCES IC25 VCE sat tfi
= 600 V = 75 A = V = 150 ns
...BD2
...BD3

IGBT

Symbol Test Conditions

V CES

VCGR
25°C
150°C

TJ = 25°C to 150°C RGE = 1 MW

VGES V

Continuous Transient

IC25

TC = 25°C

IC90

TC = 90°C

TC = 25°C, 1 ms

SSOA

VGE= 15 V, TVJ = 125°C, RG = 10 W

RBSOA Clamped inductive load, L = 30 mH

PC VRRM IFAVM IFRM PD TJ T

Tstg M

TC = 25°C TC = 70°C rectangular, d = 50% tP z<10 ms pulse width limited by TJ TC = 25°C

Mounting torque Terminal connection torque M4

Weight

Maximum lead temperature for soldering mm in. from case for 10 s

Maximum Ratings
±20
±30

ICM = 100

VCES
-40 +150
-40 +150

Nm/lb.in. Nm/lb.in.

Diode

Case

BVCES VGE th I

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Datasheet ID: IXGN50N60BD2 644311