ESD8V0R1B Series
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ESD8V0R1B-02EL E6433 (pdf) |
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ESD8V0R1B02ELSE6327XTSA1 |
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ESD8V0R1B02ELE6327XTMA1 |
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TVS Diodes Transient Voltage Suppressor Diodes ESD8V0R1B Series Bi-directional Low Capacitance TVS Diode ESD8V0R1B-02EL ESD8V0R1B-02ELS Data Sheet Industrial and Multi-Market Edition 2010-12-15 Published by Infineon Technologies AG 81726 Munich, Germany 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. ESD8V0R1B Series Other Trademarks Advance Design System ADS of Agilent Technologies, AMBA , ARM , MULTI-ICE , PRIMECELL , REALVIEW , THUMB of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS , FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC Visa Holdings Inc. . EPCOS of Epcos AG. FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data Association Corporation. ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB of MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC , NUCLEUS of Mentor Graphics Corporation. Mifare of NXP. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. muRata of MURATA MANUFACTURING CO., MICROWAVE OFFICE MWO of Applied Wave Research Inc., OmniVision of OmniVision Technologies, Inc. Openwave Systems Inc. RED HAT Red Hat, Inc. RFMD RF Micro Devices, Inc. SIRIUS of Sirius Sattelite Radio Inc. SOLARIS of Sun Microsystems, Inc. SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYO YUDEN of Taiyo Yuden Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA. UNIX of X/Open Company Limited. VERILOG , PALLADIUM of Cadence Design Systems, Inc. VLYNQ of Texas Instruments Incorporated. VXWORKS , WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of Diodes Zetex Limited. Last Trademarks Update 2010-06-09 Final Data Sheet ESD8V0R1B Series Table of Contents Table of Contents Table of Contents 4 List of Figures 5 List of Tables 6 Bi-directional Low Capacitance TVS Diode 7 Features 7 Application Examples 7 Product Description 7 Characteristics 8 Electrical Characteristics at TA = 25 °C, unless otherwise specified 8 Typical Performance characteristics at TA = 25 °C, unless otherwise specified 10 Application Information 12 Ordering information scheme 13 Package Information 14 PG-TSLP-2-18 14 PG-TSSLP-2-2 15 Terminology 16 Final Data Sheet ESD8V0R1B Series List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 Figure 13 Figure 14 Figure 15 Figure 16 a Pin Configuration and b Schematic Diagram 7 Definitions of electrical characteristics 8 1 Line, bi-directional protection with ESD diode 12 Ordering Information Scheme examples 13 PG-TSLP-2-18 Package Overview 14 PG-TSLP-2-18 Footprint 14 PG-TSLP-2-18 Packing 14 PG-TSLP-2-18 Marking example 14 PG-TSSLP-2-2 Package Overview 15 PG-TSSLP-2-2 Footprint 15 PG-TSSLP-2-2 Packing. 15 PG-TSSLP-2-2 Marking example 15 Final Data Sheet ESD8V0R1B Series List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Ordering information 7 Maximum Rating at TA = 25 °C, unless otherwise specified. 8 DC characteristics at TA = 25 °C, unless otherwise specified 8 RF characteristics at TA = 25 °C, unless otherwise specified 9 ESD characteristics at TA = 25 °C, unless otherwise specified 9 Final Data Sheet ESD8V0R1B Series Bi-directional Low Capacitance TVS Diode Bi-directional Low Capacitance TVS Diode • ESD / Transient protection of data lines in / 5 / 12 V applications according to : • IEC61000-4-2 ESD ±20 kV air and ±18 kV contact • IEC61000-4-4 EFT 40 A 5/50ns • Extremely small form factor down to x • Pb-free and Halogen-Free package RoHS compliant Application Examples • Keypad, touchpad, buttons, convenience keys • LCD displays, Camera, audio lines, mobile communication, Consumer products E-Book, MP3, DVD, DSC, • Notebooks tablets and desktop computers and their peripherals Product Description Pin 1 Pin 2 Pin 1 TSLP - 2 Pin 2 Figure 1 TSSLP -2 a Pin configuration a Pin Configuration and b Schematic Diagram Table 1 Ordering information Type Package ESD8V0R1B-02EL PG-TSLP-2-18 ESD8V0R1B-02ELS PG-TSSLP-2-2 Configuration 1 line, bi-directional 1 line, bi-directional Pin 2 Pin 1 b Schematic diagram Marking code R D Final Data Sheet Characteristics ESD8V0R1B Series Characteristics Table 2 Maximum Rating at TA = 25 °C, unless otherwise specified Parameter Values Min. Typ. ESD air discharge1 VESD ESD contact discharge1 VESD Peak pulse current tp = 8/20 us 2 IPP Operating temperature Storage temperage Tstg 1 VESD according to IEC61000-4-2 IPP according to IEC61000-4-5 Max. 20 18 1 150 Unit kV A °C °C Electrical Characteristics at TA = 25 °C, unless otherwise specified Rdyn Differential series resistance I IPP IPP Peak pulse current tP=8/20us typ. Rdyn Figure 2 VCL VBR VRWM IBR IRWM IRWM IBR VRWM VBR VCL Pin 2 Ordering information scheme ESD8V0R1B Series Ordering information scheme ESD 0P1 RF - XX YY Package XX = Pin number i.e. 02 = 2 pins 03 = 3 pins YY = Package family LS = TSSLP LRH = TSLP For Radio Frequency Applications Line Capacitance CL in pF i.e. 0P1 = 0.1pF ESD 5V3 U n U - XX YY Package or Application XX = Pin number i.e. 02 = 2 pins 03 = 3 pins YY = Package family LS = TSSLP LRH = TSLP S = SOT363 U = SC74 XX = Application family LC = Low Clamp HDMI Uni- / Bi-directional orRail to Rail protection Number of protected lines i.e. 1 = 1 line 4 = 4 lines Capacitance Standard >10pF , Low <10pF , Ultra-low <1pF Maximum working voltage VRWM in V i.e. 5V3 = 5.3V Figure 8 Ordering Information Scheme examples Final Data Sheet Package Information ESD8V0R1B Series Package Information PG-TSLP-2-18 Top view MAX. Bottom view Cathode marking Figure 9 1 Dimension applies to plated terminals PG-TSLP-2-18 Package Overview TSLP-2-18-PO V01 Copper Solder mask Figure 10 PG-TSLP-2-18 Footprint Stencil apertures TSLP-2-18-FP V01 Cathode marking Figure 11 PG-TSLP-2-18 Packing TSLP-2-18-TP V01 Type code Cathode marking TSLP-2-18-MK V01 Figure 12 PG-TSLP-2-18 Marking example Final Data Sheet ESD8V0R1B Series PG-TSSLP-2-2 Package Information Top view Bottom view Cathode marking 1 Dimension applies to plated terminal Figure 13 PG-TSSLP-2-2 Package Overview TSSLP-2-1,-2-PO V05 Copper Solder mask Figure 14 PG-TSSLP-2-2 Footprint Stencil apertures TSSLP-2-1,-2-FP V02 Cathode marking Tape type Ex Ey Punched Tape Embossed Tape |
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