BGF110E6327XT
BGF110E6327XT Datasheet
BGF110
| Part | Datasheet |
|---|---|
BGF110E6327XT |
BGF110E6327XT (pdf) |
| PDF Datasheet Preview |
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| Data Sheet, V2.2, July 2007 BGF110 SD Card Interface ESD Protection Small Signal Discretes Edition 2007-07-04 Published by Infineon Technologies AG 81726 München, Germany Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics “Beschaffenheitsgarantie” . With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF110 Previous Version 2006-10-17 EMI and cross talk feature added Contact discharge added BGF110 Data Sheet V2.2, 2007-07-04 SD Card Interface ESD Protection Feature • ESD protection for SD Card interface • Integrated ESD protection up to 15 kV contact discharge • Very good EMI filtering with very low cross talk • Green wafer level package with SnAgSu solder balls • 400 µm solder ball pitch BGF110 SD Card Interface ESD Protection WLP-24-2 The BGF110 is an ESD protection for the SD Card interface using a green wafer level package. External pins are protected up to 15 kV contact discharge according to IEC61000-4-2. A RF filter functionality provides very good RF and EMI suppression on the digital lines with very low cross talk. Sensitivity of the line capacitance on the bias voltage is very low. The wafer level package has a 400 µm solder ball pitch and 250 µm ball diameter before ball attach . Type BGF110 Package WLP-24-2 Marking BGF110 Chip N0720 Table 1 Maximum Ratings Parameter Values Min. Typ. Max. Voltage at all pins to GND Operating temperature range Storage temperature range TSTG Maximum current at all pins Imax Electrostatic discharge according to IEC61000-4-2 contact discharge |
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