IC9-68RD-0.635SFA(51)

IC9-68RD-0.635SFA(51) Datasheet

IC9 Series

Part	Datasheet
IC9-68RD-0.635SFA(51)	IC9-68RD-0.635SFA(51) (pdf)

Related Parts	Information
IC9-68RD-0.635SFA(75)	IC9-68RD-0.635SFA(75)
IC9-68RD-0.635SF(51)	IC9-68RD-0.635SF(51)

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Card Bus Socket Connectors IC9 Series sFeatures Compliant with PC Card Standards Complies with latest requirements of PC Card Standard. Repairable Repairable terminations of connector solder joints after installation on the board. Lead Offset Available with two board mounting levels of terminations, to allow use of different height components. sProduct Specifications Current rating A Operating temperature -55ç to +85ç Note 1 Storage temperature -10ç to +60ç Note 2 Ratings Voltage rating 125 V AC Operating humidity 95% R.H. or less No condensation Storage humidity 40 to 70% Note 2 Item Insulation resistance Withstanding voltage Contact resistance Vibration Specification 1000M ohms min. No flashover or insulation breakdown. 40 max. initial value No electrical discontinuity of 100ns or more Conditions 500 V DC 500 V AC / 1 minute 1 mA Frequency 10 to 2000 Hz, single amplitude of mm or acceleration of 147 m/s2 peak , 4 hours in each of the 3 directions. Humidity Steady state Insulation resistance 100 min. 96 hours at temperature of 40ç and humidity of 90% to 95% Temperature cycle No damage, cracks, or parts looseness. -55ç, 30 min/15 to 30ç, within 5 min/85ç30 min /15 to 35ç, within 5 min, for 5 cycles Durability Insertion/withdrawal Resistance to soldering heat Change of contact resistance from the start should be 20 max. No deformation of components affecting performance. 10000 cycles at 400 to 600 cycles per hour Reflow At the recommended temperature profile Manual soldering 300ç for 3 seconds Note 1 Includes temperature rise caused by current flow. Note 2 The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. sMaterials Part Insulator Contact Ground plate Material PA Phosphor bronze Brass sOrdering Information IC9 - 68 R D - SFA 1 Series name IC9 2 Number of contacts 68 3 R card connector 4 D 2-row alignment 5 Lead pitch mm 6 Offset type SF mm offset SFA mm offset BLead Offset qType with mm offset qType with mm offset BMounting Method Place and solder the connector without the ground plate as shown in fig. a . Place the ground plate over the connector as shown in Fig. b , making sure that the locking tabs are correctly aligned with the slots on both sides of the insulator. Press firmly at both ends to assure secure lock. Note Care should be taken that the termination leads of the ground plate are not deformed or damaged during this operation. Solder the termination leads of the ground plate to the board. sCard Connectors Socket Connector CL No. IC9-68RD-0.635SF 640-0901-2 IC9-68RD-0.635SFA 640-0902-5 Ground Plate Combined Condition BPCB mounting pattern BTemperature Profile Applicable Conditions Reflow system IR reflow Solder Paste type 63 Sn/37 Pb Flux content 9 wt% Test board Glass epoxy 60mm x 60mm x mm Metal mask thickness mm Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and amount.

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Card Bus Socket Connectors

IC9 Series
sFeatures

Compliant with PC Card Standards

Complies with latest requirements of PC Card Standard.

Repairable

Repairable terminations of connector solder joints after installation on the board.

Lead Offset

Available with two board mounting levels of terminations, to allow use of different height components.
sProduct Specifications

Current rating A

Operating temperature -55ç to +85ç Note 1

Storage temperature -10ç to +60ç Note 2

Ratings

Voltage rating 125 V AC Operating humidity 95% R.H. or less No condensation Storage humidity
40 to 70% Note 2

Item Insulation resistance Withstanding voltage Contact resistance

Vibration

Specification 1000M ohms min. No flashover or insulation breakdown. 40 max. initial value

No electrical discontinuity of 100ns or more

Conditions 500 V DC 500 V AC / 1 minute 1 mA

Frequency 10 to 2000 Hz, single amplitude of mm or acceleration of 147 m/s2 peak , 4 hours in each of the 3 directions.

Humidity Steady state Insulation resistance 100 min.
96 hours at temperature of 40ç and humidity of 90% to 95%

Temperature cycle

No damage, cracks, or parts looseness.
-55ç, 30 min/15 to 30ç, within 5 min/85ç30 min /15 to 35ç, within 5 min, for 5 cycles

Durability Insertion/withdrawal

Resistance to soldering heat

Change of contact resistance from the start should be 20 max.

No deformation of components affecting performance.
10000 cycles at 400 to 600 cycles per hour

Reflow At the recommended temperature profile Manual soldering 300ç for 3 seconds

Note 1 Includes temperature rise caused by current flow. Note 2 The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature

Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
sMaterials

Part Insulator Contact

Ground plate

Material PA

Phosphor bronze

Brass
sOrdering Information

IC9 - 68 R D - SFA
1 Series name IC9 2 Number of contacts 68 3 R card connector 4 D 2-row alignment 5 Lead pitch mm 6 Offset type

SF mm offset SFA mm offset

BLead Offset
qType with mm offset
qType with mm offset

BMounting Method

Place and solder the connector without the ground plate as shown in fig. a .

Place the ground plate over the connector as shown in Fig. b , making sure that the locking tabs are correctly aligned with the slots on both sides of the insulator. Press firmly at both ends to assure secure lock. Note Care should be taken that the termination leads of the ground plate are not deformed or damaged during this operation.

Solder the termination leads of the ground plate to the board.
sCard Connectors

Socket Connector

CL No.

IC9-68RD-0.635SF
640-0901-2

IC9-68RD-0.635SFA 640-0902-5

Ground Plate Combined Condition

BPCB mounting pattern

BTemperature Profile

Applicable Conditions

Reflow system IR reflow

Solder

Paste type 63 Sn/37 Pb

Flux content 9 wt%

Test board Glass epoxy 60mm x 60mm x mm

Metal mask thickness mm

Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and amount.

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Datasheet ID: IC9-68RD-0.635SFA(51) 636188