DI9400T

DI9400T Datasheet

DI9400

Part	Datasheet
DI9400T	DI9400T (pdf)

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DI9400 SINGLE P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR • High Cell Density DMOS Technology • Lower On-State Resistance • High Power and Current Capability • Fast Switching Speed • High Transient Tolerance 8 765 TOP VIEW 1234 Mechanical Data • SO-8 Plastic Case • Terminal Connections See Outline Drawing and Internal Circuit Diagram above SO-8 Dim Min Max J Nominal P Nominal All Dimensions in mm Maximum Ratings 25°C unless otherwise specified Characteristic Value Unit Drain-Source Voltage VDSS Gate-Source Voltage VGSS ±20 Drain Current Note 1a Continuous Pulsed ±10 Maximum Power Dissipation Note 1a Note 1b Note 1c Operating and Storage Temperature Range Tj, TSTG -55 to +150 Thermal Characteristics Characteristic Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Note 1a Note 1 Symbol RQJA RQJC Value 50 25 Unit °C/W °C/W RQJA is the sum of the junction-to-case and case-to-ambient thermal resistance RQJC + RQCA where the case thermal reference is defined as the solder mounting surface of the drain pins. RQJC in this instance is 25°C/W but is dependent on the specific circuit board thermal design. 1a. With 1 in2 of 2 oz. copper mounting pad RQJA = 1b. With in2 of 2 oz. copper mounting pad RQJA = 1c. With in2 of 2 oz. copper mounting pad RQJA =

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DI9400

SINGLE P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
• High Cell Density DMOS Technology
• Lower On-State Resistance
• High Power and Current Capability
• Fast Switching Speed
• High Transient Tolerance
8 765

TOP VIEW
1234

Mechanical Data
• SO-8 Plastic Case
• Terminal Connections See Outline Drawing
and Internal Circuit Diagram above

SO-8

Dim Min Max

J Nominal

P Nominal

All Dimensions in mm

Maximum Ratings 25°C unless otherwise specified

Characteristic

Value

Unit

Drain-Source Voltage

VDSS

Gate-Source Voltage

VGSS
±20

Drain Current

Note 1a Continuous Pulsed
±10

Maximum Power Dissipation

Note 1a

Note 1b

Note 1c

Operating and Storage Temperature Range

Tj, TSTG
-55 to +150

Thermal Characteristics

Characteristic Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case

Note 1a Note 1

Symbol RQJA RQJC

Value 50 25

Unit °C/W °C/W

RQJA is the sum of the junction-to-case and case-to-ambient thermal resistance RQJC + RQCA where the case thermal reference is defined as the solder mounting surface of the drain pins. RQJC in this instance is 25°C/W but is dependent on the specific circuit board thermal design.
1a. With 1 in2 of 2 oz. copper mounting pad RQJA = 1b. With in2 of 2 oz. copper mounting pad RQJA = 1c. With in2 of 2 oz. copper mounting pad RQJA =

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Datasheet ID: DI9400T 509913