150-3040-1

150-3040-1 Datasheet


Order No. 150-3040-1

Part Datasheet
150-3040-1 150-3040-1 150-3040-1 (pdf)
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Sentis3D - M520

Time-of-Flight Smart Sensor
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The Sentis3D - M520 is a new depth sensor, operating on the Time-of-Flight ToF principle. The M520 is equipped with a PMD 19k-S3 Timeof-Flight 3D IC and a high resolution 2D CMOS sensor. The smart depth sensor IC delivers depth information and gray value image data for each pixel simultaneously. An integrated 2D CMOS imager captures scenes with a resolution of up to 1080p. Therefore, possible to analyze scenes based on 3D depth data only or in combination with 2D data.

Using active IR illumination, the sensor is able to capture 3D and 2D information. With a range of 10 m indoors, a field of view of 90° and a size of only 130 x 95 x 40 mm, this Gigabit Ethernet connected sensor can be used for next generation sensor systems in various application fields like robotics, automation and people counting.
»» People counting / tracking »» Building Automation »» 3D light barrier - safety area »» Gesture Recognition »» HMI for industrial robots »» Range measurements

SentisToF - P510

Highlights
»» 3D depth sensor 160 x 120 pixel »» 2D CMOS imager 5 MP »» Up to 160 fps* »» Up to 10 m application range* »» Gigabit Ethernet »» PoE++ Support »» Field-of-View 90°

Sentis3D - M520 point cloud for e.g. goods inspection

Sentis3D - M520

Time-of-Flight Smart Sensor
3<,;,*/50?

Feature Overview

Software

Depth Sensor
2D CMOS

Range LED

Power Supply Ethernet PoE++ OWIRE Mod Interface GPIO I/O Trigger In Trigger Out Temperature Range

Supported OS

Cooling Dimensions

PMD ToF 19k-S3 160 x 120 Pixel up to 160 FPS *

OV5640 5MP 720p 60 FPS *
up to 10 m * up to 2 x 6 high power LEDs 12 - 30 VDC 10 / 100 / 1000 Mbit/s up to 60 W 1 galvanic isolated 1 Industrial -20 to +60 °C depends on heatsink Windows Linux Heatsink required W130 x H95 x D40 mm
* FPS & Range depends on integration time, ambient temperature, FoV and software configuration

Based on

Sentis3D - M520 software support » Free Linux BSP
with multi core support

Customization

Sentis3D M520 is focused on modularity. Individual base boards with your required interfaces can easily be implemented. For further information please contact
Ordering Information

Order No. 150-3040-1

Info

Sentis3D - M520 Kit Time-of-Flight smart sensor

Bluetechnix Group GmbH Waidhausenstraße 3/19 | 1140 Wien, Austria P +43 1 9142091 x 0 | F +43 1 9142091 x 99 |
More datasheets: 4362D1/5 | SEN0171 | CY7C60223-PXC | CY7C60113-PVXC | PI7C8150BND | PI7C8150BNDI | PI7C8150BEVB | B39380K6264K100 | CDBFR0520L | HFX2-10S10


Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 150-3040-1 Datasheet file may be downloaded here without warranties.

Datasheet ID: 150-3040-1 521956