Order No. 150-3040-1
Part | Datasheet |
---|---|
![]() |
150-3040-1 (pdf) |
PDF Datasheet Preview |
---|
Sentis3D - M520 Time-of-Flight Smart Sensor 3<,;,*/50? The Sentis3D - M520 is a new depth sensor, operating on the Time-of-Flight ToF principle. The M520 is equipped with a PMD 19k-S3 Timeof-Flight 3D IC and a high resolution 2D CMOS sensor. The smart depth sensor IC delivers depth information and gray value image data for each pixel simultaneously. An integrated 2D CMOS imager captures scenes with a resolution of up to 1080p. Therefore, possible to analyze scenes based on 3D depth data only or in combination with 2D data. Using active IR illumination, the sensor is able to capture 3D and 2D information. With a range of 10 m indoors, a field of view of 90° and a size of only 130 x 95 x 40 mm, this Gigabit Ethernet connected sensor can be used for next generation sensor systems in various application fields like robotics, automation and people counting. »» People counting / tracking »» Building Automation »» 3D light barrier - safety area »» Gesture Recognition »» HMI for industrial robots »» Range measurements SentisToF - P510 Highlights »» 3D depth sensor 160 x 120 pixel »» 2D CMOS imager 5 MP »» Up to 160 fps* »» Up to 10 m application range* »» Gigabit Ethernet »» PoE++ Support »» Field-of-View 90° Sentis3D - M520 point cloud for e.g. goods inspection Sentis3D - M520 Time-of-Flight Smart Sensor 3<,;,*/50? Feature Overview Software Depth Sensor 2D CMOS Range LED Power Supply Ethernet PoE++ OWIRE Mod Interface GPIO I/O Trigger In Trigger Out Temperature Range Supported OS Cooling Dimensions PMD ToF 19k-S3 160 x 120 Pixel up to 160 FPS * OV5640 5MP 720p 60 FPS * up to 10 m * up to 2 x 6 high power LEDs 12 - 30 VDC 10 / 100 / 1000 Mbit/s up to 60 W 1 galvanic isolated 1 Industrial -20 to +60 °C depends on heatsink Windows Linux Heatsink required W130 x H95 x D40 mm * FPS & Range depends on integration time, ambient temperature, FoV and software configuration Based on Sentis3D - M520 software support » Free Linux BSP with multi core support Customization Sentis3D M520 is focused on modularity. Individual base boards with your required interfaces can easily be implemented. For further information please contact Ordering Information Order No. 150-3040-1 Info Sentis3D - M520 Kit Time-of-Flight smart sensor Bluetechnix Group GmbH Waidhausenstraße 3/19 | 1140 Wien, Austria P +43 1 9142091 x 0 | F +43 1 9142091 x 99 | |
More datasheets: 4362D1/5 | SEN0171 | CY7C60223-PXC | CY7C60113-PVXC | PI7C8150BND | PI7C8150BNDI | PI7C8150BEVB | B39380K6264K100 | CDBFR0520L | HFX2-10S10 |
Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 150-3040-1 Datasheet file may be downloaded here without warranties.