Q3-0.005-AC-1212-NA

Q3-0.005-AC-1212-NA Datasheet

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Q3-0.005-AC-1212-NA	Q3-0.005-AC-1212-NA (pdf)

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Thermally Conductive Interface Materials for Cooling Electronic Assemblies SELECTION GUIDE Introduction Thermal Properties & Testing Interface Material Selection Guide Gap Thermally Conductive Materials Gap Pad Comparison Data Frequently Asked Questions Gap Pad Gap Pad VO Gap Pad VO Ultra Soft Gap Pad 1000SF Gap Pad HC1000 Gap Pad 1500 Gap Pad 1500R Gap Pad A2000 Gap Pad 2000S40 Gap Pad 2500S20 Gap Pad 2500 Gap Pad A3000 Gap Pad 3000S30 Gap Filler 1000 Gap Filler 1100SF Gap Filler 2000 TIC - Thermal Interface Compound Comparison Data & FAQ’s TIC 1000G TIC 1000A TIC 2000A TIC 4000 Hi-Flow Phase Change Interface Materials Hi-Flow Comparison Data Frequently Asked Questions Hi-Flow 105 Hi-Flow 115-AC Hi-Flow 225F-AC Hi-Flow 225FT Hi-Flow 225UF Hi-Flow 225UT Hi-Flow 225U Hi-Flow 625 Hi-Flow 300P Hi-Flow 300G Table of Contents 1 Thermally Conductive Insulators Sil-Pad Comparison Data Frequently Asked Questions Choosing Sil-Pad Thermally Conductive Insulators 46 Mechanical, Electrical and Thermal Properties Sil-Pad Applications Selection Guide Sil-Pad 400 Sil-Pad 800 Sil-Pad 900S Sil-Pad 980 Sil-Pad A1500 Sil-Pad 1500ST Sil-Pad 1750 Sil-Pad 2000 Sil-Pad A2000 Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Q-Pad 3 1000 Poly-Pad K-4 Poly-Pad K-10 Sil-Pad Tubes Sil-Pad Shield 28 & Liqui-Bond Adhesives Bond-Ply & Liqui-Bond Comparison Data Frequently Asked Questions Bond-Ply 100 Bond-Ply 400 Bond-Ply 660B Liqui-Bond SA 2000 35 Solutions for Surface Mount Applications 36 Ordering Information Sil-Pad Configurations - Imperial Hi-Flow Configurations - Imperial Sil-Pad Configurations - Metric Hi-Flow Configurations - Metric Sil-Pad Shield INTRODUCTION World Leader in Thermal Management Through Technology, Innovation & Service At Bergquist, developing high quality components for the electronics industry is our first priority. As a world-leading manufacturer with state-of-the-art facilities, we serve a multitude of industries worldwide including automotive, computer, consumer electronics, military, motor control, power conversion, telecommunications and more. We make it our business to know your business. We understand your problems. We also know that there will always be a better way to help you reach your goals and objectives. To that end, our company continually invests considerable time and money into research and development. The Bergquist Company is focused on a single purpose discovering the need, then developing and delivering technologically advanced solutions backed by superior service. Bergquist Takes the Heat Thermal Management Products Bergquist's Thermal Products Group is a world leading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Used by many of the world’s largest OEMs in various industries including automotive, computer, power supply, military and motor control, these materials include Thermally Conductive Insulators & Liqui-Bond Thermally Conductive Adhesives Gap Thermally Conductive Gap Filling Materials Phase Change Interface Materials TIC Thermal Interface Compound Thermal Insulated Metal Substrates World Class Operations Around the Globe Worldwide Locations In the United States, the Thermal Products Group’s 90,000 square foot manufacturing facility is located in Cannon Falls, Minnesota. A 40,000 square foot facility in Prescott, Wisconsin houses the Thermal Clad printed circuit board operations. A 130,000 square foot facility in Chanhassen, Minnesota is the location for Bergquist’s corporate headquarters and state of the art research and development facilities.Worldwide, Bergquist has facilities in The Netherlands, Germany, the United Kingdom,Taiwan, Korea, Hong Kong and China with sales representatives in 30 countries to support worldwide growth. INTRODUCTION GAP PAD A Legacy of IndustryLeading Technology Research & Development at the Speed of Change New Product Innovation For over 35 years, outstanding quality, innovation and engineering have been hallmarks of The Bergquist Company. Today, developing innovative products for the electronics industry remains our first priority. Bergquist has developed over 260 materials which provide thermal solutions for a wide variety of electronic applications. Many of our products were originally developed to satisfy a customer request for a specific material designed to perform to their particular specifications.This “can do” attitude and customized technology has earned The Bergquist Company its QS 9000 certification ahead of competitors, and will position the company as an industry leader by early certification to ISO 9001: R&D Facilities Keeping pace in today’s aggressive electronics industry demands continual anticipation of change and the ability to develop customerdriven solutions quickly and efficiently. Our Chanhassen headquarters features a state-of-the-art development laboratory and engineering department staffed with highly skilled chemical engineers, laboratory technicians and manufacturing engineers all dedicated to researching, developing and testing new materials. From such dedication has come many industry-standard proprietary products including Thermal Clad, Sil-Pad, Gap Pad, Bond-Ply and Hi-Flow materials. HI--FLOW SIL-PAD BOND-PLY ORDERING INTRODUCTION Thermal Properties & Testing Thermal Conductivity The time rate of heat flow through a unit area producing a unit temperature difference across a unit thickness. Thermal Resistance The opposition to the flow of heat through a unit area of material across an undefined thickness. Thermal conductivity is an inherent or absolute property of the material. Thermal resistance varies with thickness. Thermal Impedance A property of a particular assembly measured by the ratio of the temperature difference between two surfaces to the steady state heat flow through them. Test Methods ASTM D5470 Factors affecting thermal impedance include: Area Increasing the area of thermal contact decreases thermal impedance. Thickness Increasing the insulator thickness increases thermal impedance. Pressure Increasing mounting pressure under ideal conditions decreases thermal impedance. Time Thermal impedance decreases over time. Measurement Thermal impedance is affected by the method of temperature measurement. Thermal Impedance Per Bergquist TO-220 Thermal Performance Cold Plate Testing 2 in. diameter stack ref. in2 10-500* psi, 1 hour per layer * Bergquist modified Interface Material Selection Guide PRODUCT OVERVIEW INTERFACE APPLICATIONS MOUNTING TYPICAL CONVERTED METHODS OPTIONS Discrete Power Devices for Power Supplies, Computers, Telecom Thru-Hole Active Power Compensators Capacitors, Inductors, Resistors Electronic Modules for Automotive Motor & wiper Controls, Anti-Lock, et. Electronic Modules for Telecom and Power Supplies Computer Applications CPU, GPU, ASICs, Hard Drives Electrical Insulator Clip, Low Pressure Screw/Rivets, High Pressure Not Applicable Sheet Stock Roll-Form Continuous Standard Configurations Custom External Shapes Custom Internal Features Standard PSA Offerings INTRODUCTION Market Applications Products Grease Replacement Q-Pad II Materials Q-Pad 3 Hi-Flow 105 Hi-Flow 115-AC Hi-Flow 300G Hi-Flow 225F-AC Hi-Flow 225FT Hi-Flow 225UT Hi-Flow 225U Hi-Flow 225UF Grease Replacement Hi-Flow 625 Materials - Insulated Hi-Flow 300P Bonding - Thin-Film Bond-Ply 660B Bonding - Fiberglass Bond-Ply 100 Bonding Unreinforced Bond-Ply 400 Ordering Procedure: Sample SPT 400 ___ “A” “B” “C” U.S. Patents 4,574,879 4,602,125 4,602,678 4,685,987 4,842,911 and others SIL-PAD Shield Bonded Laminate of Sil-Pad with a Copper Shield • Bonded laminate • Electrically isolating • Copper shield between layers of Sil-Pad • Pre-tinned solder point for easy grounding TYPICAL PROPERTIES OF SIL-PAD SHIELD PROPERTY VALUE TEST METHOD Thickness / Total inches Shield / Copper Thickness inches Approx.Thermal Resistance TO-3 °C/W Min. Breakdown Voltage Between Device & Copper Volts 4500 ASTM D149 Capacitance at 1000 Hz & 5 Volts pF Dissipation Factor at 1000 Hz & 5 Volts TO-3 Power Factor ASTM D150 Dielectric Constant at 1000 Hz & 5 Volts ASTM D150 Continuous Use Temp °C -60 to 180 Recommended Torque TO-3 inch-pounds RFI Produced by Heat Sink Current The capacitance between a TO-3 encapsulated transistor and its heat sink is typically 100pf when a mica or other insulating washer is used. A power supply constructed with a standard insulator and a grounded heat sink can be expected to produce about 10 times more interference than is permitted. A solution to the problem can be accomplished by: 1.The use of chokes, filters and LC networks which have to be designed into the circuitry. OR Constructing a shield between the transistor and its heat sink by replacing the mica insulator with a Sil-Pad Shield see illustration . Typical Applications Include: • Switch mode power supplies • EMI / RFI shield between PCB’s Configurations Available: Sil-Pad Shield is available in many custom configurations to meet special requirements.Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad Shield is a laminate of copper with Sil-Pad thermally conductive insulators. Sil-Pad Shield provides • Shielding effectiveness of 50dB or higher • Electrical isolation of 500 volts minimum • Good thermal transfer • Reduced labor costs due to the elimination of having to apply thermal grease U.S. Patents 4,574,879 4,602,125 4,602,678 4,685,987 4,842,911 and others SIL-PAD & Liqui-Bond Adhesives Bond-Ply Adhesive Tapes Available in a pressure sensitive adhesive or laminating format, the Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion. Typical Bond-Ply Applications ORDERING Solutions for Surface Mount Applications Hi-Flow The Hi-Flow family of phase change materials offers an easy to apply thermal interface for many surface mount packages. At the phase change temperature, Hi-Flow materials change from a solid and flow with minimal applied pressure.This characteristic optimizes heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to replace messy thermal grease. Bergquist phase change materials are specially compounded to prevent pump out of the interface area, which is often associated with thermal grease. Power Device Thermal Clad High Power Application Hi-Flow with Thermal Clad Processor High Power Application Hi-Flow without Thermal Clad Hi-Flow Heat Spreader Hi-Flow Heat Spreader FR-4 Board Typical applications include: • and other high performance CPUs • DC/DC converters • Power modules Hi-Flow materials are manufactured with or without film or foil carriers. Custom shapes and sizes for non-standard applications are also available. Sil-Pad Sil-Pad is the benchmark in thermal interface materials.The Sil-Pad family of materials are thermally conductive and electrically insulating. Available in custom shapes, sheets, and rolls, Sil-Pad materials come in a variety of different thicknesses and are frequently used in SMT applications such as: • Interface between thermal vias in a PCB, and a heat sink or casting • Heat sink interface to many surface mount packages Power Device Sil-Pad or Bond-Ply FR-4 Mid Power Application with Bond-Ply Heat Spreader ORDERING Where Thermal Solutions Come Together Bond-Ply The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply is available in a PSA or laminating format, is reinforced with fiberglass or film and comes in a variety of different thicknesses. Bond-Ply provides for the mechanical decoupling of bonded materials with mismatched thermal coefficients of expansion, typical applications include • Bonding bus bars in a variety of electronic modules and sub assemblies • Attaching a metal-based component to a heat sink • Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages • Bonding flexible circuits to a rigid heat spreader or thermal plane • Assembly tapes for BGA heat spreader Gap Pad The Gap Pad product family offers a line of thermally conductive materials which are highly conformable.Varying degrees of thermal conductivities and compression deflection characteristics are available.Typical applications include: • On top of a semiconductor package such as a QFP or BGA. Often times, several packages with varying heights can use a common heat sink when utilizing Gap Pad • Between a PCB or substrate and a chassis, frame, or other heat spreader • Areas where heat needs to be transferred to any type of heat spreader Gap Pads are available in thickness of to and in custom shapes, with or without adhesive. Power Device Gap Pad Heat Spreader Lower Power Application with Gap Pad Top Efficiency In Thermal Materials For Today's Changing Technology. Contact Bergquist for additional information regarding our Thermal Solutions.We are constantly innovating to offer you the greatest selection of options and flexibility to meet today's changing technology. FR-4 Board ORDERING Ordering Information Ordering Procedure: The last 2 or 3 digits the part number selected.The “foot print” and dimensions are shown on pages Each material has a prefix as shown on page Special Shapes: For applications requiring non standard or custom Sil-Pad contact the factory.We produce thousands of custom die shapes and designs. Tolerances: Typical converting tolerances are held on length L , width W , hole diameter and hole location for most materials as noted below: TYPICAL SIL-PAD / HI-FLOW TOLERANCES Part Dimension <6" Length & Width Tolerance ± Hole Location & Diameter ± 6" - 12" >12" TYPICAL GAP PAD TOLERANCES Material Thickness Length & Width Tolerance Hole Location & Diameter 10 mil 15 mil 20 mil 40 mil 60 mil 80 mil 100 mil 125 mil 160 mil 200 mil 250 mil Note Dependent upon material and application requirements, tighter tolerances may be feasible and available. Please contact Bergquist Sales for these requests and additional information regarding tolerances. Sheets: Standard sheet size for most materials is 12" x 12", with or without adhesive as specified on the individual data sheet.When ordering sheets, please specify material type, thickness and include all dimensions. Contact Bergquist Sales if other sizes are required. Note Sil-Pad A2000 maximum sheet size is 10" x Gap Pad standard sheet size is 8" x Rolls: Sil-Pad materials are available in roll form, with or without adhesive, with the exception of Sil-Pad 1750, 2000 and A2000. Hi-Flow materials are available in roll form. Certain Gap Pad materials are available in roll form. Please contact Bergquist Sales for more information. Adhesives: Before selecting an adhesive, check individual product sheets for standard PSA offerings. Bergquist adhesives include: SILICONE: AC - Unloaded ACA - Unloaded, Low Tack TAC - Loaded Thermally Enhanced ACRYLIC: AAC - Unloaded TAAC - Thermally Loaded EAAC - Thermally Enhanced THICKNESS - 12-25µm Adhesive only Note All non-symmetrical parts are supplied with the adhesive on the far side unless otherwise specified. Peel Strength See data below. POL = Peel Off Liner force per lineal strength of the liner to the adhesive . QS = Quick Stick Simulated force per lineal strength of the adhesive to the heat sink . g/in = Grams per inch. TYPICAL ADHESIVE PROPERTIES ADHESIVE Silicone AC 50-150 g/in 50-150 g/in Silicone ACA 5-70 g/in 5-150 g/in Silicone TAC 50-150 g/in 50-150 g/in Acrylic AAC 5-70 g/in 100-800 g/in Acrylic TAAC 5-70 g/in 100-400 g/in Acrylic EAAC 5-60 g/in 100-200 g/in Note These values are typical after the material has aged for 2-3 weeks and are significantly different immediately after coating. Upon completion of coating, QS is 250-500 g/in and POL is 3-20 g/in for all silicone adhesives. Shelf Life: Silicone Adhesives Six 6 months from date of manufacture when stored in original packaging at 70°F 21°C and 50% relative humidity. Acrylic Adhesives One 1 year from date of manufacture when stored in original packaging at 70°F 21°C and 50% relative humidity. Peel adhesion data is available upon request. Please contact Bergquist Sales for more information. ORDERING Ordering Information PSA Characteristics: Standard pressure sensitive adhesive AC coated on one side of a Sil-Pad will increase the thermal resistance per ASTM D5470 by 0.2°C-in2/W. Standard PSA on 2 sides increases the thermal impedance by 0.4°C-in2/W. Thermally conductive PSA TAC on one side increases the thermal resistance by 0.05°C-in2/W and on two sides by 0.1°C-in2/W. The effect of AC and TAC on the thermal impedance in an application will vary. In low pressure applications, the pressure sensitive adhesive will wet out the interface easier and eliminate the interfacial thermal resistance. Note Bergquist adhesives are designed for ease of application during assembly. If an automated dispensing method is preferred, Bergquist will recommend manufacturers of automated dispensing equipment upon request. Please contact Bergquist Sales for more information on this subject. Note Bergquist cannot be responsible for dispensing equipment selection and/or performance of specific materials on said equipment. It is the customer’s responsibility to determine the suitability and compatibility of the specific Bergquist material with the selected equipment. Recognition: For information regarding the U.L. Underwriters Laboratories, Inc. recognition status of Bergquist Sil-Pad, Gap Pad and Hi-Flow materials, the U.L. web site provides the most current information. Using the URL select “Online Certification Directory.”You may then enter one of the following file numbers for the applicable Bergquist file: QMFZ2.E59150 Plastics Component. This category includes all Sil-Pad, Gap Pad and Hi-Flow materials. QOQW2.E81718 Polymeric Adhesive Systems, Electrical Equipment Component. This category includes Bond-Ply adhesive only. In each group there is a “Guide Information” section which gives a detailed description of the categories listed and all recognized materials will be listed with supporting data. Material Specifications: Bergquist will supply a Thermal Insulation Material Cross Reference Listing for all pertinent military part numbers included in the following specifications: MIL M-38527 / 08 MIL I-49456A MIL I-49466 / 02 NAS 4117 MIL H-87111 NAS 4118 Each Bergquist part number a Bergquist grade of thermal insulation material and a transistor case Details of different Bergquist thermal insulation materials as well as details on different thermal insulator are found on previous pages of the Sil-Pad Selection Guide. MIL-I-49456A specifies a fiberglass reinforced elastomeric sheet material showing type and class. MIL-I-49466-02, MIL M-38527 / 08 and MIL-H-87111 specify thermal insulator configurations. MIL I-49466 / 02 supersedes the part numbers covered under MIL M-38527 / M49466 / 02 is the most complete listing of military part numbers. Each of the military part numbers in M49466 / 02 is cross referenced to Bergquist part numbers. Please use MIL-I-49466 whenever possible. Please contact The Bergquist Company for the complete MIL Spec Reference Guide. FSCM NUMBER 55285 ORDERING Configurations Imperial Measurements 4 Lead Part Number TO-66 Suffix TO-220 Plastic Part Number Power Suffix Dimensions Various Clip Mount TO-126 Various TO-220 TO-202 Various TO-220 TO-126 Various TO-220 Various TO-218 Various -102 -103 Suffix Dimensions "C" "D" Various -104 Various -107 Various -110 Various -114 Various -116 Various -117 Various -118 Various -119 Various -120 TO-3P -122 Various -126 Various -128 Various -131 Various -132 Various -133 Various -134 Various -136 Various -137 Various -138 Power Part Number Dimensions Module Suffix ORDERING D-DIA B C D A F RAD TYP 2 G Dia Configurations Multiwatt Suffix -124 -125 Dimensions x 45° x 45° Imperial Measurements Multi-Lead Part Number TO-66 Suffix Diode Washer Part Number Dimensions Suffix Part Number Dimensions Suffix Various Various DO-4 Various DO-5 Various DO-4 oversized -22 DO-8 DO-5 oversized -25 Various Various Various Various Various Various Various Various Various -111 Part Number TO-36 Suffix ORDERING Configurations Imperial Measurements TO-3 & TO-66 Dimensions Style Suffix -59 Leadless -112 -113 -127 -129 -135 3 Lead Part Number Dimensions TO-3 Suffix C DIA. 2 D DIA. 3 F DIA. A D DIA. 4 C DIA. 2 18° G° 4 Lead Part Number Dimensions TO-3 Suffix 72° 72° 8 Lead Part Number Dimensions TO-3 Suffix 40° 10 Lead Part Number Dimensions TO-3 Suffix 3 Lead Part Number Dimensions TO-66 ORDERING 9 Lead Part Number Dimensions TO-66 Suffix 36° Power Part Number Dimensions Module Suffix -130 C - DIA. 225 Configurations Imperial Measurements Hi-Flow 225U Configurations MATERIAL LINER PSA STRIP LINER Part Number Suffix -143 -144 -145 -146 -147 -148 -149 “A” Dimensions ± “B” “C” Min. Pcs/Roll 5000 7500 10000 15000 22500 Hi-Flow 225UT/225FT Configurations YELLOW PSA TAPE LINER MATERIAL LINER PSA STRIP CLEAR PSA TAPE Part Number Suffix -150 -151 -152 -153 -154 -155 -156 “A” Dimensions ± “B” “C” Min. Pcs/Roll 3000 5000 7500 10000 15000 ORDERING Configurations Metric Measurements 4 Lead Part Number Dimensions TO-66 Suffix Plastic Part Number Power Suffix Dimensions Suffix Dimensions "C" "D" Various Clip Mount -43 TO-126 TO-220 Various Various TO-220 TO-202 Various TO-220 TO-126 Various TO-220 Various Various TO-218 Various Various Various -102 Various -103 Various Various TO-3P Various -104 -107 -110 -114 ORDERING D-DIA F RAD TYP 2 G Dia Configurations Multiwatt Suffix -124 -125 Multi- Lead Part Number TO-66 Suffix Dimensions x 45° x 45° Dimensions Metric Measurements Diode Washer Part Number Suffix Dimensions Various DO-4 DO-5 DO-4 oversized DO-5 oversized Various -19 -20 -21 -22 -25 -26 -27 -28 -32 TO-36 Dimensions Suffix Dimensions Suffix Various Various Various DO-8 Various Various Various Various -111 Small Power Devices TO-5, 3 Holes TO-18, 3 Holes TO-18, 4 Holes TO-5, 4 Holes TO-5, 3 Holes TO-5, 4 Holes Dimensions Suffix -09 -12 -13 -33 -44 -45 Rectifier Part Number Dimensions Suffix ORDERING Configurations Metric Measurements C DIA. 2 D DIA. 3 F DIA. A D DIA. 4 C DIA. 2 18° G° TO-3 Part Number Dimensions Style Suffix -59 Leadless -112 -113 -127 -129 -135 3 Lead Part Number TO-3 Suffix Dimensions 4 Lead Part Number TO-3 Suffix 72° 72° 8 Lead TO-3 Suffix 40° 10 Lead Part Number TO-3 Suffix 3 Lead Part Number TO-66 Suffix 9 Lead Part Number TO-66 Suffix 36° ORDERING Power Part Number Module Suffix -130 C - DIA. 225 Configurations Metric Measurements Hi-Flow 225U Configurations MATERIAL LINER PSA STRIP LINER Part Number Suffix -143 -144 -145 -146 -147 -148 -149 “A” Dimensions ± “B” “C” Min. Pcs/Roll 5000 7500 10000 15000 22500 Hi-Flow 225UT/225FT Configurations YELLOW PSA TAPE LINER MATERIAL LINER PSA STRIP CLEAR PSA TAPE Part Number Suffix -150 -151 -152 -153 -154 -155 -156 Dimensions ± “A” “B” “C” Min. Pcs/Roll 3000 5000 7500 10000 15000 ORDERING Shield Standard Configurations DIA. DIA. 2 HOLES DIA. tinned copper to ground DIA 3 HOLES DIA. tinned copper to ground 33° DIA. tinned copper to ground P/N 09SPS01-002 TO-220 P/N 09SPS01-001 TO-3 P/N 09SPS01-009 .040DIA 3 HOLES DIA 2 DIA 2 HOLES DIA 2 HOLES DIA. tinned copper to ground DIA. tinned copper to ground DIA. tinned copper to ground P/N 09SPS01-011 TO-5 P/N 09SPS01-016 TO-3 P/N 09SPS01-017 TO-66 DIA 2 HOLES N.T.S. DIA 2 HOLES 30° DIA. tinned copper to ground P/N 09SPS01-020 DO-5 P/N 09SPS01-023 TO-3 DIA. DIA. tinned copper to ground P/N 09SPS01-019 DO-4 Contact the factory for other configurations. ORDERING

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Thermally Conductive Interface Materials for Cooling Electronic Assemblies

SELECTION GUIDE

Introduction Thermal Properties & Testing Interface Material Selection Guide

Gap Thermally Conductive Materials Gap Pad Comparison Data Frequently Asked Questions Gap Pad Gap Pad VO Gap Pad VO Ultra Soft Gap Pad 1000SF Gap Pad HC1000 Gap Pad 1500 Gap Pad 1500R Gap Pad A2000 Gap Pad 2000S40 Gap Pad 2500S20 Gap Pad 2500 Gap Pad A3000 Gap Pad 3000S30 Gap Filler 1000 Gap Filler 1100SF Gap Filler 2000

TIC - Thermal Interface Compound Comparison Data & FAQ’s TIC 1000G TIC 1000A TIC 2000A TIC 4000

Hi-Flow Phase Change Interface Materials Hi-Flow Comparison Data Frequently Asked Questions Hi-Flow 105 Hi-Flow 115-AC Hi-Flow 225F-AC Hi-Flow 225FT Hi-Flow 225UF Hi-Flow 225UT Hi-Flow 225U Hi-Flow 625 Hi-Flow 300P Hi-Flow 300G

Table of Contents
1 Thermally Conductive Insulators

Sil-Pad Comparison Data

Frequently Asked Questions

Choosing Sil-Pad Thermally Conductive Insulators 46

Mechanical, Electrical and Thermal Properties

Sil-Pad Applications

Selection Guide

Sil-Pad 400

Sil-Pad 800

Sil-Pad 900S

Sil-Pad 980

Sil-Pad A1500

Sil-Pad 1500ST

Sil-Pad 1750

Sil-Pad 2000

Sil-Pad A2000

Sil-Pad K-4

Sil-Pad K-6

Sil-Pad K-10

Q-Pad 3
1000

Poly-Pad K-4

Poly-Pad K-10

Sil-Pad Tubes

Sil-Pad Shield
28 & Liqui-Bond Adhesives

Bond-Ply & Liqui-Bond Comparison Data

Frequently Asked Questions

Bond-Ply 100

Bond-Ply 400

Bond-Ply 660B

Liqui-Bond SA 2000
35 Solutions for Surface Mount Applications
36 Ordering Information

Sil-Pad Configurations - Imperial

Hi-Flow Configurations - Imperial

Sil-Pad Configurations - Metric

Hi-Flow Configurations - Metric

Sil-Pad Shield

INTRODUCTION

World Leader in Thermal Management Through Technology, Innovation & Service

At Bergquist, developing high quality components for the electronics industry is our first priority. As a world-leading manufacturer with state-of-the-art facilities, we serve a multitude of industries worldwide including automotive, computer, consumer electronics, military, motor control, power conversion, telecommunications and more.

We make it our business to know your business. We understand your problems. We also know that there will always be a better way to help you reach your goals and objectives. To that end, our company continually invests considerable time and money into research and development. The Bergquist Company is focused on a single purpose discovering the need, then developing and delivering technologically advanced solutions backed by superior service.

Bergquist Takes the Heat

Thermal Management Products Bergquist's Thermal Products Group is a world leading developer and manufacturer of thermal management materials which provide product solutions to control and manage heat in electronic assemblies and printed circuit boards. Used by many of the world’s largest OEMs in various industries including automotive, computer, power supply, military and motor control, these materials include Thermally Conductive Insulators & Liqui-Bond Thermally Conductive Adhesives Gap Thermally Conductive Gap Filling Materials Phase Change Interface Materials TIC Thermal Interface Compound Thermal Insulated Metal Substrates

World Class Operations Around the Globe

Worldwide Locations In the United States, the Thermal Products Group’s 90,000 square foot manufacturing facility is located in Cannon Falls, Minnesota. A 40,000 square foot facility in Prescott, Wisconsin houses the Thermal Clad printed circuit board operations. A 130,000 square foot facility in Chanhassen, Minnesota is the location for Bergquist’s corporate headquarters and state of the art research and development facilities.Worldwide, Bergquist has facilities in The Netherlands, Germany, the United Kingdom,Taiwan, Korea, Hong Kong and China with sales representatives in 30 countries to support worldwide growth.

INTRODUCTION

GAP PAD

A Legacy of IndustryLeading Technology

Research & Development at the Speed of Change

New Product Innovation

For over 35 years, outstanding quality, innovation and engineering have been hallmarks of The Bergquist Company. Today, developing innovative products for the electronics industry remains our first priority. Bergquist has developed over 260 materials which provide thermal solutions for a wide variety of electronic applications. Many of our products were originally developed to satisfy a customer request for a specific material designed to perform to their particular specifications.This “can do” attitude and customized technology has earned The Bergquist Company its QS 9000 certification ahead of competitors, and will position the company as an industry leader by early certification to ISO 9001:

R&D Facilities

Keeping pace in today’s aggressive electronics industry demands continual anticipation of change and the ability to develop customerdriven solutions quickly and efficiently. Our Chanhassen headquarters features a state-of-the-art development laboratory and engineering department staffed with highly skilled chemical engineers, laboratory technicians and manufacturing engineers all dedicated to researching, developing and testing new materials. From such dedication has come many industry-standard proprietary products including Thermal Clad, Sil-Pad, Gap Pad, Bond-Ply and Hi-Flow materials.

HI--FLOW

SIL-PAD

BOND-PLY
ORDERING

INTRODUCTION

Thermal Properties & Testing

Thermal Conductivity

The time rate of heat flow through a unit area producing a unit temperature difference across a unit thickness.

Thermal Resistance

The opposition to the flow of heat through a unit area of material across an undefined thickness.

Thermal conductivity is an inherent or absolute property of the material. Thermal resistance varies with thickness.

Thermal Impedance

A property of a particular assembly measured by the ratio of the temperature difference between two surfaces to the steady state heat flow through them.

Test Methods ASTM D5470

Factors affecting thermal impedance include:

Area Increasing the area of thermal contact decreases thermal impedance. Thickness Increasing the insulator thickness increases thermal impedance. Pressure Increasing mounting pressure under ideal conditions decreases thermal impedance. Time Thermal impedance decreases over time. Measurement Thermal impedance is affected by the method of temperature measurement.

Thermal Impedance Per Bergquist TO-220 Thermal Performance Cold Plate Testing
2 in. diameter stack ref. in2 10-500* psi, 1 hour per layer * Bergquist modified

Interface Material Selection Guide

PRODUCT OVERVIEW

INTERFACE APPLICATIONS

MOUNTING TYPICAL CONVERTED

METHODS

OPTIONS

Discrete Power Devices for Power Supplies, Computers, Telecom Thru-Hole Active Power Compensators Capacitors, Inductors, Resistors Electronic Modules for Automotive Motor & wiper Controls, Anti-Lock, et. Electronic Modules for Telecom and Power Supplies Computer Applications CPU, GPU, ASICs, Hard Drives Electrical Insulator Clip, Low Pressure Screw/Rivets, High Pressure Not Applicable Sheet Stock Roll-Form Continuous Standard Configurations Custom External Shapes Custom Internal Features Standard PSA Offerings

INTRODUCTION

Market Applications Products

Grease Replacement Q-Pad II

Materials

Q-Pad 3

Hi-Flow 105

Hi-Flow 115-AC

Hi-Flow 300G

Hi-Flow 225F-AC

Hi-Flow 225FT

Hi-Flow 225UT

Hi-Flow 225U

Hi-Flow 225UF

Grease Replacement Hi-Flow 625

Materials - Insulated Hi-Flow 300P

Bonding - Thin-Film Bond-Ply 660B

Bonding - Fiberglass Bond-Ply 100

Bonding Unreinforced

Bond-Ply 400
Ordering Procedure:

Sample SPT 400 ___ “A” “B” “C”

U.S. Patents 4,574,879 4,602,125 4,602,678 4,685,987 4,842,911 and others

SIL-PAD

Shield

Bonded Laminate of Sil-Pad with a Copper Shield
• Bonded laminate
• Electrically isolating
• Copper shield between layers of Sil-Pad
• Pre-tinned solder point for easy grounding

TYPICAL PROPERTIES OF SIL-PAD SHIELD

PROPERTY

VALUE

TEST METHOD

Thickness / Total inches

Shield / Copper Thickness inches

Approx.Thermal Resistance TO-3 °C/W

Min. Breakdown Voltage Between Device & Copper Volts
4500

ASTM D149

Capacitance at 1000 Hz & 5 Volts pF

Dissipation Factor at 1000 Hz & 5 Volts TO-3 Power Factor

ASTM D150

Dielectric Constant at 1000 Hz & 5 Volts

ASTM D150

Continuous Use Temp °C
-60 to 180

Recommended Torque TO-3 inch-pounds

RFI Produced by Heat Sink Current

The capacitance between a TO-3 encapsulated transistor and its heat sink is typically 100pf when a mica or other insulating washer is used. A power supply constructed with a standard insulator and a grounded heat sink can be expected to produce about 10 times more interference than is permitted.

A solution to the problem can be accomplished by:
1.The use of chokes, filters and LC networks which have to be designed into the circuitry. OR

Constructing a shield between the transistor and its heat sink by replacing the mica insulator with a Sil-Pad Shield see illustration .

Typical Applications Include:
• Switch mode power supplies
• EMI / RFI shield between PCB’s

Configurations Available:

Sil-Pad Shield is available in many custom configurations to meet special requirements.Tooling charges vary depending on tolerances and complexity of the part. Sil-Pad Shield is a laminate of copper with Sil-Pad thermally conductive insulators. Sil-Pad Shield provides
• Shielding effectiveness of 50dB or higher
• Electrical isolation of 500 volts minimum
• Good thermal transfer
• Reduced labor costs due to the elimination of having to apply thermal grease

U.S. Patents 4,574,879 4,602,125 4,602,678 4,685,987 4,842,911 and others

SIL-PAD
& Liqui-Bond Adhesives

Bond-Ply Adhesive Tapes

Available in a pressure sensitive adhesive or laminating format, the Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply facilitates the decoupling of bonded materials with mismatched thermal coefficients of expansion.

Typical Bond-Ply Applications
ORDERING

Solutions for Surface Mount Applications

Hi-Flow

The Hi-Flow family of phase change materials offers an easy to apply thermal interface for many surface mount packages. At the phase change temperature, Hi-Flow materials change from a solid and flow with minimal applied pressure.This characteristic optimizes heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to replace messy thermal grease.

Bergquist phase change materials are specially compounded to prevent pump out of the interface area, which is often associated with thermal grease.

Power Device

Thermal Clad

High Power Application Hi-Flow with Thermal Clad

Processor High Power Application

Hi-Flow without Thermal Clad

Hi-Flow Heat Spreader

Hi-Flow

Heat Spreader

FR-4 Board

Typical applications include:
• and other high performance CPUs
• DC/DC converters
• Power modules Hi-Flow materials are manufactured with or without film or foil carriers. Custom shapes and sizes for non-standard applications are also available.

Sil-Pad

Sil-Pad is the benchmark in thermal interface materials.The Sil-Pad family of materials are thermally conductive and electrically insulating. Available in custom shapes, sheets, and rolls, Sil-Pad materials come in a variety of different thicknesses and are frequently used in SMT applications such as:
• Interface between thermal vias in a PCB, and a heat sink or casting
• Heat sink interface to many surface mount packages

Power Device

Sil-Pad or

Bond-Ply

FR-4

Mid Power Application with Bond-Ply

Heat Spreader
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Where Thermal Solutions Come Together

Bond-Ply

The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply is available in a PSA or laminating format, is reinforced with fiberglass or film and comes in a variety of different thicknesses. Bond-Ply provides for the mechanical decoupling of bonded materials with mismatched thermal coefficients of expansion, typical applications include
• Bonding bus bars in a variety of electronic modules and sub assemblies
• Attaching a metal-based component to a heat sink
• Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages
• Bonding flexible circuits to a rigid heat spreader or thermal plane
• Assembly tapes for BGA heat spreader

Gap Pad

The Gap Pad product family offers a line of thermally conductive materials which are highly conformable.Varying degrees of thermal conductivities and compression deflection characteristics are available.Typical applications include:
• On top of a semiconductor package such as a QFP or BGA. Often times, several packages with varying heights can use a common heat sink when utilizing Gap Pad
• Between a PCB or substrate and a chassis, frame, or other heat spreader
• Areas where heat needs to be transferred to any type of heat spreader Gap Pads are available in thickness of to and in custom shapes, with or without adhesive.

Power Device

Gap Pad

Heat Spreader

Lower Power Application with Gap Pad

Top Efficiency In Thermal Materials For Today's Changing Technology.

Contact Bergquist for additional information regarding our Thermal Solutions.We are constantly innovating to offer you the greatest selection of options and flexibility to meet today's changing technology.

FR-4 Board
ORDERING
Ordering Information
Ordering Procedure:

The last 2 or 3 digits the part number selected.The “foot print” and dimensions are shown on pages Each material has a prefix as shown on page

Special Shapes:

For applications requiring non standard or custom Sil-Pad contact the factory.We produce thousands of custom die shapes and designs.

Tolerances:

Typical converting tolerances are held on length L , width W , hole diameter and hole location for most materials as noted below:

TYPICAL SIL-PAD / HI-FLOW TOLERANCES

Part Dimension <6"

Length & Width Tolerance ±

Hole Location & Diameter ±
6" - 12"
>12"

TYPICAL GAP PAD TOLERANCES

Material Thickness

Length & Width Tolerance

Hole Location & Diameter
10 mil
15 mil
20 mil
40 mil
60 mil
80 mil
100 mil
125 mil
160 mil
200 mil
250 mil

Note Dependent upon material and application requirements, tighter tolerances may be feasible and available. Please contact Bergquist Sales for these requests and additional information regarding tolerances.

Sheets:
Standard sheet size for most materials is 12" x 12", with or without adhesive as specified on the individual data sheet.When ordering sheets, please specify material type, thickness and include all dimensions. Contact Bergquist Sales if other sizes are required.

Note Sil-Pad A2000 maximum sheet size is 10" x Gap Pad standard sheet size is 8" x

Rolls:

Sil-Pad materials are available in roll form, with or without adhesive, with the exception of Sil-Pad 1750, 2000 and A2000. Hi-Flow materials are available in roll form. Certain Gap Pad materials are available in roll form. Please contact Bergquist Sales for more information.

Adhesives:

Before selecting an adhesive, check individual product sheets for standard PSA offerings. Bergquist adhesives include:

SILICONE:

AC - Unloaded ACA - Unloaded, Low Tack TAC - Loaded Thermally Enhanced

ACRYLIC:

AAC - Unloaded TAAC - Thermally Loaded EAAC - Thermally Enhanced

THICKNESS - 12-25µm Adhesive only

Note All non-symmetrical parts are supplied with the adhesive on the far side unless otherwise specified.

Peel Strength See data below.

POL = Peel Off Liner force per lineal strength of the liner to the adhesive .

QS = Quick Stick Simulated force per lineal strength of the adhesive to the heat sink . g/in = Grams per inch.

TYPICAL ADHESIVE PROPERTIES

ADHESIVE

Silicone AC
50-150 g/in
50-150 g/in

Silicone ACA
5-70 g/in
5-150 g/in

Silicone TAC
50-150 g/in
50-150 g/in

Acrylic AAC
5-70 g/in
100-800 g/in

Acrylic TAAC
5-70 g/in
100-400 g/in

Acrylic EAAC
5-60 g/in
100-200 g/in

Note These values are typical after the material has aged for 2-3 weeks and are significantly different immediately after coating. Upon completion of coating, QS is 250-500 g/in and POL is 3-20 g/in for all silicone adhesives.

Shelf Life:

Silicone Adhesives Six 6 months from date of manufacture when stored in original packaging at 70°F 21°C and 50% relative humidity.

Acrylic Adhesives One 1 year from date of manufacture when stored in original packaging at 70°F 21°C and 50% relative humidity.

Peel adhesion data is available upon request. Please contact Bergquist Sales for more information.
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Ordering Information

PSA Characteristics:

Standard pressure sensitive adhesive AC coated on one side of a Sil-Pad will increase the thermal resistance per ASTM D5470 by 0.2°C-in2/W. Standard PSA on 2 sides increases the thermal impedance by 0.4°C-in2/W.

Thermally conductive PSA TAC on one side increases the thermal resistance by 0.05°C-in2/W and on two sides by 0.1°C-in2/W.

The effect of AC and TAC on the thermal impedance in an application will vary. In low pressure applications, the pressure sensitive adhesive will wet out the interface easier and eliminate the interfacial thermal resistance.

Note Bergquist adhesives are designed for ease of application during assembly. If an automated dispensing method is preferred, Bergquist will recommend manufacturers of automated dispensing equipment upon request. Please contact Bergquist Sales for more information on this subject.

Note Bergquist cannot be responsible for dispensing equipment selection and/or performance of specific materials on said equipment. It is the customer’s responsibility to determine the suitability and compatibility of the specific Bergquist material with the selected equipment.

Recognition:

For information regarding the U.L. Underwriters Laboratories, Inc. recognition status of Bergquist Sil-Pad, Gap Pad and Hi-Flow materials, the U.L. web site provides the most current information.

Using the URL select “Online Certification Directory.”You may then enter one of the following file numbers for the applicable Bergquist file:

QMFZ2.E59150 Plastics Component. This category includes all Sil-Pad, Gap Pad and Hi-Flow materials.

QOQW2.E81718 Polymeric Adhesive Systems, Electrical Equipment Component. This category includes Bond-Ply adhesive only.

In each group there is a “Guide Information” section which gives a detailed description of the categories listed and all recognized materials will be listed with supporting data.

Material Specifications:

Bergquist will supply a Thermal Insulation Material Cross Reference Listing for all pertinent military part numbers included in the following specifications:

MIL M-38527 / 08 MIL I-49456A MIL I-49466 / 02 NAS 4117 MIL H-87111 NAS 4118

Each Bergquist part number a Bergquist grade of thermal insulation material and a transistor case Details of different Bergquist thermal insulation materials as well as details on different thermal insulator are found on previous pages of the Sil-Pad Selection Guide.

MIL-I-49456A specifies a fiberglass reinforced elastomeric sheet material showing type and class. MIL-I-49466-02, MIL M-38527 / 08 and MIL-H-87111 specify thermal insulator configurations.

MIL I-49466 / 02 supersedes the part numbers covered under MIL M-38527 / M49466 / 02 is the most complete listing of military part numbers. Each of the military part numbers in M49466 / 02 is cross referenced to Bergquist part numbers. Please use MIL-I-49466 whenever possible. Please contact The Bergquist Company for the complete MIL Spec Reference Guide.

FSCM NUMBER 55285
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Configurations

Imperial Measurements
4 Lead Part Number

TO-66

Suffix

TO-220

Plastic Part Number

Power

Suffix

Dimensions

Various Clip Mount TO-126 Various TO-220 TO-202 Various TO-220 TO-126 Various TO-220 Various TO-218 Various
-102
-103

Suffix

Dimensions
"C" "D"

Various
-104

Various -107

Various -110

Various -114

Various -116

Various -117

Various -118

Various -119

Various -120

TO-3P -122

Various -126

Various -128

Various -131

Various -132

Various -133

Various -134

Various -136

Various -137

Various -138

Power Part Number

Dimensions

Module

Suffix
ORDERING

D-DIA

B C D A

F RAD TYP 2 G Dia

Configurations

Multiwatt

Suffix
-124
-125

Dimensions
x 45° x 45°

Imperial Measurements

Multi-Lead Part Number

TO-66

Suffix

Diode Washer

Part Number Dimensions

Suffix

Part Number Dimensions

Suffix

Various

Various

DO-4

Various

DO-5

Various

DO-4 oversized -22

DO-8

DO-5 oversized -25

Various

Various

Various

Various

Various

Various

Various

Various

Various
-111

Part Number TO-36

Suffix
ORDERING

Configurations

Imperial Measurements

TO-3 & TO-66

Dimensions

Style

Suffix
-59 Leadless
-112
-113
-127
-129
-135
3 Lead Part Number

Dimensions

TO-3

Suffix

C DIA. 2

D DIA. 3

F DIA. A

D DIA. 4

C DIA. 2
18° G°
4 Lead Part Number

Dimensions

TO-3

Suffix
72°
72°
8 Lead Part Number

Dimensions

TO-3

Suffix
40°
10 Lead Part Number

Dimensions

TO-3

Suffix
3 Lead Part Number

Dimensions

TO-66
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9 Lead Part Number

Dimensions

TO-66

Suffix
36°

Power Part Number

Dimensions

Module

Suffix
-130

C - DIA.
225 Configurations

Imperial Measurements

Hi-Flow 225U Configurations

MATERIAL LINER PSA STRIP LINER

Part Number Suffix -143 -144 -145 -146 -147 -148 -149
“A”

Dimensions ±
“B”
“C”

Min. Pcs/Roll 5000 7500 10000 15000 22500

Hi-Flow 225UT/225FT Configurations

YELLOW PSA TAPE

LINER MATERIAL

LINER

PSA STRIP CLEAR PSA TAPE

Part Number Suffix -150 -151 -152 -153 -154 -155 -156
“A”

Dimensions ±
“B”
“C”

Min. Pcs/Roll 3000 5000 7500 10000 15000
ORDERING

Configurations

Metric Measurements
4 Lead Part Number

Dimensions

TO-66

Suffix

Plastic Part Number

Power

Suffix

Dimensions

Suffix

Dimensions
"C" "D"

Various

Clip Mount -43

TO-126

TO-220 Various

Various

TO-220

TO-202

Various

TO-220

TO-126

Various

TO-220

Various

Various

TO-218

Various

Various

Various
-102

Various
-103

Various

Various TO-3P Various
-104
-107
-110
-114
ORDERING

D-DIA

F RAD TYP 2 G Dia

Configurations

Multiwatt Suffix
-124 -125

Multi-

Lead Part Number

TO-66

Suffix

Dimensions
x 45° x 45°

Dimensions

Metric Measurements

Diode Washer

Part Number Suffix

Dimensions

Various DO-4 DO-5 DO-4 oversized DO-5 oversized Various
-19 -20 -21 -22 -25 -26 -27 -28 -32

TO-36

Dimensions

Suffix

Dimensions

Suffix

Various

Various

Various

DO-8

Various

Various

Various

Various
-111

Small Power Devices

TO-5, 3 Holes TO-18, 3 Holes TO-18, 4 Holes TO-5, 4 Holes TO-5, 3 Holes TO-5, 4 Holes

Dimensions

Suffix
-09 -12 -13 -33 -44 -45

Rectifier

Part Number Dimensions

Suffix
ORDERING

Configurations

Metric Measurements

C DIA. 2

D DIA. 3

F DIA. A

D DIA. 4

C DIA. 2
18° G°

TO-3 Part Number

Dimensions

Style

Suffix
-59 Leadless
-112
-113
-127
-129
-135
3 Lead Part Number

TO-3

Suffix

Dimensions
4 Lead Part Number

TO-3

Suffix
72°
72°
8 Lead TO-3

Suffix
40°
10 Lead Part Number

TO-3

Suffix
3 Lead Part Number

TO-66

Suffix
9 Lead Part Number

TO-66

Suffix
36°
ORDERING

Power Part Number

Module

Suffix
-130

C - DIA.
225 Configurations

Metric Measurements

Hi-Flow 225U Configurations

MATERIAL LINER PSA STRIP LINER

Part Number Suffix -143 -144 -145 -146 -147 -148 -149
“A”

Dimensions ± “B”
“C”

Min. Pcs/Roll 5000 7500 10000 15000 22500

Hi-Flow 225UT/225FT Configurations

YELLOW PSA TAPE

LINER MATERIAL

LINER

PSA STRIP CLEAR PSA TAPE

Part Number Suffix -150 -151 -152 -153 -154 -155 -156

Dimensions ± “A”
“B”
“C”

Min. Pcs/Roll 3000 5000 7500 10000 15000
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Shield

Standard Configurations

DIA.

DIA. 2 HOLES

DIA. tinned copper to ground

DIA 3 HOLES DIA. tinned copper to ground
33°

DIA. tinned copper to ground

P/N 09SPS01-002 TO-220

P/N 09SPS01-001 TO-3

P/N 09SPS01-009
.040DIA 3 HOLES

DIA 2

DIA 2 HOLES

DIA 2 HOLES

DIA. tinned copper to ground

DIA. tinned copper to ground

DIA. tinned copper to ground

P/N 09SPS01-011 TO-5

P/N 09SPS01-016 TO-3

P/N 09SPS01-017 TO-66

DIA 2 HOLES

N.T.S.

DIA 2 HOLES
30°

DIA. tinned copper to ground

P/N 09SPS01-020 DO-5

P/N 09SPS01-023 TO-3

DIA.

DIA. tinned copper to ground

P/N 09SPS01-019 DO-4

Contact the factory for other configurations.
ORDERING

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived Q3-0.005-AC-1212-NA Datasheet file may be downloaded here without warranties.

Datasheet ID: Q3-0.005-AC-1212-NA 521729