SSH22N50A
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SSH22N50A (pdf) |
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3RZHU 026 7 SSH22N50A Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current 10µA Max. VDS = 500V Lower RDS ON Typ. Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt TJ , TSTG Characteristic Drain-to-Source Voltage Continuous Drain Current TC=25°C Continuous Drain Current TC=100°C Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation TC=25°C Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8 from case for 5-seconds Thermal Resistance Characteristic Junction-to-Case Case-to-Sink Junction-to-Ambient BVDSS = 500 V RDS on = ID = 22 A TO-3P 1.Gate Drain Source Value 500 22 88 ±30 2151 22 278 - 55 to +150 Units V A V mJ A mJ V/ns W/°C Typ. -- Max. Units °C/W 1999 Fairchild Semiconductor Corporation SSH22N50A 32 5 026 7 Electrical Characteristics TC=25°C unless otherwise specified Symbol BVDSS VGS th |
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