FQPF6N90

FQPF6N90 Datasheet


FQPF6N90

Part Datasheet
FQPF6N90 FQPF6N90 FQPF6N90 (pdf)
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QFET N-CHANNEL
• Advanced New Design
• Avalanche Rugged Technology
• Rugged Gate Oxide Technology
• Very Low Intrinsic Capacitances
• Excellent Switching Characteristics
• Unrivalled Gate Charge 40nC Typ.
• Extended Safe Operating Area
• Lower RDS ON Typ.

ABSOLUTE MAXIMUM RATINGS

Symbol VDSS

IDM VGS EAS IAR EAR dv/dt

TJ, TSTG

Characteristics

Drain-to-Source Voltage

Continuous Drain Current TC = 25°C

Continuous Drain Current TC = 100°C

Drain Current-Pulsed

Gate-to-Source Voltage

Single Pulsed Avalanche Energy

Avalanche Current

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

Total Power Dissipation TC = 25°C Linear Derating Factor

Operating Junction and Storage Temperature Range

Maximum Lead Temp. for Soldering Purposes, 1/8” from case for 5-seconds

THERMAL RESISTANCE

Characteristics Junction-to-Case Junction-to-Ambient

FQPF6N90

BVDSS = 900V RDS ON = ID = 3.4A

TO-220F

Gate Drain Source

Value 900 ±30 710 56
−55 to +150

Units V

A V mJ A mJ V/ns W/°C

Typ. − −

Max.

Units °C/W
1999 Fairchild Semiconductor Corporation

FQPF6N90

QFET N-CHANNEL

ELECTRICAL CHARACTERISTICS TC = 25°C unless otherwise specified

Symbol BVDSS VGS th

IGSS

IDSS Drain-to-Source Leakage Current

RDS on
gfs Ciss Coss Crss td on
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Datasheet ID: FQPF6N90 515443