FEB155

FEB155 Datasheet

FEB155-001 User’s Guide

Part	Datasheet
FEB155	FEB155 (pdf)

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FEB155-001 User’s Guide Motor Control Evaluation Board Using the Motion-SPM FSB50450 in a Tiny-DIP 29mm x 12mm Package 2006 Fairchild Semiconductor Page 1 of 12 Contents Product Description Circuit Designed Schematic Bill of Materials Printed Circuit Board Recommended Cooling Methods of Motion-SPM in Tiny-DIP 2006 Fairchild Semiconductor Page 2 of 12 Introduction This user’s guide supports the FSB50450, Motion-SPM in a Tiny-DIP package evaluation board. It should be used in conjunction with the FSB50450 data sheet. Circuit Description The Motion-SPM is installed as the switching module in this evaluation board and has direct interface with the CPU. The DC-link P and N input terminals are connected into the corresponding terminals in Motion-SPM and three-phase U,V,W output terminals from SPM are wired into motor input. Since the three HVICs are integrated in the Motion-SPM, three parts of bootstrap circuit are needed, which consists of bootstrap capacitor, charge resistor for charging boost capacitor, blocking diode for high voltage isolation. Six R-C low pass are used between input connector from DSP or other controller and gate input signal pins of Motion-SPM 2006 Fairchild Semiconductor Page 3 of 12 Designed Solution Schematic 2006 Fairchild Semiconductor Gating UH Gating VH Gating WH Gating UL Gating VL Gating WL Fault 15V line Test Board 10 15V 11 GND 15V 10 GND 11 TP2 TP3 TP4 TP6 TP5 TP7 15V line R16 10 1/4W D1 1N4937 R1 0 1/8W R2 0 1/8W C8 C5 C1 102 104 D2 1N4937 R4 0 1/8W R6 0 1/8W C9 C6 C3 102 104 D3 1N4937 R3 0 1/8W R5 0 1/8W C10 C7 C2 102 104 10uF R12 0 1/8W R8 0 1/8W R7 0 1/8W C14 105 C15 105 C18 105 1 COM 2 VB U 3 VCC U 4 IN UH 5 IN UL 6 VS U 7 VB V 8 VCC V 9 IN VH 10 IN VL

PDF Datasheet Preview

FEB155-001 User’s Guide

Motor Control Evaluation Board Using the Motion-SPM FSB50450 in a Tiny-DIP 29mm x 12mm Package
2006 Fairchild Semiconductor

Page 1 of 12

Contents

Product Description Circuit

Designed Schematic Bill of Materials Printed Circuit Board Recommended Cooling Methods of Motion-SPM in Tiny-DIP
2006 Fairchild Semiconductor

Page 2 of 12

Introduction This user’s guide supports the FSB50450, Motion-SPM in a Tiny-DIP package evaluation board. It should be used in conjunction with the FSB50450 data sheet.

Circuit Description The Motion-SPM is installed as the switching module in this evaluation board and has direct interface with the CPU. The DC-link P and N input terminals are connected into the corresponding terminals in Motion-SPM and three-phase U,V,W output terminals from SPM are wired into motor input. Since the three HVICs are integrated in the Motion-SPM, three parts of bootstrap circuit are needed, which consists of bootstrap capacitor, charge resistor for charging boost capacitor, blocking diode for high voltage isolation. Six R-C low pass are used between input connector from DSP or other controller and gate input signal pins of Motion-SPM
2006 Fairchild Semiconductor

Page 3 of 12

Designed Solution Schematic
2006 Fairchild Semiconductor

Gating UH Gating VH Gating WH Gating UL Gating VL Gating WL

Fault
15V line

Test Board
10 15V
11 GND
15V 10

GND 11

TP2 TP3

TP4 TP6

TP5 TP7
15V line

R16 10 1/4W

D1 1N4937 R1 0 1/8W R2 0 1/8W

C8 C5 C1 102 104

D2 1N4937 R4 0 1/8W R6 0 1/8W

C9 C6 C3 102 104

D3 1N4937 R3 0 1/8W R5 0 1/8W

C10 C7 C2 102 104
10uF

R12 0 1/8W R8 0 1/8W R7 0 1/8W

C14 105

C15 105

C18 105
1 COM 2 VB U 3 VCC U 4 IN UH 5 IN UL
6 VS U 7 VB V 8 VCC V 9 IN VH 10 IN VL

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Datasheet ID: FEB155 514463