UMA5818

UMA5818 Datasheet

UMA5817, UMA5818, and UMA5819

Part	Datasheet
UMA5818	UMA5818 (pdf)

Related Parts	Information
UMAF5819	UMAF5819
UMAF5818	UMAF5818
UMA5817-T7	UMA5817-T7
UMA5819	UMA5819
UMAF5817	UMAF5817

PDF Datasheet Preview
SCOTTSDALE DIVISION UMA5817, UMA5818, and UMA5819 ULTRAMITE SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS .COM The UMA5817 thru UMA5819 UltraMite series offers small efficient surface mount packaging with the same electrical features as the popular 1N5817, 1N5818, and 1N5819 Schottky rectifiers. It provides the same size footprint as other small surface mount DO-214AC or BA package options except with a much lower profile height. Its configuration in a “2010 MELF” style robust package design prevents lead damage to terminals and also minimizes parasitics by eliminating internal wire bonds and providing very short internal conduction paths. APPEARANCE UltraMite IMPORTANT For the most current data, consult MICROSEMI’s website: APPLICATIONS / BENEFITS • Plastic package has Underwriters Laboratory Flammability classification 94V-0 • Metal to silicon rectifier, majority carrier conduction • High current capability, low VF • Built-in stress relief with similar COE as PC boards • Optional Lead-Free design/finish UMAF5817-19 • Options for screening in accordance with MIL-PRF19500/586 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers. For example, designate a MXUMAJ5819 for a JANTX screen. • For surface mount applications • For use in low-voltage high-frequency switching power supplies, inverters, free wheeling, and polarity protection applications • Low power loss, High efficiency • Low inductive parasitics for minimal Ldi/dt effects • Fits same small PCB footprints as popular “SMAJxxx” or “SMBJxxx” Schottky devices in JEDEC outlines DO-214AC or BA and DO-214AA respectively except with much lower height profile • Robust 2010 MELF style package configuration for pick-and-place handling MAXIMUM RATINGS MECHANICAL AND PACKAGING • Operating junction and storage temperature range TJ and TSTG -50 oC to +125oC • Forward average rectified current IO Amp • Forward surge current IFSM ms single half-sine waveform superimposed on rated load JEDEC Method 25 Amps • Typical thermal resistance 50 oC/W • Typical junction capacitance CJ at MHz and VR of Volts 65 pF for UMA5817, and 46 pF for UMA5818 and UMA5819 • Solder temperatures 260 ºC for 10 s maximum • FRP substrate material and epoxy under-fill package meeting UL94V-0 • Terminals solder plated solderable per MIL-STD750, Method 2026 • Body marked with 5817, 5818, or 5819 • Cathode designated with band • Weight grams • Tape & Reel packaging per EIA-481-2 with 12 mm tape and 3000 units/reel 7 inch reel or 10,000 units/reel 13 inch reel • See package dimensions on last page ELECTRICAL CHARACTERISTICS 25oC unless specified otherwise Working Maximum Maximum Peak Peak

PDF Datasheet Preview

SCOTTSDALE DIVISION

UMA5817, UMA5818, and UMA5819

ULTRAMITE SURFACE MOUNT

SCHOTTKY BARRIER RECTIFIERS
.COM

The UMA5817 thru UMA5819 UltraMite series offers small efficient surface mount packaging with the same electrical features as the popular 1N5817, 1N5818, and 1N5819 Schottky rectifiers. It provides the same size footprint as other small surface mount DO-214AC or BA package options except with a much lower profile height. Its configuration in a “2010 MELF” style robust package design prevents lead damage to terminals and also minimizes parasitics by eliminating internal wire bonds and providing very short internal conduction paths.

APPEARANCE UltraMite

IMPORTANT For the most current data, consult MICROSEMI’s website:

APPLICATIONS / BENEFITS
• Plastic package has Underwriters Laboratory Flammability classification 94V-0
• Metal to silicon rectifier, majority carrier conduction
• High current capability, low VF
• Built-in stress relief with similar COE as PC boards
• Optional Lead-Free design/finish UMAF5817-19
• Options for screening in accordance with MIL-PRF19500/586 for JAN, JANTX, JANTXV, and JANS are available by adding MQ, MX, MV, or MSP prefixes respectively to part numbers. For example, designate a MXUMAJ5819 for a JANTX screen.
• For surface mount applications
• For use in low-voltage high-frequency switching power supplies, inverters, free wheeling, and polarity protection applications
• Low power loss, High efficiency
• Low inductive parasitics for minimal Ldi/dt effects
• Fits same small PCB footprints as popular “SMAJxxx” or “SMBJxxx” Schottky devices in JEDEC outlines DO-214AC or BA and DO-214AA respectively except with much lower height profile
• Robust 2010 MELF style package configuration for pick-and-place handling

MAXIMUM RATINGS

MECHANICAL AND PACKAGING
• Operating junction and storage temperature range TJ and TSTG -50 oC to +125oC
• Forward average rectified current IO Amp
• Forward surge current IFSM ms single half-sine waveform superimposed on rated load JEDEC Method 25 Amps
• Typical thermal resistance 50 oC/W
• Typical junction capacitance CJ at MHz and VR of Volts 65 pF for UMA5817, and 46 pF for UMA5818 and UMA5819
• Solder temperatures 260 ºC for 10 s maximum
• FRP substrate material and epoxy under-fill package meeting UL94V-0
• Terminals solder plated solderable per MIL-STD750, Method 2026
• Body marked with 5817, 5818, or 5819
• Cathode designated with band
• Weight grams
• Tape & Reel packaging per EIA-481-2 with 12 mm
tape and 3000 units/reel 7 inch reel or 10,000 units/reel 13 inch reel
• See package dimensions on last page

ELECTRICAL CHARACTERISTICS 25oC unless specified otherwise

Working Maximum

Maximum

Peak

Peak

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived UMA5818 Datasheet file may be downloaded here without warranties.

Datasheet ID: UMA5818 649170