LE71HE0011

LE71HE0011 Datasheet

Le71HE0011 Le78D11 /Le77D11 Evaluation Board, Revision D1 User’s Guide

Part	Datasheet
LE71HE0011	LE71HE0011 (pdf)

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Document Number 081081 The contents of this document are provided in connection with Legerity, Inc. products. Legerity makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in Legerity's Standard Terms and Conditions of Sale, Legerity assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. Legerity's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of Legerity's product could create a situation where personal injury, death, or severe property or environmental damage may occur. Legerity reserves the right to discontinue or make changes to its products at any time without notice. 2003 Legerity, Inc. All rights reserved. Trademarks Legerity, the Legerity logo and combinations thereof, VoSLIC, VoSLAC, WinACIF, WinSLAC, and WinSLAC2 are trademarks of Legerity, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. TABLE OF CONTENTS CHAPTER 1 CHAPTER 2 CHAPTER 3 CHAPTER 4 CHAPTER 5 INTRODUCTION 1 Overview 1 BOARD SETUP AND CONNECTION 3 Board Features. 3 Board Modifications 3 BGND-to-AGND 3 Surge Protection 3 Unpopulated Components. 3 Board Connections 3 Power 3 Test Points 5 Telephone Line Interface 5 Interconnection of the Le71HE0011 Evaluation Board 6 PCM/MPI Connections 7 BOARD OPERATION AND CONTROL 9 Switcher Configurations 9 Jumper Settings 9 JP1 and JP2 9 JP3 9 JP4 10 Component Carriers 11 SOFTWARE OPERATION 13 Overview 13 EVALUATION BOARD SCHEMATICS. 15 Evaluation Board Schematics 15 Bill of Materials 21 Table of Contents Document ID# 081081 Date Version: Mar 5, 2003 1 Distribution Public Document Table of Contents 1 INTRODUCTION OVERVIEW Detailed device explanations, operational circuit descriptions and required formulas can be found within the individual data sheets. Figure below shows the physical layout of the Le71HE0011 evaluation board. Introduction Introduction 2 BOARD SETUP AND CONNECTION BOARD FEATURES The Le71HE0011 evaluation board features the following: • Four layer board Layer 1 Top routed traces Layer 2 Internal voltage planes variable V/Fixed V and VPOS Layer 3 Internal ground planes DGND, AGND and BGND Layer 4 Bottom routed traces BOARD MODIFICATIONS BGND-to-AGND The BGND-to-AGND connections for the PCB printed circuit board is made via the two jumpers located underneath the Le77D11 device socket. The jumpers keep AGND and BGND potentials to within 50 mV of each other. Surge Protection The surge protector for the board is the Power TISP61089B. The TIP/RING signals are routed through the part. The switcher junction of DSW, CFL and LVREG generates the gating signal for the Power Innovations part. This junction will typically be 8-10 volts above the ringing signal. The two "Protection Ground" banana jacks BJ5 and BJ6 allow for the surge signal to bypass the BGND plane up to the common BGND connection at PW1. In order for BJ5 to go directly to the PW1 connector the wire jumper, located in. to the right of the connector, must be cut and a short banana jack must be placed from BJ5 to BJ6. The VA and VB sense resistors are surface mounted resistors whose values are 243 and 232 respectively. Unpopulated Components Components not loaded at assembly time are listed in Table below. Table Unpopulated Components Component RXA1, RXB1, RXA2, RXB2 PTC1, PTC2, PTC3, PTC4 CVT1 and CVT2 CFL11 and CFL22 CIMT1 and CIMT2 Reason not Loaded Not required Board uses 50 wire wound resistors Not required Not required Not required The FZT953 was changed to a FZT955 due to the higher voltage rating 200 V of the FZT955. This will facilitate 100 V ringing on the PCB.

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Document Number 081081

The contents of this document are provided in connection with Legerity, Inc. products. Legerity makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in Legerity's Standard Terms and Conditions of Sale, Legerity assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. Legerity's products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of Legerity's product could create a situation where personal injury, death, or severe property or environmental damage may occur. Legerity reserves the right to discontinue or make changes to its products at any time without notice.
2003 Legerity, Inc. All rights reserved.

Trademarks Legerity, the Legerity logo and combinations thereof, VoSLIC, VoSLAC, WinACIF, WinSLAC, and WinSLAC2 are trademarks of Legerity, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

TABLE OF CONTENTS

CHAPTER 1 CHAPTER 2

CHAPTER 3 CHAPTER 4 CHAPTER 5

INTRODUCTION 1 Overview 1

BOARD SETUP AND CONNECTION 3 Board Features. 3 Board Modifications 3

BGND-to-AGND 3 Surge Protection 3 Unpopulated Components. 3 Board Connections 3 Power 3 Test Points 5 Telephone Line Interface 5 Interconnection of the Le71HE0011 Evaluation Board 6 PCM/MPI Connections 7

BOARD OPERATION AND CONTROL 9 Switcher Configurations 9 Jumper Settings 9

JP1 and JP2 9 JP3 9 JP4 10 Component Carriers 11

SOFTWARE OPERATION 13 Overview 13

EVALUATION BOARD SCHEMATICS. 15 Evaluation Board Schematics 15 Bill of Materials 21

Table of Contents

Document ID# 081081

Date Version:

Mar 5, 2003 1

Distribution Public Document

Table of Contents
1 INTRODUCTION

OVERVIEW

Detailed device explanations, operational circuit descriptions and required formulas can be found within the individual data sheets. Figure below shows the physical layout of the Le71HE0011 evaluation board.

Introduction

Introduction
2 BOARD SETUP AND CONNECTION

BOARD FEATURES

The Le71HE0011 evaluation board features the following:
• Four layer board Layer 1 Top routed traces Layer 2 Internal voltage planes variable V/Fixed V and VPOS Layer 3 Internal ground planes DGND, AGND and BGND Layer 4 Bottom routed traces

BOARD MODIFICATIONS

BGND-to-AGND

The BGND-to-AGND connections for the PCB printed circuit board is made via the two jumpers located underneath the Le77D11 device socket. The jumpers keep AGND and BGND potentials to within 50 mV of each other.

Surge Protection

The surge protector for the board is the Power TISP61089B. The TIP/RING signals are routed through the part. The switcher junction of DSW, CFL and LVREG generates the gating signal for the Power Innovations part. This junction will typically be 8-10 volts above the ringing signal. The two "Protection Ground" banana jacks BJ5 and BJ6 allow for the surge signal to bypass the BGND plane up to the common BGND connection at PW1. In order for BJ5 to go directly to the PW1 connector the wire jumper, located in. to the right of the connector, must be cut and a short banana jack must be placed from BJ5 to BJ6.

The VA and VB sense resistors are surface mounted resistors whose values are 243 and 232 respectively.

Unpopulated Components

Components not loaded at assembly time are listed in Table below.

Table Unpopulated Components

Component RXA1, RXB1, RXA2, RXB2 PTC1, PTC2, PTC3, PTC4 CVT1 and CVT2 CFL11 and CFL22 CIMT1 and CIMT2

Reason not Loaded Not required Board uses 50 wire wound resistors Not required Not required Not required

The FZT953 was changed to a FZT955 due to the higher voltage rating 200 V of the FZT955. This will facilitate 100 V ringing on the PCB.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived LE71HE0011 Datasheet file may be downloaded here without warranties.

Datasheet ID: LE71HE0011 648975