MT66R7072A10AB5ZZW.ZCA
MT66R7072A10AB5ZZW.ZCA Datasheet
MT66R7072A10AB5ZZW.ZCA, MT66R7072A10ACUXZW.ZCA MT66R5072A10ACUXZW.ZFA
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MT66R7072A10AB5ZZW.ZCA |
MT66R7072A10AB5ZZW.ZCA (pdf) |
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MT66R7072A10ACUXZW.ZCA |
MT66R7072A10ACUXZW.ZCA |
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MT66R7072A10AB5ZZW.ZCA TR |
MT66R7072A10AB5ZZW.ZCA TR |
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MT66R7072A10ACUXZW.ZCA TR |
MT66R7072A10ACUXZW.ZCA TR |
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| Product Brief 121-Ball LPDDR2-PCM and LPDDR2 MCP Features Product Brief LPDDR2-PCM and Mobile LPDDR2 121-Ball MCP MT66R7072A10AB5ZZW.ZCA, MT66R7072A10ACUXZW.ZCA MT66R5072A10ACUXZW.ZFA • LPDDR2-PCM and LPDDR2 components • RoHS-compliant, “green” package • Shared LPDDR2-PCM and LPDDR2 interfaces • Space-saving multichip package • Ultra low-voltage core and I/O power supplies VDD1 = VDDCA/VDDQ = VDD2 = • Wireless temperature range to +85°C LPDDR2-PCM Specific Features • Memory interface 16-bit data bus width Two data transfers per clock cycle Clock frequency up to 400 MHz Active to read/write delay tRCD = 86ns Configurable output drive strength • Memory architecture 4-row data buffers RDB Row data buffer size 32B 4-row address buffers RAB Emulated block size 128KB • Program/erase performance Legacy programming mode up to 10MB/s TYP Overwrite up to 3 MB/s TYP Legacy block erase time 60ms TYP • Dual operations PROGRAM/ERASE in one partition while READ in other partitions No delay between READ and WRITE operations • Locking scheme All blocks locked at power-up 8Mb lock region Any combination of regions can be locked Absolute write protection with VACC = VSS • Quality and reliability Minimum 100k WRITE cycles/row Figure 1 MCP Block Diagram LPDDR2-PCM Power LPDDR2-PCM Device LPDDR2 Power LPDDR2 Device Interface LPDDR2 Mobile LPDDR2-Specific Features • Programmable read and write latencies • Programmable burst lengths 4, 8, or 16 • Partial-array self refresh PASR • Deep power-down DPD mode • Selectable output drive strength • Adjustable clock frequency and clock stop capabili- ties Note This product brief does not provide detailed device information. For the complete data sheet, which covers device functionality, operating modes, and specifications, or for further information on any aspect of the product, contact the Micron sales office. Part Number:The MT66R5072A10ACUXZW.ZFA is available as an engineering sample only. Micron Technology, Inc. reserves the right to change products or specifications without notice. 2012 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. Product Brief 121-Ball LPDDR2-PCM and LPDDR2 MCP Features Part Numbering Information Micron LPDDR2-PCM and LPDDR2 devices are available in different configurations and densities. The MCP/PoP part numbering guide is available at Figure 2 Part Number Chart MT 66R 707 2 A CUX* Z W ZCA - ES Micron Technology Product Family 66R = LPDDR2-PCM I/F + LPDDR2 Production Status Blank = Production ES = Engineering samples MS = Mechanical samples Density PCM 0 1 32Mb = 4MB 2 64Mb = 8MB 3 128Mb = 16MB 4 256Mb = 32MB 5 512Mb = 64MB 6 768Mb = 96MB 7 1Gb = 128MB xNAND N/A Voltage Range Core_ I/0 PCM 1 2 LPDDR2 xLPDDR2 |
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