AT25HP512W2-10SI-2.7
AT25HP512W2-10SI-2.7 Datasheet
The AT25HP256/512 provides 262,144/524,288 bits of serial electrically erasable programmable read only memory EEPROM organized as 32,768/65,536 words of 8-bits each. The device is optimized for use in many industrial and commercial applications where high-speed, low-power, and low-voltage operation are essential. The AT25HP256/512 is available in a space saving 8-lead PDIP AT25HP256/512 , 8-lead EIAJ SOIC AT25HP256 , 16-lead JEDEC SOIC AT25HP512 , 8-lead Leadless Array AT25HP256/512 package, and 8-lead SOIC Array package SAP . In addition, the entire family is available in 2.7V 2.7V to 5.5V and 1.8V 1.8V to 5.5V versions.
| Part | Datasheet |
|---|---|
AT25HP512W2-10SI-2.7 |
AT25HP512W2-10SI-2.7 (pdf) |
| Related Parts | Information |
|---|---|
|
AT25HP512-10PI-1.8 |
AT25HP512-10PI-1.8 |
|
AT25HP512C1-10CI-1.8 |
AT25HP512C1-10CI-1.8 |
|
AT25HP512C1-10CI-2.7 |
AT25HP512C1-10CI-2.7 |
|
AT25HP512-10PI-2.7 |
AT25HP512-10PI-2.7 |
|
AT25HP512W2-10SI-2.7-T |
AT25HP512W2-10SI-2.7-T |
|
AT25HP512W210SU2.7 |
AT25HP512W210SU2.7 |
| PDF Datasheet Preview |
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| • Serial Peripheral Interface SPI Compatible • Supports SPI Modes 0,0 and 3 1,1 • 128-byte Page Mode Only for Write Operations • Low-voltage and Standard-voltage Operation VCC = 2.7V to 5.5V VCC = 1.8V to 5.5V • 10 MHz 5V , 5MHz 2.7V and 2 MHz 1.8V Clock Rate • Block Write Protection • Protect 1/4, 1/2, or Entire Array • Write Protect WP Pin and Write Disable Instructions for both Hardware and Software Data Protection • High Reliability Endurance 100K Write Cycles Data Retention >40 Years • 8-lead PDIP, 8-lead EIAJ SOIC, 16-lead JEDEC SOIC, 8-lead Leadless Array Package, and 8-lead SOIC Array Package SAP • Die Sales Wafer Form, Waffle Pack, and Bumped Wafers SPI Serial EEPROMs 256K 32,768 x 8 512K 65,536 x 8 The AT25HP256/512 provides 262,144/524,288 bits of serial electrically erasable programmable read only memory EEPROM organized as 32,768/65,536 words of 8-bits each. The device is optimized for use in many industrial and commercial applications where high-speed, low-power, and low-voltage operation are essential. The AT25HP256/512 is available in a space saving 8-lead PDIP AT25HP256/512 , 8-lead EIAJ SOIC AT25HP256 , 16-lead JEDEC SOIC AT25HP512 , 8-lead Leadless Array AT25HP256/512 package, and 8-lead SOIC Array package SAP . In addition, the entire family is available in 2.7V 2.7V to 5.5V and 1.8V 1.8V to 5.5V versions. Table Pin Configurations Pin Name Function Chip Select Serial Data Clock Serial Data Input Serial Data Output Ground 16-lead SOIC CS 1 SO 2 NC 3 NC 4 NC 5 NC 6 WP 7 GND 8 16 VCC 15 HOLD 14 NC 13 NC 12 NC 11 NC 10 SCK Power Supply 8-lead Leadless Array WP HOLD Write Protect Suspends Serial Input VCC 8 HOLD 7 SCK 6 SI 5 1 CS 2 SO 3 WP 4 GND Bottom View 8-lead SOIC Array Package SAP VCC 8 HOLD 7 SCK 6 SI 5 1 CS 2 SO 3 WP 4 GND 8-lead PDIP CS 1 SO 2 WP 3 GND 4 8 VCC 7 HOLD 6 SCK 5 SI 8-lead SOIC CS 1 SO 2 WP 3 GND 4 8 VCC 7 HOLD 6 SCK 5 SI Bottom View AT25HP256 Ordering Information 1 Ordering Code AT25HP256-10PU-2.7 2 AT25HP256-10PU-1.8 2 AT25HP256W-10SU-2.7 2 AT25HP256W-10SU-1.8 2 AT25HP256C1-10CU-2.7 2 AT25HP256C1-10CU-1.8 2 AT25HP256Y4-10YU-1.8 2 AT25HP256-W2.7-11 3 AT25HP256-W1.8-11 3 Package 8P3 8S2 8CN1 8Y4 Die Sale Die Sale Operation Range Lead-free/Halogen-free/ Industrial Temperature to 85°C Industrial Temperature to 85°C This device is not recommended for new design. Please refer to AT25256A datasheet. For devices used in 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. “U” designates Green Package & RoHS compliant. Available in waffle pack and wafer form order as SL719 for wafer form. Bumped die available upon request. Please contact Serial EEPROM marketing. 8CN1 8P3 8S2 8Y4 Package Type 8-lead, Wide, Leadless Array Package LAP 8-lead, Wide, Plastic Dual In-line Package PDIP 8-lead, Wide, Plastic Small Outline Package EIAJ 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Small Array Package SAP Options Low Voltage 2.7V to 5.5V Low Voltage 1.8V to 5.5V 14 AT25HP256/512 AT25HP256/512 AT25HP512 Ordering Information 1 Ordering Code Package Operation Range AT25HP512C1-10CI-2.7 AT25HP512-10PI-2.7 AT25HP512W2-10SI-2.7 8CN1 8P3 16S2 Industrial Temperature to 85°C AT25HP512C1-10CI-1.8 AT25HP512-10PI-1.8 AT25HP512W2-10SI-1.8 8CN1 8P3 16S2 Industrial Temperature to 85°C AT25HP512C1-10CU-2.7 2 AT25HP512C1-10CU-1.8 2 AT25HP512-10PU-2.7 2 AT25HP512-10PU-1.8 2 AT25HP512W2-10SU-2.7 2 AT25HP512W2-10SU-1.8 2 AT25HP512-W2.7-11 3 AT25HP512-W1.8-11 3 8CN1 8P3 16S2 Die Sale Die Sale Lead-free/ Halogen-free Industrial Temperature to 85°C Industrial Temperature to 85°C For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables. “U” designates Green Package & RoHS compliant. Available in waffle pack and wafer form order as SL719 for wafer form. Bumped die available upon request. Contact Serial EEPROM marketing. 8CN1 8P3 16S2 Package Type 8-lead, Wide, Leadless Array Package LAP 8-lead, Wide, Plastic Dual In-line Package PDIP 16-lead, Wide, Plastic Gull Wing Small Outline Package JEDEC SOIC Options Low Voltage 2.7V to 5.5V Low Voltage 1.8V to 5.5V Packaging Information 8CN1 LAP Marked Pin1 Indentifier mm TYP Top View Bottom View Note Metal Pad Dimensions. Pin1 Corner Side View COMMON DIMENSIONS Unit of Measure = mm SYMBOL MIN NOM MAX NOTE 2325 Orchard Parkway R San Jose, CA 95131 TITLE 8CN1, 8-lead 8 x 5 x mm Body , Lead Pitch mm, Leadless Array Package LAP 11/13/01 8CN1 16 AT25HP256/512 8P3 PDIP AT25HP256/512 Top View End View |
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