MX25V2006E
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MX25V2006EZNI-13G (pdf) |
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MX25V2006EM1I-13G |
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MX25V2006E MX25V2006E DATASHEET P/N PM1709 MX25V2006E Contents 4 GENERAL 5 PIN 5 PIN 5 BLOCK 6 MEMORY 7 Table Memory 7 DEVICE 8 Figure Serial Peripheral Interface Modes 8 DATA 9 Table Protected Area 9 HOLD 10 Figure Hold Condition Operation 10 Table COMMAND 11 COMMAND 12 1 Write Enable 12 2 Write Disable 12 3 Read Status Register 13 Status Register Bits Definition 13 Status Register Bits 13 4 Write Status Register 14 Table Protection 14 5 Read Data Bytes 15 6 Read Data Bytes at Higher Speed 15 7 Dual Output Mode 15 8 Sector Erase 15 9 Block Erase 16 10 Chip Erase 16 11 Page Program 16 12 Deep Power-down 17 13 Release from Deep Power-down RDP , Read Electronic Signature RES 17 14 Read Identification 18 15 Read Electronic Manufacturer ID & Device ID 18 Table ID 18 16 Read SFDP Mode 19 Read Serial Flash Discoverable Parameter RDSFDP 19 Table a. Signature and Parameter Identification Data Values 20 Table b. Parameter Table 0 JEDEC Flash Parameter 21 Table c. Parameter Table 1 Macronix Flash Parameter 23 POWER-ON 25 P/N PM1709 MX25V2006E ELECTRICAL 26 ABSOLUTE MAXIMUM 26 Figure Maximum Negative Overshoot 26 CAPACITANCE TA = 25°C, f = 26 Figure Maximum Positive Overshoot 26 Figure INPUT TEST WAVEFORMS AND MEASUREMENT 27 Figure OUTPUT 27 Table DC CHARACTERISTICS Temperature = -40°C to 85°C 28 Table AC CHARACTERISTICS Temperature = -40°C to 85°C 29 Table Power-Up 30 Timing 31 Figure Serial Input 31 Figure Output 31 Figure Hold 32 Figure WP# Disable Setup and Hold Timing during WRSR when 32 Figure Write Enable WREN Sequence Command 33 Figure Write Disable WRDI Sequence Command 33 Figure Read Status Register RDSR Sequence Command 33 Figure Write Status Register WRSR Sequence Command 34 Figure Read Data Bytes READ Sequence Command 34 Figure Read at Higher Speed FAST_READ Sequence Command 35 Figure Dual Output Read Mode Sequence Command 35 Figure Sector Erase SE Sequence Command 36 Figure Block Erase BE Sequence Command 52 or 36 Figure Chip Erase CE Sequence Command 60 or 36 Figure Page Program PP Sequence Command 37 Figure Deep Power-down DP Sequence Command 37 Figure Read Electronic Signature RES Sequence Command 38 Figure Release from Deep Power-down RDP Sequence Command 38 Figure Read Identification RDID Sequence Command 39 Figure Read Electronic Manufacturer & Device ID REMS Sequence Command 39 Figure Power-up 40 OPERATING 41 Figure AC Timing at Device 41 Figure Power-Down 42 P/N PM1709 MX25V2006E 2M-BIT [x 1/x 2] CMOS SERIAL FLASH GENERAL • Serial Peripheral Interface compatible -- Mode 0 and Mode 3 • 2,097,152 x 1 bit structure or 1,048,576 x 2 bits Dual Output mode structure • 64 Equal Sectors with 4K byte each - Any Sector can be erased individually • 4 Equal Blocks with 64K byte each - Any Block can be erased individually • Single Power Supply Operation - to volt for read, erase, and program operations • Latch-up protected to 100mA from -1V to Vcc +1V PERFORMANCE • High Performance - Fast access time 75MHz serial clock - Serial clock of Dual Output mode 70MHz - Fast program time 0.6ms typ. and 1ms max. /page 256-byte per page - Byte program time 9us typ. - Fast erase time 40ms typ. /sector 4K-byte per sector 0.4s typ. /block 64K-byte per block • Low Power Consumption - Low active read current 12mA max. at 75MHz and 4mA max. at 33MHz - Low active programming current 15mA typ. - Low active sector erase current 9mA typ. - Low standby current 15uA typ. - Deep power-down mode 2uA typ. • Minimum 100,000 erase/program cycles • 20 years data retention SOFTWARE FEATURES • Input Data Format - 1-byte Command code • Block Lock protection - The BP0~BP1 status bit defines the size of the area to be software protected against Program and Erase instructions • Auto Erase and Auto Program Algorithm - Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algorithm that automatically times the program pulse widths Any page to be programed should have page in the erased state first • Status Register Feature • Electronic Identification - JEDEC 2-byte Device ID - RES command, 1-byte Device ID • Support Serial Flash Discoverable Parameters SFDP mode HARDWARE FEATURES • PACKAGE - 8-pin SOP 150mil - 8-land WSON 6x5mm, 0.8mm package height - All devices are RoHS Compliant and Halogen-free P/N PM1709 MX25V2006E The device features a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus. The four bus signals are a clock input SCLK , a serial data input SI , a serial data output SO , and a chip select CS# . Serial access to the device is enabled by CS# input. When it is in Dual Output read mode, the SI and SO pins become SIO0 and SIO1 pins for data output. The device provides sequential read operation on whole chip. After program/erase command is issued, auto program/erase algorithms which program/erase and verify the specified page or sector/block locations will be executed. Program command is executed on byte basis, or page basis, or word basis for erase command is executes on sector, or block, or whole chip basis. To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read command can be issued to detect completion status of a program or erase operation via WIP bit. When the device is not in operation and CS# is high, it is put in standby mode. The device utilizes Macronix's proprietary memory cell, which reliably stores memory contents even after 100,000 program and erase cycles. PIN CONFIGURATIONS 8-PIN SOP 150mil CS# 1 SO/SIO1 2 WP# 3 GND 4 8 VCC 7 HOLD# 6 SCLK 5 SI/SIO0 8-LAND, WSON 6x5mm CS# 1 SO/SIO1 2 WP# 3 GND 4 8 VCC 7 HOLD# 6 SCLK 5 SI/SIO0 PIN DESCRIPTION SYMBOL DESCRIPTION ORDERING INFORMATION PART NO. MX25V2006EM1I-13G MX25V2006EZNI-13G CLOCK MHz 75 Temperature -40~85°C -40~85°C Package 8-SOP 150mil 8-land WSON 6x5mm Remark P/N PM1709 MX25V2006E PART NAME DESCRIPTION MX 25 V 2006E M1 I OPTION G RoHS Compliant and Halogen-free SPEED 13 75MHz TEMPERATURE RANGE I Industrial -40°C to 85°C PACKAGE ZN WSON 0.8mm package height M1 150mil 8-SOP DENSITY & MODE 2006E 2Mb TYPE V 2.5V DEVICE 25 Serial Flash P/N PM1709 PACKAGE INFORMATION 8-pin SOP 150mil MX25V2006E P/N PM1709 8-land WSON 6x5mm, 0.8mm package height MX25V2006E P/N PM1709 Removed "Advanced Inforamtion" Modified tVR Min. from 5us/V to 20us/V Added Read SFDP RDSFDP Mode Modified Secured OTP data from 1 to 0 Updated parameters for DC/AC Characteristics Updated Erase and Programming Performance MX25V2006E Page P4 P35 P4,8,11, P19~24,29 P23 P4,28,29 P4,43 Date 2011/07/27 FEB/10/2012 NOV/23/2012 DEC/09/2013 P/N PM1709 MX25V2006E Except for customized products which has been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright Macronix International Co., Ltd. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich io, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto if any are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 49 |
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