MX25L12855EXCI-10G

MX25L12855EXCI-10G Datasheet

MX25L6455E MX25L12855E

Part	Datasheet
MX25L12855EXCI-10G	MX25L12855EXCI-10G (pdf)

Related Parts	Information
MX25L12855EMI-10G	MX25L12855EMI-10G
MX25L6455EXCI-10G	MX25L6455EXCI-10G

PDF Datasheet Preview
MX25L6455E MX25L12855E MX25L6455E/MX25L12855E HIGH PERFORMANCE SERIAL FLASH SPECIFICATION P/N PM1467 MX25L6455E MX25L12855E Contents 5 GENERAL 7 Table Additional Features 7 PIN 8 PIN 8 BLOCK 9 DATA 10 Table Protected Area 11 Table 4K-bit Secured OTP 11 Memory 12 Table Memory Organization for 12 Table Memory Organization for 13 DEVICE 14 Figure Serial Modes Supported for Normal Serial 14 Figure Serial Modes Supported for Double Transfer Rate serial read 14 COMMAND 15 Table Command 15 1 Write Enable 17 2 Write Disable 17 3 Read Identification 17 4 Read Status Register 18 5 Write Status Register 19 Protection 19 6 Read Data Bytes 20 7 Read Data Bytes at Higher Speed 20 8 Fast Double Transfer Rate Read 20 9 2 x I/O Read Mode 20 10 2 x I/O Double Transfer Rate Read Mode 21 11 4 x I/O Read Mode 21 12 4 x I/O Double Transfer Rate Read Mode 22 13 Dual Read Mode 22 14 Quad Read Mode 23 15 Sector Erase 23 16 Block Erase 23 17 Block Erase 24 18 Chip Erase 24 19 Page Program 24 20 4 x I/O Page Program 25 Program/Erase Flow 1 with read array 26 Program/Erase Flow 2 without read array 27 21 Continuously program mode CP 28 22 Deep Power-down 29 23 Release from Deep Power-down RDP , Read Electronic Signature 29 24 Read Electronic Manufacturer ID & Device ID REMS , REMS2 , REMS4 , REMS4D ........................ 29 P/N PM1467 MX25L6455E MX25L12855E Table ID Definitions 30 25 Enter Secured OTP 30 26 Exit Secured OTP 30 27 Read Security Register 30 Security Register 31 28 Write Security Register 31 29 Write Protection Selection 32 BP and SRWD if 32 The individual block lock mode is effective after setting 33 WPSEL 34 30 Single Block Lock/Unlock Protection 35 Block Lock 35 Block Unlock 36 31 Read Block Lock Status 37 32 Gang Block Lock/Unlock 37 33 Clear SR Fail Flags 37 34 Enable SO to Output RY/BY# 37 35 Disable SO to Output RY/BY# 37 36 Read SFDP Mode 38 Read Serial Flash Discoverable Parameter RDSFDP 38 Table a-1. Signature and Parameter Identification Data Values for 39 Table b-1. Parameter Table 0 JEDEC Flash Parameter Tables for 40 Table c-1. Parameter Table 1 Macronix Flash Parameter Tables for 42 Table a-2. Signature and Parameter Identification Data Values for 43 Table b-2. Parameter Table 0 JEDEC Flash Parameter Tables for 44 Table c-2. Parameter Table 1 Macronix Flash Parameter Tables for 46 POWER-ON 48 ELECTRICAL 49 ABSOLUTE MAXIMUM 49 Figure Maximum Negative Overshoot 49 CAPACITANCE TA = 25°C, f = 49 Figure Maximum Positive Overshoot 49 Figure OUTPUT 50 Table MX25L6455E DC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 51 Table MX25L12855E DC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 52 Table MX25L6455E AC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 53 Table MX25L12855E AC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 55 Timing 57 Figure Serial Input 57 Figure Output 57 Figure Serial Input Timing for Double Transfer Rate 58 Figure Serial Output Timing for Double Transfer Rate 58 P/N PM1467 MX25L6455E MX25L12855E P/N PM1467 MX25L6455E MX25L12855E 64/128M-BIT [x 1/x 2/x 4] CMOS MXSMIOTM SERIAL MULTI I/O FLASH MEMORY GENERAL • Serial Peripheral Interface compatible -- Mode 0 and Mode 3 • 64Mb 67,108,864 x 1 bit structure or 33,554,432 x 2 bits two I/O mode structure or 16,777,216 x 4 bits four I/ O mode structure 128Mb 134,217,728 x 1 bit structure or 67,108,864 x 2 bits two I/O mode structure or 33,554,432 x 4 bits four I/O mode structure • 4096 Equal Sectors with 4K bytes each - Any Sector can be erased individually • 512 Equal Blocks with 32K bytes each - Any Block can be erased individually • 256 Equal Blocks with 64K bytes each - Any Block can be erased individually • Power Supply Operation - to volt for read, erase, and program operations • Latch-up protected to 100mA from -1V to Vcc +1V PERFORMANCE • High Performance VCC = 2.7~3.6V - Normal read - 50MHz - Fast read Normal Serial Mode - 1 I/O 104MHz with 8 dummy cycles - 2 I/O 70MHz with 4 dummy cycles for 2READ mode or 70MHz with 8 dummy cycles for DREAD mode - 4 I/O 70MHz with 6 dummy cycles for 4READ mode or 70MHz with 8 dummy cycles for QREAD mode - Fast read Double Transfer Rate Mode - 1 I/O 50MHz with 6 dummy cycles - 2 I/O 50MHz with 6 dummy cycles - 4 I/O 50MHz with 8 dummy cycles - Fast program time 1.4ms typ. and 5ms max. /page 256-byte per page - Byte program time 9us typical - Continuously Program mode automatically increase address under word program mode - Fast erase time 60ms typ. /sector 4K-byte per sector 0.7s typ. /block 64K-byte per block 50s typ. /chip for 64Mb, 80s typ. /chip for 128Mb • Low Power Consumption - Low active read current 19mA max. at 104MHz, 15mA max. at 66MHz and 10mA max. at 33MHz - Low active programming current 25mA max. - Low active erase current 25mA max. - Low standby current 100uA max. for 128Mb, 50uA max. for 64Mb - Deep power down current 128Mb is 40uA max. , 64Mb is 20uA max. • Typical 100,000 erase/program cycles P/N PM1467 MX25L6455E MX25L12855E SOFTWARE FEATURES • Input Data Format - 1-byte Command code • Advanced Security Features - BP0-BP3 block group protect - Flexible individual block protect and permanent lock when OTP WPSEL=1 - Read lock - Additional 4K bits secured OTP for unique identifier • Auto Erase and Auto Program Algorithms - Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algorithm that automatically times the program pulse width Any page to be programed should have page in the erased state first. • Status Register Feature • Electronic Identification - JEDEC 1-byte Manufacturer ID and 2-byte Device ID - RES command for 1-byte Device ID - Both REMS,REMS2, REMS4 and REMS4D commands for 1-byte Manufacturer ID and 1-byte Device ID • Support Serial Flash Discoverable Parameters SFDP mode HARDWARE FEATURES • SCLK Input - Serial clock input • SI/SIO0 - Serial Data Input or Serial Data Input/Output for 2 x I/O mode and 4 x I/O mode • SO/SIO1 - Serial Data Output or Serial Data Input/Output for 2 x I/O mode and 4 x I/O mode • WP#/SIO2 - Hardware write protection or serial data Input/Output for 4 x I/O mode • NC/SIO3 - NC pin or serial data Input/Output for 4 x I/O mode • PACKAGE - 16-pin SOP 300mil - 24-ball TFBGA 6x8mm - All devices are RoHS Compliant Please contact Macronix sales for specific information regarding this Advanced Security Features P/N PM1467 MX25L6455E MX25L12855E MX25L6455E is 67,108,864 bits serial Flash memory, which is configured as 8,388,608 x 8 internally. When it is in two or four I/O mode, the structure becomes 33,554,432 bits x 2 or 16,777,216 bits x MX25L12855E is 134,217,728 bits serial Flash memory, which is configured as 16,777,216 x 8 internally. When it is in two or four I/O mode, the structure becomes 67,108,864 bits x 2 or 33,554,432 bits x The MX25L6455E/12855E features a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus. The three bus signals are a clock input SCLK , a serial data input SI , and a serial data output SO . Serial access to the device is enabled by CS# input. MX25L6455E/12855E provides high performance read mode, which may latch address and data on both rising and falling edge of clock. By using this high performance read mode, the data throughput may be doubling. Moreover, the performance may reach direct code execution, the RAM size of the system may be reduced and further saving system cost. MX25L6455E/12855E, MXSMIOTM Serial Multi I/O flash memory, provides sequential read operation on whole chip and multi-I/O features. When it is in dual I/O mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for address/dummy bits input and data output. When it is in quad I/O mode, the SI pin, SO pin, WP# pin and NC pin become SIO0 pin, SIO1 pin, SIO2 pin and SIO3 pin for address/dummy bits input and data Input/Output. After program/erase command is issued, auto program/ erase algorithms which program/ erase and verify the specified page or sector/block locations will be executed. Program command is executed on byte basis, or page 256 bytes basis, or word basis for Continuously Program mode, and erase command is executes on sector 4K-byte , block 32K-byte/64K-byte , or whole chip basis. To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read command can be issued to detect completion status of a program or erase operation via WIP bit. When the device is not in operation and CS# is high, it is put in standby mode and draws less than 100uA DC current. ORDERING INFORMATION PART NO. MX25L6455EMI-10G MX25L6455EXCI-10G MX25L12855EMI-10G MX25L12855EXCI-10G CLOCK MHz TEMPERATURE -40°C~85°C -40°C~85°C -40°C~85°C -40°C~85°C PACKAGE 16-SOP 24-TFBGA 16-SOP 24-TFBGA Remark P/N PM1467 MX25L6455E MX25L12855E PART NAME DESCRIPTION MX 25 L 6455E M I OPTION G RoHS Compliant SPEED 10 104MHz TEMPERATURE RANGE I Industrial -40C to 85C PACKAGE M 300mil 16-SOP XC 24-ball TFBGA 6mmx8mm DENSITY & MODE 6455E 64Mb with advanced security feature 12855E 128Mb with advanced security feature TYPE L 3V DEVICE 25 Serial Flash P/N PM1467 PACKAGE INFORMATION MX25L6455E MX25L12855E P/N PM1467 MX25L6455E MX25L12855E P/N PM1467 MX25L6455E MX25L12855E Removed "Advanced Information" JUN/15/2009 Merge MX25L6455E and MX25L12855E together Add CFI mode content Align waveform format P43,45 Change command table format P15,16 Added "DATA RETENTION" Condition Modified sector erase time from 90ms to 60ms P5,43,45, Modified 128Mb chip erase time max from 512s to 200s P46,63 Change 128Mb 24ball-BGA package size from 10x13mm to 6x8mm P6,8,64, P65,67

PDF Datasheet Preview

MX25L6455E MX25L12855E

MX25L6455E/MX25L12855E

HIGH PERFORMANCE SERIAL FLASH SPECIFICATION

P/N PM1467

MX25L6455E MX25L12855E

Contents
5 GENERAL 7

Table Additional Features 7 PIN 8 PIN 8 BLOCK 9 DATA 10

Table Protected Area 11 Table 4K-bit Secured OTP 11 Memory 12 Table Memory Organization for 12 Table Memory Organization for 13 DEVICE 14 Figure Serial Modes Supported for Normal Serial 14 Figure Serial Modes Supported for Double Transfer Rate serial read 14 COMMAND 15 Table Command 15 1 Write Enable 17 2 Write Disable 17 3 Read Identification 17 4 Read Status Register 18 5 Write Status Register 19 Protection 19 6 Read Data Bytes 20 7 Read Data Bytes at Higher Speed 20 8 Fast Double Transfer Rate Read 20 9 2 x I/O Read Mode 20 10 2 x I/O Double Transfer Rate Read Mode 21 11 4 x I/O Read Mode 21 12 4 x I/O Double Transfer Rate Read Mode 22 13 Dual Read Mode 22 14 Quad Read Mode 23 15 Sector Erase 23 16 Block Erase 23 17 Block Erase 24 18 Chip Erase 24 19 Page Program 24 20 4 x I/O Page Program 25 Program/Erase Flow 1 with read array 26 Program/Erase Flow 2 without read array 27 21 Continuously program mode CP 28 22 Deep Power-down 29 23 Release from Deep Power-down RDP , Read Electronic Signature 29 24 Read Electronic Manufacturer ID & Device ID REMS , REMS2 , REMS4 , REMS4D ........................ 29

P/N PM1467

MX25L6455E MX25L12855E

Table ID Definitions 30 25 Enter Secured OTP 30 26 Exit Secured OTP 30 27 Read Security Register 30 Security Register 31 28 Write Security Register 31 29 Write Protection Selection 32 BP and SRWD if 32 The individual block lock mode is effective after setting 33 WPSEL 34 30 Single Block Lock/Unlock Protection 35 Block Lock 35 Block Unlock 36 31 Read Block Lock Status 37 32 Gang Block Lock/Unlock 37 33 Clear SR Fail Flags 37 34 Enable SO to Output RY/BY# 37 35 Disable SO to Output RY/BY# 37 36 Read SFDP Mode 38 Read Serial Flash Discoverable Parameter RDSFDP 38 Table a-1. Signature and Parameter Identification Data Values for 39 Table b-1. Parameter Table 0 JEDEC Flash Parameter Tables for 40 Table c-1. Parameter Table 1 Macronix Flash Parameter Tables for 42 Table a-2. Signature and Parameter Identification Data Values for 43 Table b-2. Parameter Table 0 JEDEC Flash Parameter Tables for 44 Table c-2. Parameter Table 1 Macronix Flash Parameter Tables for 46 POWER-ON 48 ELECTRICAL 49 ABSOLUTE MAXIMUM 49 Figure Maximum Negative Overshoot 49 CAPACITANCE TA = 25°C, f = 49 Figure Maximum Positive Overshoot 49 Figure OUTPUT 50 Table MX25L6455E DC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 51 Table MX25L12855E DC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 52 Table MX25L6455E AC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 53 Table MX25L12855E AC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 55 Timing 57 Figure Serial Input 57 Figure Output 57 Figure Serial Input Timing for Double Transfer Rate 58 Figure Serial Output Timing for Double Transfer Rate 58

P/N PM1467

MX25L6455E MX25L12855E
P/N PM1467

MX25L6455E MX25L12855E
64/128M-BIT [x 1/x 2/x 4] CMOS MXSMIOTM SERIAL MULTI I/O FLASH MEMORY

GENERAL
• Serial Peripheral Interface compatible -- Mode 0 and Mode 3
• 64Mb 67,108,864 x 1 bit structure or 33,554,432 x 2 bits two I/O mode structure or 16,777,216 x 4 bits four I/

O mode structure 128Mb 134,217,728 x 1 bit structure or 67,108,864 x 2 bits two I/O mode structure or 33,554,432 x 4 bits four I/O mode structure
• 4096 Equal Sectors with 4K bytes each - Any Sector can be erased individually
• 512 Equal Blocks with 32K bytes each - Any Block can be erased individually
• 256 Equal Blocks with 64K bytes each - Any Block can be erased individually
• Power Supply Operation - to volt for read, erase, and program operations
• Latch-up protected to 100mA from -1V to Vcc +1V

PERFORMANCE
• High Performance

VCC = 2.7~3.6V - Normal read - 50MHz - Fast read Normal Serial Mode - 1 I/O 104MHz with 8 dummy cycles - 2 I/O 70MHz with 4 dummy cycles for 2READ mode or 70MHz with 8 dummy cycles for DREAD mode - 4 I/O 70MHz with 6 dummy cycles for 4READ mode or 70MHz with 8 dummy cycles for QREAD mode - Fast read Double Transfer Rate Mode - 1 I/O 50MHz with 6 dummy cycles - 2 I/O 50MHz with 6 dummy cycles - 4 I/O 50MHz with 8 dummy cycles - Fast program time 1.4ms typ. and 5ms max. /page 256-byte per page - Byte program time 9us typical - Continuously Program mode automatically increase address under word program mode - Fast erase time 60ms typ. /sector 4K-byte per sector 0.7s typ. /block 64K-byte per block 50s typ. /chip
for 64Mb, 80s typ. /chip for 128Mb
• Low Power Consumption
- Low active read current 19mA max. at 104MHz, 15mA max. at 66MHz and 10mA max. at 33MHz - Low active programming current 25mA max. - Low active erase current 25mA max. - Low standby current 100uA max. for 128Mb, 50uA max. for 64Mb - Deep power down current 128Mb is 40uA max. , 64Mb is 20uA max.
• Typical 100,000 erase/program cycles

P/N PM1467

MX25L6455E MX25L12855E

SOFTWARE FEATURES
• Input Data Format
- 1-byte Command code
• Advanced Security Features
- BP0-BP3 block group protect - Flexible individual block protect and permanent lock when OTP WPSEL=1 - Read lock - Additional 4K bits secured OTP for unique identifier
• Auto Erase and Auto Program Algorithms
- Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algorithm that automatically times the
program pulse width Any page to be programed should have page in the erased state first.
• Status Register Feature
• Electronic Identification
- JEDEC 1-byte Manufacturer ID and 2-byte Device ID
- RES command for 1-byte Device ID - Both REMS,REMS2, REMS4 and REMS4D commands for 1-byte Manufacturer ID and 1-byte Device ID
• Support Serial Flash Discoverable Parameters SFDP mode

HARDWARE FEATURES
• SCLK Input
- Serial clock input
• SI/SIO0
- Serial Data Input or Serial Data Input/Output for 2 x I/O mode and 4 x I/O mode
• SO/SIO1
- Serial Data Output or Serial Data Input/Output for 2 x I/O mode and 4 x I/O mode
• WP#/SIO2
- Hardware write protection or serial data Input/Output for 4 x I/O mode
• NC/SIO3
- NC pin or serial data Input/Output for 4 x I/O mode
• PACKAGE
- 16-pin SOP 300mil - 24-ball TFBGA 6x8mm
- All devices are RoHS Compliant

Please contact Macronix sales for specific information regarding this Advanced Security Features

P/N PM1467

MX25L6455E MX25L12855E

MX25L6455E is 67,108,864 bits serial Flash memory, which is configured as 8,388,608 x 8 internally. When it is in two or four I/O mode, the structure becomes 33,554,432 bits x 2 or 16,777,216 bits x MX25L12855E is 134,217,728 bits serial Flash memory, which is configured as 16,777,216 x 8 internally. When it is in two or four I/O mode, the structure becomes 67,108,864 bits x 2 or 33,554,432 bits x The MX25L6455E/12855E features a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus. The three bus signals are a clock input SCLK , a serial data input SI , and a serial data output SO . Serial access to the device is enabled by CS# input.

MX25L6455E/12855E provides high performance read mode, which may latch address and data on both rising and falling edge of clock. By using this high performance read mode, the data throughput may be doubling. Moreover, the performance may reach direct code execution, the RAM size of the system may be reduced and further saving system cost.

MX25L6455E/12855E, MXSMIOTM Serial Multi I/O flash memory, provides sequential read operation on whole chip and multi-I/O features.

When it is in dual I/O mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for address/dummy bits input and data output. When it is in quad I/O mode, the SI pin, SO pin, WP# pin and NC pin become SIO0 pin, SIO1 pin, SIO2 pin and SIO3 pin for address/dummy bits input and data Input/Output.

After program/erase command is issued, auto program/ erase algorithms which program/ erase and verify the specified page or sector/block locations will be executed. Program command is executed on byte basis, or page 256 bytes basis, or word basis for Continuously Program mode, and erase command is executes on sector 4K-byte , block 32K-byte/64K-byte , or whole chip basis.

To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read command can be issued to detect completion status of a program or erase operation via WIP bit.

When the device is not in operation and CS# is high, it is put in standby mode and draws less than 100uA DC current.
ORDERING INFORMATION PART NO.

MX25L6455EMI-10G MX25L6455EXCI-10G MX25L12855EMI-10G MX25L12855EXCI-10G

CLOCK MHz

TEMPERATURE -40°C~85°C -40°C~85°C -40°C~85°C -40°C~85°C

PACKAGE 16-SOP
24-TFBGA 16-SOP
24-TFBGA

Remark

P/N PM1467

MX25L6455E MX25L12855E

PART NAME DESCRIPTION

MX 25 L 6455E M I

OPTION G RoHS Compliant

SPEED 10 104MHz

TEMPERATURE RANGE I Industrial -40C to 85C

PACKAGE M 300mil 16-SOP XC 24-ball TFBGA 6mmx8mm

DENSITY & MODE 6455E 64Mb with advanced security feature 12855E 128Mb with advanced security feature

TYPE L 3V

DEVICE 25 Serial Flash

P/N PM1467

PACKAGE INFORMATION

MX25L6455E MX25L12855E

P/N PM1467

MX25L6455E MX25L12855E

P/N PM1467

MX25L6455E MX25L12855E

Removed "Advanced Information"

JUN/15/2009

Merge MX25L6455E and MX25L12855E together

Add CFI mode content

Align waveform format

P43,45

Change command table format

P15,16

Added "DATA RETENTION" Condition

Modified sector erase time from 90ms to 60ms

P5,43,45,

Modified 128Mb chip erase time max from 512s to 200s

P46,63

Change 128Mb 24ball-BGA package size from 10x13mm to 6x8mm P6,8,64,

P65,67

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived MX25L12855EXCI-10G Datasheet file may be downloaded here without warranties.

Datasheet ID: MX25L12855EXCI-10G 646938