MMI302

MMI302 Datasheet

Passive Components MMI 300 Series

Part	Datasheet
MMI302	MMI302 (pdf)

Related Parts	Information
MMI304	MMI304
MMI303	MMI303
MMI301	MMI301

PDF Datasheet Preview
Passive Components Passive Components MMI 300 Series Spiral Inductors Description The MicroMetrics MMI 300 series of Spiral Inductors are formed by photolithography and plating techniques on quartz substrates. They eliminate the need for hand forming and ”staking“ of coil in hybrid circuits. They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding. Applications The Spiral Inductors are ideally suited for bias injection into oscillators, amplifiers and microwave switches bias tees . They can also be used to bias tuning varactors, PIN diodes, transistors and monolithic circuits. EQUIVALENT CIRCUIT Features • No Need for ”Staking“ Coil • Passivated Protective Coating Over Coil • Dimensional Uniformity • Planar Solid Structure Coil Packaging • Chip Chip Outline INSIDE DIAMETER, di = ± GOLD BONDING PADS x C Dimensions in Inches DIM “A” MAX DIMENSIONS INCHES DIM “B” DIM “C” MMI301 MMI302 MMI303 MMI304 MicroMetrics, Inc. 136 Harvey Road, Building C, Londonderry, NH 03053 Voice 603-641-3800, Fax 603-641-3500, Internet E-mail: Passive Components Passive Components MMI 300 Series Electrical Characteristics # of Turns Inductance Ls nH MIN/TYP/MAX Series Resistance,Rs DC 1GHz At Ft MIN/MAX Test Frequency,Ft GHz Resonant Frequency,Fr GHz 51/2 12/15/18 25/30 71/2 24/30/36 26/30 91/2 42/50/58

PDF Datasheet Preview

Passive Components

Passive Components MMI 300 Series

Spiral Inductors

Description The MicroMetrics MMI 300 series of Spiral Inductors are formed by photolithography and plating techniques on quartz substrates. They eliminate the need for hand forming and ”staking“ of coil in hybrid circuits.

They provide uniformity, durability and repeatability in circuit fabrication.

The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.

Applications The Spiral Inductors are ideally suited for bias injection into oscillators, amplifiers and microwave switches bias tees . They can also be used to bias tuning varactors, PIN diodes, transistors and monolithic circuits.

EQUIVALENT CIRCUIT

Features
• No Need for ”Staking“ Coil
• Passivated Protective Coating Over Coil
• Dimensional Uniformity
• Planar Solid Structure Coil Packaging
• Chip

Chip Outline

INSIDE DIAMETER, di = ±

GOLD BONDING PADS x

C Dimensions in Inches

DIM “A” MAX

DIMENSIONS INCHES

DIM “B” DIM “C”

MMI301

MMI302

MMI303

MMI304

MicroMetrics, Inc. 136 Harvey Road, Building C, Londonderry, NH 03053 Voice 603-641-3800, Fax 603-641-3500, Internet E-mail:

Passive Components

Passive Components MMI 300 Series Electrical Characteristics
# of Turns

Inductance

Ls nH MIN/TYP/MAX

Series

Resistance,Rs DC 1GHz

At Ft MIN/MAX

Test

Frequency,Ft GHz

Resonant

Frequency,Fr GHz
51/2
12/15/18
25/30
71/2
24/30/36
26/30
91/2
42/50/58

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived MMI302 Datasheet file may be downloaded here without warranties.

Datasheet ID: MMI302 646903