ICE40LP640-CM49
ICE40LP640-CM49 Datasheet
iCE40 LP Series Ultra Low-Power mobileFPGA Family
| Part | Datasheet |
|---|---|
ICE40LP640-CM49 |
ICE40LP640-CM49 (pdf) |
| Related Parts | Information |
|---|---|
ICE40LP640-CM36 |
ICE40LP640-CM36 |
ICE40LP640-CM81 |
ICE40LP640-CM81 |
| PDF Datasheet Preview |
|---|
| iCE40 LP Series Ultra Low-Power mobileFPGA Family March 30, 2012 Data Sheet LP-Series - Smartphone targeted series optimized for low power Ultra-small footprints Figure 1 iCE40 LP-Series Family Architectural Features Programmable 35 µA at f =0 kHz Typical Logic Block PLB 30% faster than iCE65 Smartphone convergence HD video image I/O Bank 0 8 Logic Cells = Programmable Logic Block Proven, high-volume 40 nm, low-power CMOS technology Programmable Interconnect I/O Bank 1 Programmable Interconnect 4Kbit RAM 4Kbit RAM Programmable Interconnect Integrated Phase-Locked Loop PLL I/O Bank 3 Clock multiplication/division for display, SerDes and memory interface applications Up to 533 MHz PLL Output Reprogrammable from a variety of methods and sources JTAG Flexible programmable logic and programmable interconnect fabric 8K look-up tables LUT4 and flip-flops NVCM Low-power logic and interconnect Complete iCEcube2 development system and support VHDL and Verilog logic synthesis Place and route software Design and IP core libraries I/O Bank 2 SPI Config Phase-Locked Carry logic Loop Four-input Nonvolatile Configuration Memory NVCM Look-Up Table LUT4 Ordering Information Figure 2 describes the iCE40LP ordering codes for all packaged components. See the separate DiePlus data sheets when ordering die-based products. See the separate iCE40 Pinout Excel files for package and pinout specifications. Figure 2 iCE40P Ordering Codes packaged, non-die components iCE40LP 8K - CM 225 Low Power Series Logic Cells 640, 1K, 4K, 8K Package Leads Package Style CM = chip-scale ball grid mm pitch QN = quad flat no-lead mm pitch iCE40LP8K-CM225 225-ball Chip-Scale BGA Package 7x7 mm footprint, mm pitch Lattice Semiconductor Corporation 30-MAR-2012 2 iCE40 LP Series Ultra-Low Power mobileFPGA Family Electrical Characteristics All parameter limits are specified under worst-case supply voltage, junction temperature, and processing conditions. Absolute Maximum Ratings Stresses beyond those listed under Table 2 may cause permanent damage to the device. These are stress ratings only functional operation of the device at these or any other conditions beyond those listed under the Recommended Operating Conditions is not implied. Exposure to absolute maximum conditions for extended periods of time adversely affects device reliability. VCC VPP_2V5 VPP_FAST VCCIO_0 VCCIO_1 VCCIO_2 VCCIO_3 SPI_VCC VIN_0 VIN_1 VIN_2 VIN_SPI VIN_3 VCCPLL IOUT TJ TSTG Table 2 Absolute Maximum Ratings Minimum Core supply Voltage VPP_2V5 NVCM programming and operating supply Optional fast NVCM programming supply I/O bank supply voltage I/O Banks 0, 1, 2 and 3 plus SPI interface Maximum Voltage applied to PIO pin within a specific I/O bank I/O Banks 0, 1, 2 and 3 plus SPI interface Analog voltage supply to the Phase Locked Loop PLL DC output current per pin Junction temperature Storage temperature, no bias Units V mA °C °C Recommended Operating Conditions Table 3 Recommended Operating Conditions VCC VPP_2V51 VPP_FAST2 SPI_VCC VCCIO_0 VCCIO_1 VCCIO_2 VCCIO_3 SPI_VCC VCCPLL3 TA TPROG Core supply voltage High Performance, low-power VPP_2V5 NVCM Release from Power-on Reset programming and operating Configure from NVCM supply NVCM programming Optional fast NVCM programming supply |
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