AAAF5060BRGS-11

AAAF5060BRGS-11 Datasheet

Part Number AAAF5060BRGS-11 Blue Hyper Red Green

Part	Datasheet
AAAF5060BRGS-11	AAAF5060BRGS-11 (pdf)

PDF Datasheet Preview
ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES z Chips can be controlled separately. z Suitable for all SMT assembly and solder process. z Available on tape and reel. z Package 500pcs / reel. z Moisture sensitivity level z RoHS compliant. Package Dimensions 5.0mm x 6.0mm SURFACE MOUNT LED LAMP Part Number AAAF5060BRGS-11 Blue Hyper Red Green The Blue source color devices are made with InGaN on Sapphire Light Emitting Diode. The Hyper Red source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode. The Green source color devices are made with InGaN on Sapphire Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. GREEN RED BLUE Notes All dimensions are in millimeters inches . Tolerance is unless otherwise noted. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO DSAM7780 APPROVED WYNEC DATE DEC/04/2012 DRAWN C.H.HAN PAGE 1 OF 8 ERP 1201008311 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Handle the component along the side surfaces by using forceps or appropriate tools. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. All design applications should refer to Kingbright application notes available at SPEC NO DSAM7780 APPROVED WYNEC DATE DEC/04/2012 DRAWN C.H.HAN PAGE 2 OF 8 ERP 1201008311 Selection Guide Dice Lens Type Iv mcd [2] 30mA Min. Typ. Blue InGaN AAAF5060BRGS-11 Hyper Red AlGaInP Water Clear Green InGaN Notes is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. Luminous intensity/ luminous Flux Luminous intensity value is traceable to the CIE127-2007 compliant national standards. Viewing Angle [1] 100° Electrical / Optical Characteristics at TA=25°C Parameter Device Typ.

PDF Datasheet Preview

ATTENTION

OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES
z Chips can be controlled separately. z Suitable for all SMT assembly and solder process. z Available on tape and reel. z Package 500pcs / reel. z Moisture sensitivity level z RoHS compliant.

Package Dimensions
5.0mm x 6.0mm SURFACE MOUNT LED LAMP

Part Number AAAF5060BRGS-11 Blue Hyper Red Green

The Blue source color devices are made with InGaN on Sapphire Light Emitting Diode. The Hyper Red source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode. The Green source color devices are made with InGaN on Sapphire Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded.

GREEN RED BLUE

Notes All dimensions are in millimeters inches . Tolerance is unless otherwise noted. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. The device has a single mounting surface. The device must be mounted according to the specifications.

SPEC NO DSAM7780 APPROVED WYNEC

DATE DEC/04/2012 DRAWN C.H.HAN

PAGE 1 OF 8 ERP 1201008311

Handling Precautions

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Handle the component along the side surfaces by using forceps or appropriate tools.

Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry.

The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.

As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.

All design applications should refer to Kingbright application notes available at

SPEC NO DSAM7780 APPROVED WYNEC

DATE DEC/04/2012 DRAWN C.H.HAN

PAGE 2 OF 8 ERP 1201008311

Selection Guide

Dice

Lens Type

Iv mcd [2] 30mA

Min.

Typ.

Blue InGaN

AAAF5060BRGS-11

Hyper Red AlGaInP

Water Clear

Green InGaN

Notes is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. Luminous intensity/ luminous Flux Luminous intensity value is traceable to the CIE127-2007 compliant national standards.

Viewing Angle [1]
100°

Electrical / Optical Characteristics at TA=25°C

Parameter

Device

Typ.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived AAAF5060BRGS-11 Datasheet file may be downloaded here without warranties.

Datasheet ID: AAAF5060BRGS-11 644851