53-0000-0041
53-0000-0041 Datasheet
Kester Part # 53-0000-0041
| Part | Datasheet |
|---|---|
53-0000-0041 |
53-0000-0041 (pdf) |
| Related Parts | Information |
|---|---|
7001020511 |
7001020511 |
7001020510 |
7001020510 |
| PDF Datasheet Preview |
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| 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents Products Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information Pages 3-7 8-11 12-13 14-15 16 17 18 19 2 | 800 253 7837 | Coming Soon NXG3 & NXG5 Zero Halogen Solder Pastes Formula NXG3 Application Alloy Product Characteristics Residue Characteristics Typical Metal Percentage and mesh size Compliant Specifications Suggested Packaging Style No-Clean Stencil Printing Sn96.5Ag3.0Cu0.5 Zero halogen, lead-free, no-clean solder paste. NXG3 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Designed to be reflowable in air as well as nitrogen. Light colored -325/+500 Type 3 IPC/J-STD-004B Flux Designator ROL0 500g jar or 600g cartridges Formula NXG5 Application Alloy Product Characteristics Residue Characteristics Typical Metal Percentage and mesh size Compliant Specifications Suggested Packaging Style No-Clean Stencil Printing Sn96.5Ag3.0Cu0.5 Zero halogen, lead-free, no-clean solder paste. NXG5 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Prints down to 01005 pad sites for nitrogen reflow. Larger pad sizes reflowable in air as well as nitrogen. ICT-friendly Light colored -400/+500 Type 4 IPC/J-STD-004B Flux Designator ROL0 500g jar or 600g cartridges | 800 253 7837 | 3 see Page 4 for details Formula NXG3 NXG33 ApplicationKester Lead-Free, Halogen-Free Alloy No-Clean Stencil Printing Sn96.5Ag3.0Cu0.5 No-Clean Stencil Printing Sn96.5Ag3.0Cu0.5 Product Characteristics Residue Characteristics Typical Metal Percentage and mesh size Compliant Specifications Suggested Packaging Style Zero halogen, leaFd-ofrreme, unola-clean solder paste. NXG3 Nis XenGgin3e3ered for Designed to exceed customers' expectations for high yield le manufacturing. NXG33 is engineered for the high thermal de the high thermal demands of assembling with lead-free alloys. Joints are of assembling with lead-free alloys. Joints are cosmetically b cosmetically brighAt papsliScnaPtibonjoints. Prints down to 01005 pad sites. 01005 pad sites. Designed to be Designed to be reAfllolowyable in air as well as nitrogen. Post soldering, the NXG33 off mized defects, including head-in-pillow and QFN/BGA voidin |
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