IRLML6402
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IRLML6402TR (pdf) |
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l Ultra Low On-Resistance l P-Channel MOSFET l SOT-23 Footprint l Low Profile <1.1mm l Available in Tape and Reel l Fast Switching These P-Channel MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in battery and load management. A thermally enhanced large pad leadframe has been incorporated into the standard SOT-23 package to produce a HEXFET Power MOSFET with the industry's smallest footprint. This package, dubbed the Micro3 , is ideal for applications where printed circuit board space is at a premium. The low profile <1.1mm of the Micro3 allows it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards. The thermal resistance and power dissipation are the best available. Absolute Maximum Ratings VDS ID TA = 25°C ID TA= 70°C IDM PD = 25°C PD = 70°C EAS VGS TJ, TSTG Parameter Drain- Source Voltage Continuous Drain Current, VGS -4.5V Continuous Drain Current, VGS -4.5V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Single Pulse Avalanche Energy- Gate-to-Source Voltage Junction and Storage Temperature Range PD - 93755D IRLML6402 Power MOSFET VDSS = -20V RDS on = Micro3 Max. -20 -22 11 ± 12 -55 to + 150 Units V W/°C mJ V °C Thermal Resistance Parameter Maximum Junction-to-Ambient Typ. 75 Max. 100 Units °C/W 12/14/11 IRLML6402 Electrical Characteristics TJ = 25°C unless otherwise specified Parameter V BR DSS Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient RDS on Static Drain-to-Source On-Resistance VGS th gfs Gate Threshold Voltage Forward Transconductance IDSS Drain-to-Source Leakage Current IGSS Qg Qgs Qgd td on tr td off tf Ciss Coss Crss Min. Typ. Max. -20 -25 -100 12 350 48 588 381 633 145 110 |
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