BSP324L6327HTSA1

BSP324L6327HTSA1 Datasheet


BSP324

Part Datasheet
BSP324L6327HTSA1 BSP324L6327HTSA1 BSP324L6327HTSA1 (pdf)
Related Parts Information
BSP324 E6327 BSP324 E6327 BSP324 E6327
PDF Datasheet Preview
Power-Transistor

Feature
• N-Channel
• Enhancement mode
• Logic Level
• dv/dt rated
• Pb-free lead plating RoHS compliant x Qualified according to AEC Q101

BSP324

Product Summary
400 V

RDS on

SOT-223

Type BSP324

Package PG-SOT223

Pb-free Packaging Tape and Reel Information Marking

Yes Non dry

L6327 1000 pcs/reel

BSP324

Maximum Ratings, at Tj = 25 °C, unless otherwise specified

Parameter

Continuous drain current

TA=25°C

TA=70°C

Pulsed drain current

TA=25°C

ID puls
dv/dt

IS=0.17A, VDS=320V, di/dt=200A/µs, Tjmax=175°C

Gate source voltage ESD Class JESD22-A114-HBM

Power dissipation

TA=25°C

Operating and storage temperature IEC climatic category DIN IEC 68-1

Ptot Tj , Tstg

Value

Unit
kV/µs
±20
1A >250V, <500V
+150
55/150/56
2009-08-18

BSP324

Thermal Characteristics Parameter

Characteristics Thermal resistance, junction - soldering point Pin 4 SMD version, device on PCB:
min. footprint 6 cm2 cooling area 1

Values
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Datasheet ID: BSP324L6327HTSA1 637840