BSP324 E6327
BSP324 E6327 Datasheet
BSP324
| Part | Datasheet |
|---|---|
BSP324 E6327 |
BSP324 E6327 (pdf) |
| Related Parts | Information |
|---|---|
|
BSP324L6327HTSA1 |
BSP324L6327HTSA1 |
| PDF Datasheet Preview |
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| Power-Transistor Feature • N-Channel • Enhancement mode • Logic Level • dv/dt rated • Pb-free lead plating RoHS compliant x Qualified according to AEC Q101 BSP324 Product Summary 400 V RDS on SOT-223 Type BSP324 Package PG-SOT223 Pb-free Packaging Tape and Reel Information Marking Yes Non dry L6327 1000 pcs/reel BSP324 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Continuous drain current TA=25°C TA=70°C Pulsed drain current TA=25°C ID puls dv/dt IS=0.17A, VDS=320V, di/dt=200A/µs, Tjmax=175°C Gate source voltage ESD Class JESD22-A114-HBM Power dissipation TA=25°C Operating and storage temperature IEC climatic category DIN IEC 68-1 Ptot Tj , Tstg Value Unit kV/µs ±20 1A >250V, <500V +150 55/150/56 2009-08-18 BSP324 Thermal Characteristics Parameter Characteristics Thermal resistance, junction - soldering point Pin 4 SMD version, device on PCB: min. footprint 6 cm2 cooling area 1 Values |
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