BGF117
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BGF117E6328XTSA1 (pdf) |
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Data Sheet, V2.0, January 2010 BGF117 High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter RF & Protection Devices Edition 2010-01-15 Published by Infineon Technologies AG 81726 München, Germany Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics “Beschaffenheitsgarantie” . With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF117 Previous Version:2009-09-28, V1.2 Target status removed BGF117 Data Sheet V2.0, 2010-01-15 BGF117 High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter Features • Bidirectional ESD protection and EMI filter for High-Speed Mini-/Micro-SD card interface • ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on all external IOs • ESD protection according to IEC61000-4-2 for ±2 kV contact discharge on all internal IOs • Very good EMI filtering and very low cross talk due to small package parasitics • Suitable for high speed applications due to low line capacitance of typical 8 pF • Very low voltage dependency of line capacitance • Very low leakage currents • Integrated pull up resistors to enable proper line biasing • Application requires very low PCB area using an optimized I/O arrangement • 400 µm solder ball pitch • RoHS and WEEE compliant package • Complies with following standards: SD Card Specification V2.0, MicroSD Card Specification V1.0 WLP-16-4-N Int. IOs B1 clk C1 cmd A1 dat0 A2 dat1 D2 dat2 D1 dat3/CD R7, R8, R9, R10, R11, R1, R2, R3, R4, R5, R6, Ext. IOs SDclk SDcmd SDdat 0 SDdat 1 SDdat 2 SDdat3/CD D4 HOST CARD Figure 1 Schematic |
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