B57311V2221H60

B57311V2221H60 Datasheet


B573**V2 December 2016

Part Datasheet
B57311V2221H60 B57311V2221H60 B57311V2221H60 (pdf)
Related Parts Information
B57311V2331H60 B57311V2331H60 B57311V2331H60
B57311V2151H60 B57311V2151H60 B57311V2151H60
PDF Datasheet Preview
NTC thermistors for temperature measurement

SMD NTC thermistors, case size 0603 1608 , standard series

Series/Type Date:

B573**V2 December 2016

EPCOS AG Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

Temperature measurement and compensation SMD NTC thermistors, case size 0603 1608

B573**V2 Standard series

Applications Temperature measurement and compensation

Features Multilayer SMD NTC with inner electrodes Nickel barrier termination Excellent long-term aging stability in high temperature environment Short response time UL approval E69802

Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request.

Delivery mode Cardboard tape, 180-mm reel standard 330-mm reel on request

Dimensional drawing

Dimensions in mm Approx. weight 6 mg

General technical data

Operating temperature range Max. power Resistance tolerance Rated temperature Dissipation factor Thermal cooling time constant Heat capacity
at 25 °C, on PCB
on PCB on PCB

Top P251 TR Cth1
125 180 ±1, ±3, ±5 25 approx. 3 approx. 4 approx. 12
°C mW % °C mW/K s mJ/K
1 Depends on mounting situation

Please read Cautions and warnings and Important notes at the end of this document.

Page 2 of 21

Temperature measurement and compensation SMD NTC thermistors, case size 0603 1608

B573**V2 Standard series
Electrical specification and ordering codes
k 10 k 10 k 10 k 10 k 22 k 22 k 47 k 47 k 47 k 47 k 68 k 100 k 100 k 100 k 100 k 470 k
±3, ±5 ±3, ±5 ±3, ±5 ±3, ±5 ±1, ±3, ±5 ±3, ±5 ±3, ±5 ±3, ±5 ±3, ±5 ±3, ±5 ±3, ±5 ±1, ±3, ±5 ±3, ±5 ±3, ±5 ±3, ±5 ±1, ±3, ±5 ±3, ±5 ±1, ±3, ±5 ±3, ±5 ±3, ±5

No. of R/T characteristic
8502 8500 8507 8509 8500 8502 8507 8502 8507 8502 8551 8507 8512 8552 8507

B25/50 K
3940 3590 4386 3380 3590 3940 4386 3940 4386 3940 4050 4386 4200 4250 4386
+ = Resistance tolerance

F = ±1% H = ±3% J = ±5%

B25/85 K
3980 3635 4455 3435 3635 3980 4455 3980 4455 3980 4108 4455 4260 4311 4455

B25/100
4000 ±3% 4000 ±3% 3650 ±3% 4480 ±3% 3455 ±1% 3650 ±3% 4000 ±3% 4480 ±3% 4000 ±3% 4480 ±3% 4000 ±3% 4131 ±2% 4480 ±3% 4480 ±3% 4282 ±1% 4334 ±2% 4480 ±1% 4480 ±3% 4480 ±3%
Ordering code

B57321V2102+060 B57321V2222+060 B57301V2472+060 B57371V2682+060 B57330V2103+260 B57301V2103+060 B57321V2103+060 B57371V2103+060 B57321V2223+060 B57371V2223+060 B57321V2473+060 B57357V2473+560 B57358V2473+560 B57371V2473+060 B57371V2683+060 B57350V2104+460 B57358V2104+360 B57374V2104+060 B57371V2104+060 B57371V2474+060

Please read Cautions and warnings and Important notes at the end of this document.

Page 3 of 21

Temperature measurement and compensation SMD NTC thermistors, case size 0603 1608

B573**V2 Standard series

Reliability data

SMD NTC thermistors are tested in accordance with IEC The parts are mounted on a standardized PCB in accordance with IEC

Test Storage in dry heat

Storage in damp heat, steady state

Rapid temperature cycling Endurance

Solderability

Resistance drift after soldering

Standard Test conditions

IEC 60068-2-2 JIS C 0021

IEC 60068-2-78 JIS C 0022

IEC 60068-2-14 JIS C 0025

Storage at upper category temperature T 125 ±2 °C t 1000 h

Temperature of air 40 ±2 °C Relative humidity of air 93 Duration 56 days

Lower test temperature °C Upper test temperature 125 °C Number of cycles 100

Pmax 180 mW T 65 ±2 °C t 1000 h

Solderability:
60068-2-58 215 ±3 °C, 3 s

JIS C 0054 245 ±5 °C, 3 s

Resistance to soldering heat 260 ±5 °C, 10 ±1 s Reflow soldering profile Wave soldering profile
typical < 2% < 2% < 2% < 2%

Remarks
95% of terminations wetted

Please read Cautions and warnings and Important notes at the end of this document.

Page 4 of 21

Temperature measurement and compensation SMD NTC thermistors, case size 0603 1608

B573**V2 Standard series

R/T characteristics

R/T No.

T °C
8500
8502
8507

B25/100 = 3650 K

B25/100 = 4000 K

B25/100 = 4480 K
The last two digits of the complete ordering code state the packing mode:

Last two digits 60 62 70 72

Cardboard tape Blister tape Cardboard tape Blister tape
180-mm reel packing 180-mm reel packing 330-mm reel packing 330-mm reel packing

Please read Cautions and warnings and Important notes at the end of this document.

Page 9 of 21

Temperature measurement and compensation SMD NTC thermistors, case size 0603 1608

B573**V2 Standard series

Mounting instructions

Soldering

SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommended as well as a proper cleaning of the PCB.

The nickel barrier layer of the silver/nickel/tin termination see figure 1 prevents leaching of the silver base metalization layer. This allows great flexibility in the selection of soldering parameters.

The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is suitable for all commonly-used soldering methods. Note SMD NTCs with AgPd termination are not approved for lead-free soldering.

Figure 1 SMD NTC thermistors, structure of nickel barrier termination

Please read Cautions and warnings and Important notes at the end of this document.

Page 10 of 21

Temperature measurement and compensation SMD NTC thermistors, case size 0603 1608

B573**V2 Standard series

Wave soldering Temperature characteristic at component terminal with dual wave soldering

Solder joint profiles for silver/nickel/tin terminations

Please read Cautions and warnings and Important notes at the end of this document.

Page 11 of 21

Temperature measurement and compensation SMD NTC thermistors, case size 0603 1608

B573**V2 Standard series

Reflow soldering Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D

Profile feature

Preheat and soak
- Temperature min

Tsmin
- Temperature max

Tsmax
- Time
tsmin to tsmax

Average ramp-up rate

TL to Tp

Liquidous temperature

Time at liquidous

Peak package body temperature Tp1

Time tP 3 within 5 °C of specified classification temperature Tc

Average ramp-down rate

Tp to TL
To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummern-
codes, type designations etc.
code oder für die Typenbezeichnung.

To be replaced by a letter.

Platzhalter für einen Buchstaben.

All dimensions are given in mm.

Alle Maße sind in mm angegeben.

The commas used in numerical values Verwendete Kommas in Zahlenwerten
denote decimal points.
bezeichnen Dezimalpunkte.

Please read Cautions and warnings and Important notes at the end of this document.

Page 19 of 21

Important notes

The following applies to all products named in this publication Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health e.g. in accident prevention or lifesaving systems , it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer e.g. installation of protective circuitry or redundancy that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. The warnings, cautions and product-specific notes must be observed. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions e.g. because they are classed as hazardous . Useful information on this will be found in our Material Data Sheets on the Internet Should you have any more detailed questions, please contact our sales offices. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association ZVEI .

Page 20 of 21

Important notes The trade names EPCOS, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP, CTVS,

DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at

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Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived B57311V2221H60 Datasheet file may be downloaded here without warranties.

Datasheet ID: B57311V2221H60 511499