CYW4319XKUBGT

CYW4319XKUBGT Datasheet

Part	Datasheet
CYW4319XKUBGT	CYW4319XKUBGT (pdf)

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Not Recommended for New Designs The following document contains information on Cypress products. Although the document is marked with the name “Broadcom”, the company that originally developed the specification, Cypress will continue to offer these products to new and existing customers. CONTINUITY OF ORDERING PART NUMBERS Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed in this document. FOR MORE INFORMATION Please visit our website at or contact your local sales office for additional information about Cypress products and services. OUR CUSTOMERS Cypress is for true innovators in companies both large and small. ABOUT CYPRESS Founded in 1982, Cypress is the leader in advanced embedded system solutions for the world’s most innovative automotive, industrial, home automation and appliances, consumer electronics and medical products. Cypress’s programmable systems-onchip, general-purpose microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance memories help engineers design differentiated products and get them to market first. Cypress is committed to providing customers with the best support and engineering resources on the planet enabling innovators and out-of-the-box thinkers to disrupt markets and create new product categories in record time. To learn more, go to • San Jose, CA 95134-1709 • 408-943-2600 Not Recommended for New Designs Preliminary Data Sheet BCM4319 Single-Chip IEEE a/b/g/n MAC/Baseband/ Radio with Integrated SDIO and USB Interfaces The Broadcom BCM4319 single-chip device provides the highest level of integration for Wi-Fi enabled SDIO and USB-based wireless systems. Featuring an IEEE a/b/g/n MAC/baseband/radio with integrated CMOS, Power Amplifiers PAs and a power management unit PMU the BCM4319 provides a compact, ultrasmall form factor solution with few required external components. This enables highvolume costs to be driven down and allows flexibility in the size, form, and function of handheld devices. The BCM4319 supports SDIO 4-bit, 1-bit, and Serial Peripheral Interface SPI modes , generic SPI gSPI , USB device , and local coexistence host interfaces. Using advanced design techniques and process technology to deliver the lowest active and idle power, the BCM4319 extends system battery life in mobile systems, while maintaining consistent connectivity and high performance. Integrated CMOS WLAN GHz and 5 GHz power amplifiers provide sufficient output power to meet the needs of most WLAN devices. An optional external PA and Low-Noise Amplifier LNA are also supported. In addition, the BCM4319 includes integrated transmit and receive baluns for both the GHz and 5 GHz RF paths, further reducing the overall solution cost. To simplify the system power topology and to enable operation directly from the battery of a mobile platform, the BCM4319 includes one switching regulator buck mode , five linear low dropout LDO voltage regulators, and an advanced PMU. A variable input voltage range of is supported. The integrated buck regulator enables the internal power amplifiers to operate at optimal performance, even at low VBAT supply voltages. • USB dongles • Printers • Media players • Cellular and mobile phones • Gaming systems • Cameras • All types of battery powered devices • Integrated designs with Bluetooth and GPS Figure 1 BCM4319 System Block Diagram VDDIO VBAT WLAN Host I/F WL_REG_ON SDIO 5 GHz WLAN Tx 5 GHz WLAN Rx Switch TCXO USB UART BCM4319 Reference frequency GHz WLAN Tx Switch GHz WLAN Rx 5300 California Avenue • Irvine, CA 92617 • Phone 949-926-5000 • Fax 949-926-5203 4319CT-DSXX3-RI April 2, 2014 Not Recommended for New Designs IEEE 802.11x Key Features • Dual band GHz and 5 GHz a/b/g/n. • Single stream 802.11n support for both 20 MHz and 40 MHz channels provides PHY layer rates up to MCS7 150 Mbps for typical upper layer throughput in excess of 70 Mbps. • Integrated CMOS power amplifiers deliver greater than 20 dBm of linear output power • Integrated Cortex-M3 processor and onchip memory for complete WLAN subsystem functionality minimizing the need to wake up the applications processor for standard WLAN functions. This allows for further minimization of power consumption, while maintaining the capability to field upgrade with future features. • Provides for the following security features • WPA and WPA2 Personal support for powerful encryption and authentication • Table 32 “Ordering Information,” on page 82 Updated • Table 32 on page 88 • Converted to latest format template Updated • VBAT range, global update from to • “General Description” on Page • Figure 1, ”BCM4319 System Block Diagram,” on page i • “Mobile Phone Usage Model” on page 2 • Figure 3, ”Mobile Phone System Diagram,” on page 2 • “Power Management” on page 3 • “Voltage Regulators” on page 3 • “Power Supply Topology” on page 4 • Figure 4, ”Power Topology Example,” on page 5 • “Low-Power Shutdown” on page 6 • Table 1, ”Crystal Oscillator and External Frequency Reference Specifications,” on page 7 • “Frequency Selection” on page 9 • “General-Purpose Input/Output Interface” on page 10 • “SDIO V2.0” on page 13 • Figure 8, ”Host Interface,” on page 14 • Figure 14, ”WLAN MAC Architecture,” on page 22 • Table 4, mm x mm 138-Ball WLBGA,” on page 29 • Table 6, ”138-Ball WLBGA Signal Descriptions,” on page 34 • “Strapping Options and GPIO Functions” on page 41 • Table 8, ”Strapping Options,” on page 42 • Table 9, ”Environmental Characteristics,” on page 43 • Table 10, ”Absolute Maximum Ratings,” on page 43 • Table 11, ”Recommended Operating Conditions and DC Characteristics,” on page 44 • Table 12, ”Current Consumption,” on page 45 • Cellular Blocking deleted • Section 11, WLAN RF Specifications, “Introduction” on page 46 • Table 13, GHz Band General RF Specifications,” on page 46 • Figure 20, ”RF Port Location,” on page 46 • Table 14, GHz Band Receiver RF Specifications,” on page 47 • Table 15, GHz Band Transmitter RF Specifications,” on page 49 • Table 16, GHz Band Local Oscillator Specifications,” on page 51 • Table 18, ”5 GHz Receiver Sensitivity,” on page 52 April 2, 2014 • 4319CT-DSXX3-RI Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 4 Not Recommended for New Designs BCM4319 Preliminary Data Sheet 4319-DS02-R 7/24/09 • Table 21, ”Core Buck Regulator CBUCK ,” on page 54 • Table 22, ”Internal PALDO,” on page 55 • Table 23, ”2.5V LDO LDO2p5V ,” on page 55 • Table 24, ”CLDO,” on page 56 • Table 25, ”LNLDO1, LNLDO2,” on page 57 • Section 13 ”Power-Up Sequence” on page 58 • Figure 21, ”Power-Up Sequence Timing Diagram,” on page 58 • Table 27, ”gSPI Timing,” on page 59 • Table 28, ”SDIO Bus Timing Parameters Default Mode ,” on page 60 • Table 29, ”SDIO Bus Timing Parameters High-Speed Mode ,” on page 61 • Table 32, ”Ordering Information,” on page 65 • MAC Features: • “WSE” on page 23 • “TXE” on page 23 • “RXE” on page 24 • “PHY Description” on page 25 • Signal Descriptions, “138-Ball WLBGA Package” on page 34 • Table 6, ”138-Ball WLBGA Signal Descriptions,” on page 34 Updated: • “SDIO Key Features” on page ii • Table 1, ”Crystal Oscillator and External Frequency Reference Specifications,” on page 7 • Table 4, ”138-Ball WLBGA Signal Descriptions,” on page 28 • Table 6, ”Strapping Options,” on page 36 • Table 8, ”Environmental Characteristics,” on page 37 • Table 10, ”Recommended Operating Conditions and DC Characteristics,” on page 38 • Table 13, GHz Band General RF Specifications,” on page 42 • Table 15, GHz Receiver Sensitivity,” on page 44 • Table 16, GHz Band Transmitter RF Specifications,” on page 45 • “SDIO High Speed Mode Timing” on page 59 • Figure 18, ”138-Ball WLBGA Mechanical Information,” on page 62 • Table 32, ”Ordering Information,” on page 63 April 2, 2014 • 4319CT-DSXX3-RI Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 5 Not Recommended for New Designs BCM4319 Preliminary Data Sheet 4319-DS01-R 2/6/09 Updated • Document type header • General Description on page i • Features on page ii • Figure 2, ”BCM4319 Block Diagram,” on page 1 • “Voltage Regulators” on page 3 • Figure 4, ”Power Topology Example,” on page 4 • “Power Supply Topology” on page 4 • “Crystal Interface and Clock Generation” on page 6 • Table 1, ”Crystal Oscillator and External Frequency Reference Specifications,” on page 6 • Figure 5, ”Recommended Oscillator Configuration,” on page 7 • “One-Time-Programmable OTP Memory” on page 9 • Section 4 ”Global Functions” on page 9 changed section title, was “System Interfaces” • “USB Device Core” on page 10 • “SDIO V1.2” on page 11 • Section 5 ”USB and SDIO Interfaces” on page 10 changed section title was “USB evice Core” • “SDIO V1.2” on page 11 moved from Section 4 ”Global Functions” to Section 5 ”USB and SDIO Interfaces” • Section 6 a/b/g/n MAC and PHY” on page 12 title modified • “PHY Features” on page 16 • “138-Ball WLBGA Pinout” on page 21 • Table 2, mm x mm 138-Ball WLBGA,” on page 20 • Table 3, ”WLBGA Signal Assignments by Pin Number and X- and Y- Coordinates,” on page 21 • Table 4, ”138-Ball WLBGA Signal Descriptions,” on page 25 • Section 10 ”Operating Conditions” on page 33 changed section title was “DC Characteristics” • “Environmental Ratings” on page 33 was Environmantal Conditions moved from Section 16 ”Package Information” on page 51 • Table 7, ”Environmental Characteristics,” on page 33 April 2, 2014 • 4319CT-DSXX3-RI Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 6 Not Recommended for New Designs BCM4319 Preliminary Data Sheet 4319-DS00-R 05/01/08 • Table 8, ”Absolute Maximum Ratings,” on page 33 • Table 9, ”Recommended Operating Conditions and DC Characteristics,” on page 34 • Table 11, ”Blocking Signals from Embedded Cellular Transmitter at Cellular Antenna Port,” on page 36 • “Introduction” on page 36 • Table 13, GHz Band Receiver RF Specifications,” on page 38 • Table 14, GHz Receiver Sensitivity,” on page 38 • Table 17, ”5 GHz Band Receiver RF Specifications,” on page 40 • Table 21, ”Core Buck Regulator CBUCK ,” on page 42 • Table 22, ”Internal PALDO,” on page 43 • Table 23, ”2.5V LDO LDO2p5V ,” on page 43 • Table 24, ”CLDO,” on page 44 • Table 25, ”LNLDO1, LNLDO2,” on page 45 • Figure 14, ”Power-Up Sequence Timing Diagram,” on page 46 • Figure 15, ”SDIO Bus Timing Default Mode ,” on page 47 • Figure 16, ”SDIO Bus Timing High-Speed Mode ,” on page 49 • Figure 17, ”138-Ball WLBGA Mechanical Information,” on page 52 Added • WLBGA Package • “One-Time-Programmable OTP Memory” on page 9 • “Bluetooth Coexistence Interface” on page 9 • Table 6, ”Strapping Options and GPIO Functions,” on page 32 • “Junction Temperature Estimation and PSIJT VERSUS THETAJC” on page 51 • Table 18, ”Ordering Information,” on page 53 Deleted • FCBGA Package • “LPO Clock Interface” on page 9 • Table 21, ”PALDO with External PNP,” on page 43 • Table 25, ”Bandgap Reference Block HVBG ,” on page 44 • Table 27, ”LDO Bandgap Reference LDOBG ,” on page 45 Initial release April 2, 2014 • 4319CT-DSXX3-RI Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 7 BCM4319 Preliminary Data Sheet Table of Contents Not Recommended for New Designs Table of Contents About This Document 13 Purpose and Audience 13 Acronyms and 13 Document Conventions 13 Technical Support 13 Section 1 Overview 14 14 Mobile Phone Usage Model 15 Section 2 Power Supplies and Management 16 Power 16 Voltage 16 Power Supply 17 PMU Sequencer 18 Low-Power Shutdown 19 Section 3 Frequency 20 Crystal Interface and Clock Generation 20 Crystal 21 External Frequency 22 Frequency Selection 22 Frequency Trimming 23 Section 4 Global Functions 24 General-Purpose Input/Output Interface 24 UART 24 One-Time-Programmable OTP Memory 24 Bluetooth Coexistence 25 JTAG Interface 25 Section 5 USB and SDIO 26 USB Device Core 26 SDIO V2.0 27 28 SPI Protocol 28 Command Structure 30 Write-Read 30 Status 31 April 2, 2014 • 4319-DS05-R Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 8 Not Recommended for New Designs BCM4319 Preliminary Data Sheet Table of Contents SPI Host-Device 33 Boot-Up Sequence 33 Section 6 a/b/g/n MAC and 35 Introduction to the IEEE Standard 35 MAC Features 35 MAC Description 36 PSM 37 WSE 37 TXE 37 38 TSF 38 39 MAC-PHY 39 PHY Features 39 PHY Description 39 Section 7 WLAN Radio Subsystem 42 Receiver 43 Transmitter Path 43 Section 8 Pin Assignments 44 mm x mm 138-BALL WLBGA 44 Section 9 Pinout and Signal Descriptions 45 Signal Assignments 45 138-Ball WLBGA Pinout 45 Signal Descriptions 49 138-Ball WLBGA Package 49 SDIO Pin Descriptions 54 Strapping Options and GPIO 55 Section 10 Operating 57 Section 18 Ordering Information 82 April 2, 2014 • 4319-DS05-R Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 10 Not Recommended for New Designs BCM4319 Preliminary Data Sheet List of Figures List of Figures Figure 1 BCM4319 System Block Diagram 1 Figure 2 BCM4319 Block Diagram 14 Figure 3 Mobile Phone System Diagram 15 Figure 4 Power Topology Example 18 Figure 5 Recommended Oscillator Configuration 22 Figure 6 Recommended TCXO Connection 22 Figure 7 USB Device Block Diagram 26 Figure 8 Host Interface 28 Figure 9 SPI Write Protocol 29 Figure 10 SPI Read Protocol 29 Figure 11 SPI Command Structure 30 Figure 12 SPI Signal Timing Without Status 31 Figure 13 SPI Signal Timing with Status Response Delay = 32 Figure 14 WLAN MAC Architecture 36 Figure 15 WLAN PHY Block 40 Figure 16 STBC Receive Block Diagram 41 Figure 17 Radio Functional Block Diagram 42 Figure 18 Signal Connections to SDIO Card SD 4-Bit Mode 55 Figure 19 Signal Connections to SDIO Card gSPI Mode 55 Figure 20 RF Port Location 60 Figure 21 Power-Up Sequence Timing Diagram 73 Figure 22 gSPI Timing 74 Figure 23 SDIO Bus Timing Default Mode 75 Figure 24 SDIO Bus Timing High-Speed 76 Figure 25 138-Ball WLBGA Mechanical Information 81 April 2, 2014 • 4319-DS05-R Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 11 Not Recommended for New Designs BCM4319 Preliminary Data Sheet List of Tables List of Tables Table 1 Crystal Oscillator and External Frequency Reference Specifications 20 Table 2 SPI Status Field Details 32 Table 3 SPI Registers 33 Table 4 mm x mm 138-Ball WLBGA 44 Table 5 WLBGA Signal Assignments by Pin Number and X- and Y-Coordinates 45 Table 6 138-Ball WLBGA Signal Descriptions 49 Table 7 SDIO Pin Descriptions 54 Table 8 Strapping Options 56 Table 9 Environmental Characteristics 57 Table 10 Absolute Maximum Ratings 57 Table 11 Recommended Operating Conditions and DC Characteristics 58 Table 12 Current Consumption 59 Table 13 GHz Band General RF 60 Table 14 GHz Band Receiver RF Specifications 61 Table 15 GHz Band Transmitter RF Specifications 64 Table 16 GHz Band Local Oscillator 65 Table 17 5 GHz Band Receiver RF Specifications 66 Table 18 5 GHz Receiver Sensitivity 66 Table 19 5 GHz Band Transmitter RF Specifications 67 Table 20 5 GHz Band Local Oscillator Frequency Generator Specifications 67 Table 21 Core Buck Regulator 68 Table 22 Internal 69 Table 23 2.5V LDO LDO2p5V 69 Table 24 CLDO 70 Table 25 LNLDO1, LNLDO2 71 Table 26 Power Management Unit 71 Table 27 gSPI Timing 74 Table 28 SDIO Bus Timing Parameters Default 75 Table 29 SDIO Bus Timing Parameters High-Speed 77 Table 30 USB Electrical and Timing 78 Table 31 138-Ball WLBGA Package Thermal 80 Table 32 Ordering Information 82 April 2, 2014 • 4319-DS05-R Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 12 Not Recommended for New Designs BCM4319 Preliminary Data Sheet About This Document Purpose and Audience This data sheet provides details about the functional, operational, and electrical characteristics of the Broadcom BCM4319. It is intended for hardware design, application, and OEM engineers. Acronyms and Abbreviations In most cases, acronyms and abbreviations are defined on first use. For a comprehensive list of acronyms and other terms used in Broadcom documents, go to: Document Conventions The following conventions may be used in this document: Convention Bold Monospace <> [] User input and actions for example, type exit, click OK, press Alt+C Code #include <iostream> HTML <td rowspan = 3> Command line commands and parameters wl [-l] <command> Placeholders for required elements enter your <username> or wl <command> Indicates optional command-line parameters wl [-l] Indicates bit and byte ranges inclusive [0:3] or [7:0] Technical Support Broadcom provides customer access to a wide range of information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software updates through its customer support portal For a CSP account, contact your Sales or Engineering support representative. In addition, Broadcom provides other product support through its Downloads & Support site April 2, 2014 • 4319-DS05-R Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 13 JTAG AXI Backplane Not Recommended for New Designs BCM4319 Preliminary Data Sheet Section 1 Overview Overview Overview The Broadcom BCM4319 family of single-chip devices provides the highest level of integration for a mobile or handheld wireless system, with integrated IEEE a/b/g/n MAC/baseband/radio , power amplifiers PAs , and power management unit PMU . It provides a compact, small form factor solution with minimal external components to drive down the costs for mass volumes while enabling handheld device flexibility in size, form, and function. The BCM4319 is designed to address the needs of highly mobile devices that require minimal power consumption and reliable operation. Figure 2 shows the major blocks and external interfaces of the BCM4319. Figure 2 BCM4319 Block Diagram USB2.0/1.1 Device SDIO/SPI SDIOD SPI RAM 288 KB ROM 128 KB BCM4319 PMU Ctrl Switching Regulator Power supply Power supply Xtal Oscillator Xtal WDog timer 2 kb OTP GPIO UART JTAG Ordering Information Section 18 Ordering Information Table 32 Ordering Information Part Number BCM4319GKUBG BCM4319XKUBG BCM4319SKUBG Package 138-ball, wafer-level WLBGA package mm x mm x mm, mm pitch Single-band 802.11b/g/n 2.4GHz WLAN, USB SDIO 138-ball, wafer-level WLBGA package mm x mm x mm, mm pitch Dual-band 802.11a/b/g/n GHz and 5 GHz WLAN, USB SDIO 138-ball, wafer-level WLGBA package with Single-band 802.11b/g/n Back Side Protection BSP GHz WLAN USB2.0, mm x mm x mm, mm SDIO pitch Ambient Temperature °C to 85 °C °C to 85 °C °C to 85 °C Not Recommended for New Designs April 2, 2014 • 4319CT-DSXX3-RI Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 82 BCM4319 Preliminary Data Sheet Not Recommended for New Designs Corporation reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom Corporation is believed to be accurate and reliable. However, Broadcom Corporation does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Broadcom Corporation 5300 California Avenue Irvine, CA 92617 2014 by BROADCOM CORPORATION. All rights reserved. 4319-DS05-R April 2, 2014 Phone 949-926-5000 Fax 949-926-5203 E-mail Web:

PDF Datasheet Preview

Not Recommended for New Designs

The following document contains information on Cypress products. Although the document is marked with the name “Broadcom”, the company that originally developed the specification, Cypress will continue to offer these products to new and existing customers.
CONTINUITY OF ORDERING PART NUMBERS Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed in this document.

FOR MORE INFORMATION Please visit our website at or contact your local sales office for additional information about Cypress products and services.

OUR CUSTOMERS Cypress is for true innovators in companies both large and small.

ABOUT CYPRESS Founded in 1982, Cypress is the leader in advanced embedded system solutions for the world’s most innovative automotive, industrial, home automation and appliances, consumer electronics and medical products. Cypress’s programmable systems-onchip, general-purpose microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance memories help engineers design differentiated products and get them to market first.

Cypress is committed to providing customers with the best support and engineering resources on the planet enabling innovators and out-of-the-box thinkers to disrupt markets and create new product categories in record time. To learn more, go to
• San Jose, CA 95134-1709
• 408-943-2600

Not Recommended for New Designs

Preliminary Data Sheet

BCM4319

Single-Chip IEEE a/b/g/n MAC/Baseband/ Radio with Integrated SDIO and USB Interfaces

The Broadcom BCM4319 single-chip device provides the highest level of integration for Wi-Fi enabled SDIO and USB-based wireless systems. Featuring an IEEE a/b/g/n MAC/baseband/radio with integrated CMOS, Power Amplifiers PAs and a power management unit PMU the BCM4319 provides a compact, ultrasmall form factor solution with few required external components. This enables highvolume costs to be driven down and allows flexibility in the size, form, and function of handheld devices.

The BCM4319 supports SDIO 4-bit, 1-bit, and Serial Peripheral Interface SPI modes , generic SPI gSPI , USB device , and local coexistence host interfaces.

Using advanced design techniques and process technology to deliver the lowest active and idle power, the BCM4319 extends system battery life in mobile systems, while maintaining consistent connectivity and high performance.

Integrated CMOS WLAN GHz and 5 GHz power amplifiers provide sufficient output power to meet the needs of most WLAN devices. An optional external PA and Low-Noise Amplifier LNA are also supported.

In addition, the BCM4319 includes integrated transmit and receive baluns for both the GHz and 5 GHz RF paths, further reducing the overall solution cost.

To simplify the system power topology and to enable operation directly from the battery of a mobile platform, the BCM4319 includes one switching regulator buck mode , five linear low dropout LDO voltage regulators, and an advanced PMU. A variable input voltage range of is supported.

The integrated buck regulator enables the internal power amplifiers to operate at optimal performance, even at low VBAT supply voltages.
• USB dongles
• Printers
• Media players
• Cellular and mobile phones
• Gaming systems
• Cameras
• All types of battery powered devices
• Integrated designs with Bluetooth and GPS

Figure 1 BCM4319 System Block Diagram

VDDIO

VBAT

WLAN Host I/F

WL_REG_ON SDIO
5 GHz WLAN Tx 5 GHz WLAN Rx

Switch

TCXO

USB UART

BCM4319

Reference frequency

GHz WLAN Tx

Switch

GHz WLAN Rx
5300 California Avenue
• Irvine, CA 92617
• Phone 949-926-5000
• Fax 949-926-5203
4319CT-DSXX3-RI April 2, 2014

Not Recommended for New Designs

IEEE 802.11x Key Features
• Dual band GHz and 5 GHz a/b/g/n.
• Single stream 802.11n support for both 20 MHz and 40 MHz channels provides PHY layer rates up to MCS7 150 Mbps for typical upper layer throughput in excess of 70 Mbps.
• Integrated CMOS power amplifiers deliver greater than 20 dBm of linear output power
• Integrated Cortex-M3 processor and onchip memory for complete WLAN subsystem functionality minimizing the need to wake up the applications processor for standard WLAN functions. This allows for further minimization of power consumption, while maintaining the capability to field upgrade with future features.
• Provides for the following security features
• WPA and WPA2 Personal support for powerful encryption and authentication
• Table 32 “Ordering Information,” on page 82

Updated
• Table 32 on page 88
• Converted to latest format template

Updated
• VBAT range, global update from to
• “General Description” on Page
• Figure 1, ”BCM4319 System Block Diagram,” on page i
• “Mobile Phone Usage Model” on page 2
• Figure 3, ”Mobile Phone System Diagram,” on page 2
• “Power Management” on page 3
• “Voltage Regulators” on page 3
• “Power Supply Topology” on page 4
• Figure 4, ”Power Topology Example,” on page 5
• “Low-Power Shutdown” on page 6
• Table 1, ”Crystal Oscillator and External Frequency Reference

Specifications,” on page 7
• “Frequency Selection” on page 9
• “General-Purpose Input/Output Interface” on page 10
• “SDIO V2.0” on page 13
• Figure 8, ”Host Interface,” on page 14
• Figure 14, ”WLAN MAC Architecture,” on page 22
• Table 4, mm x mm 138-Ball WLBGA,” on page 29
• Table 6, ”138-Ball WLBGA Signal Descriptions,” on page 34
• “Strapping Options and GPIO Functions” on page 41
• Table 8, ”Strapping Options,” on page 42
• Table 9, ”Environmental Characteristics,” on page 43
• Table 10, ”Absolute Maximum Ratings,” on page 43
• Table 11, ”Recommended Operating Conditions and DC

Characteristics,” on page 44
• Table 12, ”Current Consumption,” on page 45
• Cellular Blocking deleted
• Section 11, WLAN RF Specifications, “Introduction” on page 46
• Table 13, GHz Band General RF Specifications,” on page 46
• Figure 20, ”RF Port Location,” on page 46
• Table 14, GHz Band Receiver RF Specifications,” on page 47
• Table 15, GHz Band Transmitter RF Specifications,” on page 49
• Table 16, GHz Band Local Oscillator Specifications,” on page 51
• Table 18, ”5 GHz Receiver Sensitivity,” on page 52

April 2, 2014
• 4319CT-DSXX3-RI

Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 4

Not Recommended for New Designs

BCM4319 Preliminary Data Sheet
4319-DS02-R
7/24/09
• Table 21, ”Core Buck Regulator CBUCK ,” on page 54
• Table 22, ”Internal PALDO,” on page 55
• Table 23, ”2.5V LDO LDO2p5V ,” on page 55
• Table 24, ”CLDO,” on page 56
• Table 25, ”LNLDO1, LNLDO2,” on page 57
• Section 13 ”Power-Up Sequence” on page 58
• Figure 21, ”Power-Up Sequence Timing Diagram,” on page 58
• Table 27, ”gSPI Timing,” on page 59
• Table 28, ”SDIO Bus Timing Parameters Default Mode ,” on page
60
• Table 29, ”SDIO Bus Timing Parameters High-Speed Mode ,” on
page 61
• Table 32, ”Ordering Information,” on page 65
• MAC Features:
• “WSE” on page 23
• “TXE” on page 23
• “RXE” on page 24
• “PHY Description” on page 25
• Signal Descriptions, “138-Ball WLBGA Package” on page 34
• Table 6, ”138-Ball WLBGA Signal Descriptions,” on page 34

Updated:
• “SDIO Key Features” on page ii
• Table 1, ”Crystal Oscillator and External Frequency Reference

Specifications,” on page 7
• Table 4, ”138-Ball WLBGA Signal Descriptions,” on page 28
• Table 6, ”Strapping Options,” on page 36
• Table 8, ”Environmental Characteristics,” on page 37
• Table 10, ”Recommended Operating Conditions and DC
Characteristics,” on page 38
• Table 13, GHz Band General RF Specifications,” on page 42
• Table 15, GHz Receiver Sensitivity,” on page 44
• Table 16, GHz Band Transmitter RF Specifications,” on page 45
• “SDIO High Speed Mode Timing” on page 59
• Figure 18, ”138-Ball WLBGA Mechanical Information,” on page 62
• Table 32, ”Ordering Information,” on page 63

April 2, 2014
• 4319CT-DSXX3-RI

Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 5

Not Recommended for New Designs

BCM4319 Preliminary Data Sheet
4319-DS01-R
2/6/09

Updated
• Document type header
• General Description on page i
• Features on page ii
• Figure 2, ”BCM4319 Block Diagram,” on page 1
• “Voltage Regulators” on page 3
• Figure 4, ”Power Topology Example,” on page 4
• “Power Supply Topology” on page 4
• “Crystal Interface and Clock Generation” on page 6
• Table 1, ”Crystal Oscillator and External Frequency Reference

Specifications,” on page 6
• Figure 5, ”Recommended Oscillator Configuration,” on page 7
• “One-Time-Programmable OTP Memory” on page 9
• Section 4 ”Global Functions” on page 9 changed section title, was
“System Interfaces”
• “USB Device Core” on page 10
• “SDIO V1.2” on page 11
• Section 5 ”USB and SDIO Interfaces” on page 10 changed
section title was “USB evice Core”
• “SDIO V1.2” on page 11 moved from Section 4 ”Global Functions”
to Section 5 ”USB and SDIO Interfaces”
• Section 6 a/b/g/n MAC and PHY” on page 12 title modified
• “PHY Features” on page 16
• “138-Ball WLBGA Pinout” on page 21
• Table 2, mm x mm 138-Ball WLBGA,” on page 20
• Table 3, ”WLBGA Signal Assignments by Pin Number and X- and Y-

Coordinates,” on page 21
• Table 4, ”138-Ball WLBGA Signal Descriptions,” on page 25
• Section 10 ”Operating Conditions” on page 33 changed section
title was “DC Characteristics”
• “Environmental Ratings” on page 33 was Environmantal

Conditions moved from Section 16 ”Package Information” on page 51
• Table 7, ”Environmental Characteristics,” on page 33

April 2, 2014
• 4319CT-DSXX3-RI

Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 6

Not Recommended for New Designs

BCM4319 Preliminary Data Sheet
4319-DS00-R
05/01/08
• Table 8, ”Absolute Maximum Ratings,” on page 33
• Table 9, ”Recommended Operating Conditions and DC

Characteristics,” on page 34
• Table 11, ”Blocking Signals from Embedded Cellular Transmitter at

Cellular Antenna Port,” on page 36
• “Introduction” on page 36
• Table 13, GHz Band Receiver RF Specifications,” on page 38
• Table 14, GHz Receiver Sensitivity,” on page 38
• Table 17, ”5 GHz Band Receiver RF Specifications,” on page 40
• Table 21, ”Core Buck Regulator CBUCK ,” on page 42
• Table 22, ”Internal PALDO,” on page 43
• Table 23, ”2.5V LDO LDO2p5V ,” on page 43
• Table 24, ”CLDO,” on page 44
• Table 25, ”LNLDO1, LNLDO2,” on page 45
• Figure 14, ”Power-Up Sequence Timing Diagram,” on page 46
• Figure 15, ”SDIO Bus Timing Default Mode ,” on page 47
• Figure 16, ”SDIO Bus Timing High-Speed Mode ,” on page 49
• Figure 17, ”138-Ball WLBGA Mechanical Information,” on page 52

Added
• WLBGA Package
• “One-Time-Programmable OTP Memory” on page 9
• “Bluetooth Coexistence Interface” on page 9
• Table 6, ”Strapping Options and GPIO Functions,” on page 32
• “Junction Temperature Estimation and PSIJT VERSUS THETAJC” on
page 51
• Table 18, ”Ordering Information,” on page 53

Deleted
• FCBGA Package
• “LPO Clock Interface” on page 9
• Table 21, ”PALDO with External PNP,” on page 43
• Table 25, ”Bandgap Reference Block HVBG ,” on page 44
• Table 27, ”LDO Bandgap Reference LDOBG ,” on page 45

Initial release

April 2, 2014
• 4319CT-DSXX3-RI

Single-Chip IEEE a/b/g/n MAC/Baseband/Radio Page 7

BCM4319 Preliminary Data Sheet

Table of Contents

Not Recommended for New Designs

Table of Contents

About This Document 13 Purpose and Audience 13 Acronyms and 13 Document Conventions 13

Technical Support 13

Section 1 Overview 14
14 Mobile Phone Usage Model 15

Section 2 Power Supplies and Management 16

Power 16 Voltage 16 Power Supply 17 PMU Sequencer 18 Low-Power Shutdown 19

Section 3 Frequency 20

Crystal Interface and Clock Generation 20 Crystal 21 External Frequency 22 Frequency Selection 22 Frequency Trimming 23

Section 4 Global Functions 24

General-Purpose Input/Output Interface 24 UART 24 One-Time-Programmable OTP Memory 24 Bluetooth Coexistence 25 JTAG Interface 25

Section 5 USB and SDIO 26

USB Device Core 26 SDIO V2.0 27 28

SPI Protocol 28 Command Structure 30 Write-Read 30 Status 31

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Table of Contents

SPI Host-Device 33 Boot-Up Sequence 33

Section 6 a/b/g/n MAC and 35

Introduction to the IEEE Standard 35 MAC Features 35

MAC Description 36 PSM 37 WSE 37 TXE 37 38 TSF 38 39 MAC-PHY 39

PHY Features 39 PHY Description 39

Section 7 WLAN Radio Subsystem 42

Receiver 43 Transmitter Path 43

Section 8 Pin Assignments 44
mm x mm 138-BALL WLBGA 44

Section 9 Pinout and Signal Descriptions 45

Signal Assignments 45 138-Ball WLBGA Pinout 45

Signal Descriptions 49 138-Ball WLBGA Package 49

SDIO Pin Descriptions 54 Strapping Options and GPIO 55

Section 10 Operating 57
Section 18 Ordering Information 82

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List of Figures

List of Figures

Figure 1 BCM4319 System Block Diagram 1 Figure 2 BCM4319 Block Diagram 14 Figure 3 Mobile Phone System Diagram 15 Figure 4 Power Topology Example 18 Figure 5 Recommended Oscillator Configuration 22 Figure 6 Recommended TCXO Connection 22 Figure 7 USB Device Block Diagram 26 Figure 8 Host Interface 28 Figure 9 SPI Write Protocol 29 Figure 10 SPI Read Protocol 29 Figure 11 SPI Command Structure 30 Figure 12 SPI Signal Timing Without Status 31 Figure 13 SPI Signal Timing with Status Response Delay = 32 Figure 14 WLAN MAC Architecture 36 Figure 15 WLAN PHY Block 40 Figure 16 STBC Receive Block Diagram 41 Figure 17 Radio Functional Block Diagram 42 Figure 18 Signal Connections to SDIO Card SD 4-Bit Mode 55 Figure 19 Signal Connections to SDIO Card gSPI Mode 55 Figure 20 RF Port Location 60 Figure 21 Power-Up Sequence Timing Diagram 73 Figure 22 gSPI Timing 74 Figure 23 SDIO Bus Timing Default Mode 75 Figure 24 SDIO Bus Timing High-Speed 76 Figure 25 138-Ball WLBGA Mechanical Information 81

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List of Tables

List of Tables
Table 1 Crystal Oscillator and External Frequency Reference Specifications 20 Table 2 SPI Status Field Details 32 Table 3 SPI Registers 33 Table 4 mm x mm 138-Ball WLBGA 44 Table 5 WLBGA Signal Assignments by Pin Number and X- and Y-Coordinates 45 Table 6 138-Ball WLBGA Signal Descriptions 49 Table 7 SDIO Pin Descriptions 54 Table 8 Strapping Options 56 Table 9 Environmental Characteristics 57 Table 10 Absolute Maximum Ratings 57 Table 11 Recommended Operating Conditions and DC Characteristics 58 Table 12 Current Consumption 59 Table 13 GHz Band General RF 60 Table 14 GHz Band Receiver RF Specifications 61 Table 15 GHz Band Transmitter RF Specifications 64 Table 16 GHz Band Local Oscillator 65 Table 17 5 GHz Band Receiver RF Specifications 66 Table 18 5 GHz Receiver Sensitivity 66 Table 19 5 GHz Band Transmitter RF Specifications 67 Table 20 5 GHz Band Local Oscillator Frequency Generator Specifications 67 Table 21 Core Buck Regulator 68 Table 22 Internal 69 Table 23 2.5V LDO LDO2p5V 69 Table 24 CLDO 70 Table 25 LNLDO1, LNLDO2 71 Table 26 Power Management Unit 71 Table 27 gSPI Timing 74 Table 28 SDIO Bus Timing Parameters Default 75 Table 29 SDIO Bus Timing Parameters High-Speed 77 Table 30 USB Electrical and Timing 78 Table 31 138-Ball WLBGA Package Thermal 80 Table 32 Ordering Information 82

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About This Document

Purpose and Audience

This data sheet provides details about the functional, operational, and electrical characteristics of the Broadcom BCM4319. It is intended for hardware design, application, and OEM engineers.

Acronyms and Abbreviations

In most cases, acronyms and abbreviations are defined on first use.

For a comprehensive list of acronyms and other terms used in Broadcom documents, go to:

Document Conventions

The following conventions may be used in this document:

Convention Bold Monospace
<> []

User input and actions for example, type exit, click OK, press Alt+C

Code #include <iostream> HTML <td rowspan = 3> Command line commands and parameters wl [-l] <command> Placeholders for required elements enter your <username> or wl <command> Indicates optional command-line parameters wl [-l] Indicates bit and byte ranges inclusive [0:3] or [7:0]

Technical Support

Broadcom provides customer access to a wide range of information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software updates through its customer support portal For a CSP account, contact your Sales or Engineering support representative.

In addition, Broadcom provides other product support through its Downloads & Support site

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Section 1 Overview

Overview

Overview

The Broadcom BCM4319 family of single-chip devices provides the highest level of integration for a mobile or handheld wireless system, with integrated IEEE a/b/g/n MAC/baseband/radio , power amplifiers PAs , and power management unit PMU . It provides a compact, small form factor solution with minimal external components to drive down the costs for mass volumes while enabling handheld device flexibility in size, form, and function. The BCM4319 is designed to address the needs of highly mobile devices that require minimal power consumption and reliable operation.

Figure 2 shows the major blocks and external interfaces of the BCM4319.

Figure 2 BCM4319 Block Diagram

USB2.0/1.1 Device

SDIO/SPI

SDIOD SPI

RAM 288 KB ROM 128 KB

BCM4319 PMU Ctrl

Switching Regulator

Power supply Power supply

Xtal Oscillator

Xtal

WDog timer 2 kb OTP GPIO UART JTAG
Ordering Information
Section 18 Ordering Information
Table 32 Ordering Information

Part Number BCM4319GKUBG

BCM4319XKUBG

BCM4319SKUBG

Package
138-ball, wafer-level WLBGA package
mm x mm x mm, mm pitch

Single-band 802.11b/g/n 2.4GHz WLAN, USB SDIO
138-ball, wafer-level WLBGA package
mm x mm x mm, mm pitch

Dual-band 802.11a/b/g/n GHz and 5 GHz WLAN, USB SDIO
138-ball, wafer-level WLGBA package with Single-band 802.11b/g/n

Back Side Protection BSP

GHz WLAN USB2.0,
mm x mm x mm, mm SDIO
pitch

Ambient Temperature °C to 85 °C
°C to 85 °C
°C to 85 °C

Not Recommended for New Designs

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BCM4319 Preliminary Data Sheet

Not Recommended for New Designs

Corporation reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design.

Information furnished by Broadcom Corporation is believed to be accurate and reliable. However, Broadcom Corporation does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.

Broadcom Corporation 5300 California Avenue Irvine, CA 92617 2014 by BROADCOM CORPORATION. All rights reserved.
4319-DS05-R

April 2, 2014

Phone 949-926-5000 Fax 949-926-5203 E-mail Web:

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived CYW4319XKUBGT Datasheet file may be downloaded here without warranties.

Datasheet ID: CYW4319XKUBGT 507643