HP3-TO3-CB
HP3-TO3-CB Datasheet
Series HP3
| Part | Datasheet |
|---|---|
HP3-TO3-CB |
HP3-TO3-CB (pdf) |
| PDF Datasheet Preview |
|---|
| METAL CASE, CASE-MOUNTED SEMICONDUCTORS Series HP3 Technical HP3 Series for Single TO-3 or Stud Mount DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. B. N.C Horiz. & Vert. With Dissipator. C. 200 FPM w/Diss. D. 500 FPM w/Diss. E. 1000 FPM w/Diss. • Thermal Resistance Case to Sink is °C/W/Joint Compound. • Derate °C/watt for unplated part in natural convection only. Ordering Information Unplated HP3-000-U HP3-T03-U HP3-T03-33U CTS IERC PART NO. Comm'l. Black Anodize HP3-000-CB HP3-T03-CB HP3-T03-33CB Mil. Black Anodize HP3-000-B HP3-T03-B HP3-T03-33B Semiconductor Accommodated Undrilled T0-3 T0-3 IC Hole patt. ref. no. -16 17 Max. Weight Grams HP3-T03-44U HP3-T03-44CB HP3-T03-44B T0-3 PANEL MOUNT HP3-436-U HP3-436-CB HP3-436-B T0-3 4 PIN HP3-T015-U HP3-T015-CB HP3-T015-B T0-15, D0-5 HP3-T06-U HP3-T06-CB HP3-T06-B T0-6, T0-36 HP3-420-U HP3-420-CB HP3-420-B UNIVERSAL HP3 for Dual TO-3 Outline DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. B. N.C Horiz. & Vert. With Dissipator. C. 200 FPM w/Diss. D. 500 FPM w/Diss. E. 1000 FPM w/Diss. • Thermal Resistance Case to Sink is °C/W/Joint Compound. • Derate °C/watt for unplated part in natural convection only. Ordering Information Unplated HP3-T03-4U HP3-437-U CTS IERC PART NO. Comm'l. Black Anodize HP3-T03-4CB HP3-437-CB Mil. Black Anodize HP3-T03-4B HP3-437-B Semiconductor Accommodated Two TO-3s Two TO-3s 4 pin Hole patt. ref. no. Max. Weight Grams HP3 for Three TO-3 Outline DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. B. N.C Horiz. & Vert. With Dissipator. C. 200 FPM w/Diss. D. 500 FPM w/Diss. E. 1000 FPM w/Diss. • Thermal Resistance Case to Sink is °C/W/Joint Compound. • Derate °C/watt for unplated part in natural convection only. Ordering Information Unplated HP3-T03-8U CTS IERC PART NO. Comm'l. Black Anodize HP3-T03-8CB Mil. Black Anodize HP3-T03-8B Semiconductor Accommodated Three TO-3s Hole patt. ref. no. Max. Weight Grams HOLE PATTERNS Hole pattern no. 124 accomodates two TO-3s. Available in Hole pattern no. 437 accommodates two TO-3s 4-pin . HP3 series heat dissipators only. Available in HP3 series heat dissipators only. Hole pattern no. 186 accommodates three TO-3s. Available Hole pattern no. 1 accommodates T0-3s. Available in UP, in HP3 series heat dissipators only. UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 202 accommodates T0-3 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 436 accomodates T0-3s 4-pin . Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 3 accommodates T0-15s, D0-5s and other 1/4" stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 420 Universal accommodates T0-3s, T066s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 213 accommodates one TO-3 panel mounted . Available in HP1 and HP3 series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel 818 842-7277 Fax 818 848-8872 |
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