833202B03300
833202B03300 Datasheet
P/N 833202B03300
| Part | Datasheet |
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833202B03300 |
833202B03300 (pdf) |
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| Board Level Heat Sinks P/N 833202B03300 TO-220 Temp Rise Above Ambient -oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 • Size x mm • Material Aluminum, mm Thick • Type Stamped • IC Mounting Integrated Spring • PCB Mounting Solderable Tabs • Finish Black Anodize • Package Bulk • No Hardware Device Attachment • Constant Spring Force Tension • Vertical Mounting via Solderable Tabs • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 60 40 Air Velocity - LFM 1000 20 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
| More datasheets: GPF10.1W9 | 7214N/19 | AWP2-10-7241-T-R | 8KH3-0734-0250 | 8KH3-0734-0500 | FQAF34N25 | AT24RF08-EK | 132A11029X | HCSW21E | CL20 100120 |
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