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825600T00000 (pdf) |
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Board Level Heat Sinks P/N: TO-220 Temp Rise Above Ambient -oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient PRODUCT SPECIFICATIONS • Devices TO-220 • Size x 30.0mm • Material Copper, 1.2mm Thick • Type Stamped • Finish Tin Plate • Mounting Solderable Tabs • Package Bulk • Accessories Hardware & Thermal Interface Material • Slot for Flexible Device Attachment • Vertical Mounting via Solderable Tabs • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs • Specialized Body Configurations 0 100 Air Velocity - LFM 1000 10 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
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