WM8783GED/RV

WM8783GED/RV Datasheet

WM8783

Part	Datasheet
WM8783GED/RV	WM8783GED/RV (pdf)

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Stereo Low Power 96kHz ADC WM8783 The WM8783 is a compact, low cost ADC designed for set-top boxes and DVD applications. Stereo analogue inputs accept 1Vrms line level inputs the Hi-Fi ADCs output 24-bit stereo data on the I2S digital audio interface. Sample rates from 8kHz to 96kHz are supported this is configured automatically according to the external master clock MCLK frequency. A power on reset POR circuit ensures correct start-up and shut-down. The device is held in reset when MCLK is not present, offering a low-power standby state. The WM8783 is supplied in an 8-pin SOIC package. • Hi-fi audio ADC 96dB SNR - ‘A’ weighted • 2 analogue audio inputs • I2S digital audio interface - sample rates 8kHz to 96kHz • Automatic clocking configuration from MCLK and LRCLK • Integrated voltage reference circuits • 8-pin SOIC package • LCD televisions • Set-top boxes STB • DVD recorders BLOCK DIAGRAM WOLFSON MICROELECTRONICS plc To receive regular email updates, sign up at Production Data, August 2010, Rev Copyright 2010 Wolfson Microelectronics plc WM8783 Production Data TABLE OF CONTENTS DESCRIPTION 1 APPLICATIONS BLOCK DIAGRAM TABLE OF CONTENTS PIN ORDERING INFORMATION PIN DESCRIPTION ABSOLUTE MAXIMUM RECOMMENDED OPERATING CONDITIONS THERMAL PERFORMANCE ELECTRICAL CHARACTERISTICS 7 SIGNAL TIMING REQUIREMENTS SYSTEM CLOCK 8 AUDIO INTERFACE TIMING 9 DEVICE DESCRIPTION 10 ANALOGUE-TO-DIGITAL CONVERTER ADC 10 DIGITAL AUDIO 10 DIGITAL FILTER CHARACTERISTICS ADC FILTER 12 APPLICATIONS INFORMATION RECOMMENDED EXTERNAL 14 AUDIO INPUT 14 POWER SUPPLY DECOUPLING 14 RECOMMENDED EXTERNAL COMPONENTS DIAGRAM 15 PCB LAYOUT 15 PACKAGE DIMENSIONS IMPORTANT NOTICE Production Data WM8783 PIN CONFIGURATION The WM8783 is supplied in a 8-pin SOIC format. The pin configuration is illustrated below, showing the top-down view from above the chip. ORDERING INFORMATION ORDER CODE WM8783GED/V TEMPERATURE RANGE -40°C to +85°C WM8783GED/RV -40°C to +85°C Note Reel quantity = 3000 PACKAGE MOISTURE SENSITIVITY LEVEL 8-pin SOIC Pb-free MSL3 8-pin SOIC Pb-free, tape and reel MSL3 PEAK SOLDERING TEMPERATURE 260oC 260oC PIN DESCRIPTION PIN NO 1 2 3 4 5 6 7 8 NAME ADCDAT MCLK LRCLK AGND VMIDC IN1R IN1L AVDD TYPE Digital Output Digital Input Digital Input Supply Analogue Output Analogue Input Analogue Input Supply DESCRIPTION ADC digital audio data Master clock Audio interface left / right clock Ground Midrail voltage decoupling capacitor Right channel analogue input Left channel analogue input Positive supply WM8783 Production Data ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified. ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device. Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage conditions prior to surface mount assembly. These levels are: MSL1 = unlimited floor life at <30°C / 85% Relative Humidity. Not normally stored in moisture barrier bag. MSL2 = out of bag storage for 1 year at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag. MSL3 = out of bag storage for 168 hours at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag. The Moisture Sensitivity Level for each package type is specified in Ordering Information. CONDITION Supply voltage AVDD Voltage range digital inputs Voltage range analogue inputs Operating temperature range, TA Junction temperature, TJMAX Storage temperature after soldering MIN -0.3V -0.7V -0.7V -40ºC -40ºC -65ºC MAX 4.5V AVDD +0.7V AVDD +0.7V +85ºC +150ºC +150ºC RECOMMENDED OPERATING CONDITIONS PARAMETER Analogue and digital I/O supply range Ground SYMBOL AVDD UNIT Production Data WM8783 THERMAL PERFORMANCE Thermal analysis should be performed in the intended application to prevent the WM8783 from exceeding maximum junction temperature. Several contributing factors affect thermal performance most notably the physical properties of the mechanical enclosure, location of the device on the PCB in relation to surrounding components and the number of PCB layers. Connecting the GND pin through thermal vias and into a large ground plane will aid heat extraction. Three main heat transfer paths exist to surrounding air as illustrated below in Figure 1: - Package top to air radiation . - Package bottom to PCB radiation . - Package pins to PCB conduction . Figure 1 Heat Transfer Paths The temperature rise TR is given by TR = PD * - PD is the power dissipated in the device. - is the thermal resistance from the junction of the die to the ambient temperature and is therefore a measure of heat transfer from the die to surrounding air. is determined with reference to JEDEC standard JESD51-9. The junction temperature TJ is given by TJ = TA +TR, where TA is the ambient temperature. PARAMETER Operating temperature range Operating junction temperature Thermal Resistance Note: SYMBOL TA TJ Junction temperature is a function of ambient temperature and of the device operating conditions. The ambient temperature limits and junction temperature limits must both be observed. UNIT °C °C °C/W WM8783 Production Data ELECTRICAL CHARACTERISTICS Test Conditions AVDD = 3.3V, GND = 0V, TA = +25oC, 1kHz signal, fs = 48kHz, MCLK = 256fs unless otherwise stated. LRCLK transition as per Figure PARAMETER Analogue Inputs IN1L, IN1R Maximum input signal level Input resistance Input capacitance TEST CONDITIONS Single-ended input AVDD/3.3 66 20 UNIT

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Stereo Low Power 96kHz ADC

WM8783

The WM8783 is a compact, low cost ADC designed for set-top boxes and DVD applications.

Stereo analogue inputs accept 1Vrms line level inputs the Hi-Fi ADCs output 24-bit stereo data on the I2S digital audio interface.

Sample rates from 8kHz to 96kHz are supported this is configured automatically according to the external master clock MCLK frequency.

A power on reset POR circuit ensures correct start-up and shut-down. The device is held in reset when MCLK is not present, offering a low-power standby state.

The WM8783 is supplied in an 8-pin SOIC package.
• Hi-fi audio ADC 96dB SNR - ‘A’ weighted
• 2 analogue audio inputs
• I2S digital audio interface - sample rates 8kHz to 96kHz
• Automatic clocking configuration from MCLK and LRCLK
• Integrated voltage reference circuits
• 8-pin SOIC package
• LCD televisions
• Set-top boxes STB
• DVD recorders

BLOCK DIAGRAM

WOLFSON MICROELECTRONICS plc

To receive regular email updates, sign up at

Production Data, August 2010, Rev

Copyright 2010 Wolfson Microelectronics plc

WM8783

Production Data

TABLE OF CONTENTS
DESCRIPTION 1 APPLICATIONS BLOCK DIAGRAM TABLE OF CONTENTS PIN ORDERING INFORMATION PIN DESCRIPTION ABSOLUTE MAXIMUM RECOMMENDED OPERATING CONDITIONS THERMAL PERFORMANCE ELECTRICAL CHARACTERISTICS
7 SIGNAL TIMING REQUIREMENTS

SYSTEM CLOCK 8 AUDIO INTERFACE TIMING 9 DEVICE DESCRIPTION 10 ANALOGUE-TO-DIGITAL CONVERTER ADC 10 DIGITAL AUDIO 10 DIGITAL FILTER CHARACTERISTICS ADC FILTER 12 APPLICATIONS INFORMATION RECOMMENDED EXTERNAL 14

AUDIO INPUT 14

POWER SUPPLY DECOUPLING 14

RECOMMENDED EXTERNAL COMPONENTS DIAGRAM 15

PCB LAYOUT 15 PACKAGE DIMENSIONS IMPORTANT NOTICE

Production Data

WM8783

PIN CONFIGURATION

The WM8783 is supplied in a 8-pin SOIC format. The pin configuration is illustrated below, showing the top-down view from above the chip.
ORDERING INFORMATION

ORDER CODE WM8783GED/V

TEMPERATURE RANGE
-40°C to +85°C

WM8783GED/RV
-40°C to +85°C

Note Reel quantity = 3000

PACKAGE

MOISTURE SENSITIVITY LEVEL
8-pin SOIC Pb-free

MSL3
8-pin SOIC Pb-free, tape and reel

MSL3

PEAK SOLDERING TEMPERATURE 260oC
260oC

PIN DESCRIPTION

PIN NO 1 2 3 4 5 6 7 8

NAME ADCDAT

MCLK LRCLK AGND VMIDC IN1R

IN1L AVDD

TYPE Digital Output Digital Input Digital Input Supply Analogue Output Analogue Input Analogue Input Supply

DESCRIPTION ADC digital audio data Master clock Audio interface left / right clock Ground Midrail voltage decoupling capacitor Right channel analogue input Left channel analogue input Positive supply

WM8783

Production Data

ABSOLUTE MAXIMUM RATINGS

Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified.

ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device.

Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage conditions prior to surface mount assembly. These levels are:

MSL1 = unlimited floor life at <30°C / 85% Relative Humidity. Not normally stored in moisture barrier bag. MSL2 = out of bag storage for 1 year at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag. MSL3 = out of bag storage for 168 hours at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.

CONDITION Supply voltage AVDD Voltage range digital inputs Voltage range analogue inputs Operating temperature range, TA Junction temperature, TJMAX Storage temperature after soldering

MIN -0.3V -0.7V -0.7V -40ºC -40ºC -65ºC

MAX 4.5V AVDD +0.7V AVDD +0.7V +85ºC +150ºC +150ºC

RECOMMENDED OPERATING CONDITIONS

PARAMETER

Analogue and digital I/O supply range

Ground

SYMBOL AVDD

UNIT

Production Data

WM8783

THERMAL PERFORMANCE

Thermal analysis should be performed in the intended application to prevent the WM8783 from exceeding maximum junction temperature. Several contributing factors affect thermal performance most notably the physical properties of the mechanical enclosure, location of the device on the PCB in relation to surrounding components and the number of PCB layers. Connecting the GND pin through thermal vias and into a large ground plane will aid heat extraction.

Three main heat transfer paths exist to surrounding air as illustrated below in Figure 1:
- Package top to air radiation .
- Package bottom to PCB radiation .
- Package pins to PCB conduction .

Figure 1 Heat Transfer Paths

The temperature rise TR is given by TR = PD *
- PD is the power dissipated in the device.
- is the thermal resistance from the junction of the die to the ambient temperature and is therefore a measure of heat transfer from the die to surrounding air. is determined with reference to JEDEC standard JESD51-9.

The junction temperature TJ is given by TJ = TA +TR, where TA is the ambient temperature.

PARAMETER Operating temperature range Operating junction temperature Thermal Resistance Note:

SYMBOL TA TJ

Junction temperature is a function of ambient temperature and of the device operating conditions. The ambient temperature limits and junction temperature limits must both be observed.

UNIT °C °C °C/W

WM8783

Production Data

ELECTRICAL CHARACTERISTICS

Test Conditions

AVDD = 3.3V, GND = 0V, TA = +25oC, 1kHz signal, fs = 48kHz, MCLK = 256fs unless otherwise stated. LRCLK transition as per Figure

PARAMETER

Analogue Inputs IN1L, IN1R

Maximum input signal level

Input resistance

Input capacitance

TEST CONDITIONS Single-ended input

AVDD/3.3
66 20

UNIT

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Datasheet ID: WM8783GED/RV 523278