CP547-PMD19K100-CT
CP547-PMD19K100-CT Datasheet
PROCESS CP547
| Part | Datasheet |
|---|---|
CP547-PMD19K100-CT |
CP547-PMD19K100-CT (pdf) |
| Related Parts | Information |
|---|---|
|
CP547-MJ11013-CT |
CP547-MJ11013-CT |
|
CP547-PMD19K100-WN |
CP547-PMD19K100-WN |
|
CP547-MJ11015-WR |
CP547-MJ11015-WR |
|
CP547-2N6287-CM |
CP547-2N6287-CM |
|
CP547-MJ11015-WN |
CP547-MJ11015-WN |
|
CP547-MJ11015-CTJ28 |
CP547-MJ11015-CTJ28 |
|
CP547-MJ11013-WS |
CP547-MJ11013-WS |
|
CP547-2N6287-WN |
CP547-2N6287-WN |
|
CP547-2N6287-CT |
CP547-2N6287-CT |
|
CP547-PMD19K100-WS |
CP547-PMD19K100-WS |
|
CP547-MJ11015-CT |
CP547-MJ11015-CT |
| PDF Datasheet Preview |
|---|
| PROCESS CP547 Power Transistor PNP - Darlington Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY EPITAXIAL PLANAR 195 x 195 MILS 29 x 29 MILS 61 x 35 MILS Al - Ti/Ni/Au - GROSS DIE PER 5 INCH WAFER 400 PRINCIPAL DEVICE TYPES MJ11011 2N6285 MJ11013 2N6286 MJ11015 2N6287 w. c e n t r a l s e m i c o m R5 22-March 2010 PROCESS CP547 Typical Electrical Characteristics w. c e n t r a l s e m i c o m R5 22-March 2010 BARE DIE PACKING OPTIONS BARE DIE IN TRAY WAFFLE PACK CT Singulated die in tray waffle pack. example CP211-PART NUMBER-CT CM Singulated die in tray waffle pack 100% visually inspected as per MIL-STD-750, method 2072 transistors, method 2073 diodes . example CP211-PART NUMBER-CM UNSAWN WAFER WN Full wafer, unsawn, 100% tested with reject die inked. example CP211-PART NUMBER-WN SAWN WAFER ON PLASTIC RING WR Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. example CP211-PART NUMBER-WR SAWN WAFER ON METAL FRAME WS Full wafer, sawn and mounted on metal frame, 100% tested with reject die inked. example CP211-PART NUMBER-WS w. c e n t r a l s e m i c o m R0 7-December 2015 OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management Customer portals • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples 2nd day air • Special wafer diffusions |
| More datasheets: HMC285E | 103240-HMC285 | 37790 | 37792 | 37793 | TN01 025 0001 2 | AOD512 | 120018 | CP547-MJ11013-CT | CP547-PMD19K100-WN |
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