CP547-MJ11013-WS

CP547-MJ11013-WS Datasheet


PROCESS CP547

Part Datasheet
CP547-MJ11013-WS CP547-MJ11013-WS CP547-MJ11013-WS (pdf)
Related Parts Information
CP547-MJ11013-CT CP547-MJ11013-CT CP547-MJ11013-CT
CP547-PMD19K100-WN CP547-PMD19K100-WN CP547-PMD19K100-WN
CP547-PMD19K100-CT CP547-PMD19K100-CT CP547-PMD19K100-CT
CP547-MJ11015-WR CP547-MJ11015-WR CP547-MJ11015-WR
CP547-2N6287-CM CP547-2N6287-CM CP547-2N6287-CM
CP547-MJ11015-WN CP547-MJ11015-WN CP547-MJ11015-WN
CP547-MJ11015-CTJ28 CP547-MJ11015-CTJ28 CP547-MJ11015-CTJ28
CP547-2N6287-WN CP547-2N6287-WN CP547-2N6287-WN
CP547-2N6287-CT CP547-2N6287-CT CP547-2N6287-CT
CP547-PMD19K100-WS CP547-PMD19K100-WS CP547-PMD19K100-WS
CP547-MJ11015-CT CP547-MJ11015-CT CP547-MJ11015-CT
PDF Datasheet Preview
PROCESS CP547

Power Transistor

PNP - Darlington Chip

PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization

GEOMETRY

EPITAXIAL PLANAR 195 x 195 MILS 29 x 29 MILS 61 x 35 MILS Al - Ti/Ni/Au -

GROSS DIE PER 5 INCH WAFER 400

PRINCIPAL DEVICE TYPES MJ11011 2N6285 MJ11013 2N6286 MJ11015 2N6287
w. c e n t r a l s e m i c o m

R5 22-March 2010

PROCESS CP547

Typical Electrical Characteristics
w. c e n t r a l s e m i c o m

R5 22-March 2010

BARE DIE PACKING OPTIONS

BARE DIE IN TRAY WAFFLE PACK CT Singulated die in tray waffle pack.
example CP211-PART NUMBER-CT

CM Singulated die in tray waffle pack 100% visually inspected as per MIL-STD-750, method 2072 transistors, method 2073 diodes .
example CP211-PART NUMBER-CM

UNSAWN WAFER WN Full wafer, unsawn, 100% tested with reject die inked.
example CP211-PART NUMBER-WN

SAWN WAFER ON PLASTIC RING

WR Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked.
example CP211-PART NUMBER-WR

SAWN WAFER ON METAL FRAME

WS Full wafer, sawn and mounted on metal frame, 100% tested with reject die inked.
example CP211-PART NUMBER-WS
w. c e n t r a l s e m i c o m

R0 7-December 2015

OUTSTANDING SUPPORT AND SUPERIOR SERVICES

PRODUCT SUPPORT

Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management Customer portals
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options

DESIGNER SUPPORT/SERVICES

Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples 2nd day air
• Special wafer diffusions
More datasheets: TN01 025 0001 2 | AOD512 | 120018 | CP547-MJ11013-CT | CP547-PMD19K100-WN | CP547-PMD19K100-CT | CP547-MJ11015-WR | CP547-2N6287-CM | CP547-MJ11015-WN | CP547-MJ11015-CTJ28


Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived CP547-MJ11013-WS Datasheet file may be downloaded here without warranties.

Datasheet ID: CP547-MJ11013-WS 522775