HSMF-C116

HSMF-C116 Datasheet


HSMF-C116 Ultra Small Surface Mount Tricolor ChipLED

Part Datasheet
HSMF-C116 HSMF-C116 HSMF-C116 (pdf)
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HSMF-C116 Ultra Small Surface Mount Tricolor ChipLED

Data Sheet
• LED with AlInGaP and InGaN die
• Surface mount device with ultra small x 1.0mm
footprint
• Suitable for application that requires small pitch size
• Compatible with reflow soldering
• Taped in 8mm carrier tape on a 7 inch diameter reel
• Display
• Backlighting
• Indicator

Package Dimensions

Notes All dimensions in millimeters. Tolerance is ±0.1mm unless otherwise specified.

CAUTION This LED is class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details.

Absolute Maximum Ratings TJ = 25°C

Parameter

AlInGaP Red

InGaN Green

InGaN Blue

Unit

DC Forward Current [1]

Peak Forward Current [2]

Power Dissipation

LED Junction Temperature

Operating Temperature Range
-40 to 85

Storage Temperature Range
-40 to 85

Notes Derate linearly as shown in Figure 1/10 duty factor and 0.1ms pulse width.

Optical Characteristics TJ = 25°C, R=10mA, G/B=5mA

Color

Luminous Intensity,

Iv mcd [1]

Peak Wavelength, λp nm

Dominant Wavelength, λd nm [2]

Viewing Angle, ° [3]

Min.

Typ.

Max.

Typ.

Typ.

Typ.

Green

Blue

Notes The luminous intensity is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not
be aligned with the axis. The dominant wavelength is derived from the CIE chromaticity diagram and represents the perceived color of the device. Θ1/2 is the off axis angle where the luminous intensity is the peak intensity.

Electrical Characteristics TJ = 25°C, R=10mA, G/B=5mA
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Datasheet ID: HSMF-C116 520401