EK54

EK54 Datasheet

EK54

Part	Datasheet
EK54	EK54 (pdf)

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MICROTECHNOLOGY EVALUATION KIT FOR PA60DK EK54 800 546-APEX 800 546-2739 INTRODUCTION Fast and easy breadboarding of circuits using the PA60DK is possible with the EK54 evaluation kit. The EK54 includes both the universal EVAL36 board and the EVAL46 substrate. The use of EVAL36 and EVAL46 allows for a large area of breadboarding space to work with while allowing a surface mount substrate for the PA60DK. The PA60DK may be surface mounted directly to the EVAL46, a thermally conductive but electrically isolated substrate. The PA60DK is soldered to a DUT foil footprint area the size of the heatslug as shown in Figure The metal substrate is cost effective and can allow the PA60DK to dissipate power up to the datasheet rating. Part# EVAL36 EVAL46 TSM-116-01-T-SV SSW-116-01-T-S PCE2055CT-ND OX7R105KWN 031606 Quantity Universal PC Board Evaluation substrate, PA60DK 1 Terminal Strip, 16 PIN Socket Strip, 16 PIN CAP, 47uF, 50V Cap, 200V, 1uF, Ceramic 5V, 10mA, 3.4°C/W heatsink with fan, AAVID Parts are not supplied. Parts are application dependant. Suggested part numbers are provided. Figure 1 NC -INA +INA +INB -INB NC J1 C2 M I C RO T EC H NO LOGY 1 -VS NC -IN A +IN A NC +IN B -IN B NC 20 -VS NC OUT A NC +VS +VS NC OUT B NC EVAL46 TOP 2 PLACES BEFORE YOU GET STARTED • All Apex amplifiers should be handled using ESD precaution. • Always provide the appropriate heat sinking. Power dissipation must be considered to ensure maximum junction temperature TJ is not exceeded. • Always use adequate power supply bypass capacitors, Apex recommends at least 10µF per amp of output current. • Do not change connections while the circuit is powered • In case -Vs is disconnected before +Vs, a diode between -Vs and ground is recommended to avoid damage. • Initially set all power supplies to the minimum operating levels allowed in the product datasheet. • Check for oscillations up to and above the unity gain bandwidth of the ASSEMBLY The PA60DK is a surface mount device and should be assembled to the EVAL46 substrate using surface mount processes. Solder paste may be dispensed or screen-printed on the DUT pads. The heat slug on the back of the PA60DK provides maximum heat dissipation capabilities when soldered to the foil footprint area. The PA60DK should be to the substrate using a solder furnace. If this is not available,

PDF Datasheet Preview

MICROTECHNOLOGY

EVALUATION KIT FOR PA60DK

EK54
800 546-APEX 800 546-2739

INTRODUCTION

Fast and easy breadboarding of circuits using the PA60DK is possible with the EK54 evaluation kit. The EK54 includes both the universal EVAL36 board and the EVAL46 substrate. The use of EVAL36 and EVAL46 allows for a large area of breadboarding space to work with while allowing a surface mount substrate for the PA60DK. The PA60DK may be surface mounted directly to the EVAL46, a thermally conductive but electrically isolated substrate. The PA60DK is soldered to a DUT foil footprint area the size of the heatslug as shown in Figure The metal substrate is cost effective and can allow the PA60DK to dissipate power up to the datasheet rating.

Part# EVAL36 EVAL46 TSM-116-01-T-SV SSW-116-01-T-S PCE2055CT-ND OX7R105KWN *031606

Quantity

Universal PC Board

Evaluation substrate, PA60DK 1

Terminal Strip, 16 PIN

Socket Strip, 16 PIN

CAP, 47uF, 50V

Cap, 200V, 1uF, Ceramic
5V, 10mA, 3.4°C/W
heatsink with fan, AAVID
* Parts are not supplied. Parts are application dependant. Suggested part numbers are provided.

Figure 1

NC -INA +INA +INB -INB NC

J1 C2

M I C RO T EC H NO LOGY
1 -VS NC -IN A +IN A NC +IN B -IN B NC
20 -VS NC OUT A NC +VS +VS NC OUT B NC

EVAL46 TOP
2 PLACES

BEFORE YOU GET STARTED
• All Apex amplifiers should be handled using ESD precaution.
• Always provide the appropriate heat sinking. Power dissipation must be considered to ensure maximum junction temperature TJ is not exceeded.
• Always use adequate power supply bypass capacitors, Apex recommends at least 10µF per amp of output current.
• Do not change connections while the circuit is powered
• In case -Vs is disconnected before +Vs, a diode between
-Vs and ground is recommended to avoid damage.
• Initially set all power supplies to the minimum operating
levels allowed in the product datasheet.
• Check for oscillations up to and above the unity gain
bandwidth of the

ASSEMBLY

The PA60DK is a surface mount device and should be
assembled to the EVAL46 substrate using surface mount
processes. Solder paste may be dispensed or screen-printed
on the DUT pads. The heat slug on the back of the PA60DK
provides maximum heat dissipation capabilities when soldered
to the foil footprint area. The PA60DK should be to the
substrate using a solder furnace. If this is not available,

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EK54

EK54 Datasheet

Datasheet ID: EK54 523223