BD170240N50100AHF
BD170240N50100AHF Datasheet
Model BD170240N50100AHF
| Part | Datasheet |
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BD170240N50100AHF |
BD170240N50100AHF (pdf) |
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| Model BD170240N50100AHF Ultra Low Profile 0404 Balun to Balanced The BD170240N50100AHF is a low cost, low profile sub-miniature unbalanced to balanced transformer designed for differential inputs and output locations on modern chipsets in an easy to use surface mount package for applications including point-to-point radio and wideband GaN. The BD170240N50100AHF is ideal for high volume manufacturing and delivers higher performance than traditional ceramic baluns. The BD170240N50100AHF has an unbalanced port impedance of and a balanced port impedance. This transformation enables single ended signals to be applied to differential ports on modern integrated chipsets. The output ports have equal amplitude -3dB with 180 degree phase differential. The BD170240N50100AHF is available on tape and reel for pick and place high volume manufacturing. Detailed Electrical Specifications subject to change without notice. ROOM 25C Features: Parameter Min. Typ. Max • GHz Frequency • Thin Height Profile • Ultra Low Insertion Loss • Surface Mountable • Tape & Reel • RoHS Compliant • Halogen Free • -55°C to 85°C Unbalanced Port Impedance Balanced Port Impedance Return Loss Insertion Loss* Amplitude Balance Phase Balance CMRR Power Handling Operating Temperature * Insertion Loss stated at room temperature Insertion Loss is approximately dB higher at +85 ºC Outline Drawing Top View Near-side Dimensions are in Millimeters Mechanical Outline Side View .5T6B±.D06 Pin Designation GND / DC Feed + RF GND 2 Unbalanced Port 3 Balanced Port 4 Balanced Port Bottom View Far-side Tolerances are Non-Cumulative Unit GHz dB Degrees dB Watts ºC Visit us at USA/Canada Toll Free Europe Asia: 315 432-8909 800 411-6596 +44 2392-232392 +86 512-62749282 Model BD170240N50100AHF Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from organic PTFE based composites which possess excellent electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier. An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. With No DC Bias 3x Transmission Line Plated thru hole to ground Circuit Pattern Footprint Pad s Solder Resist Dimensions are in Millimeters Mounting Footprint Packaging and Ordering Information Parts are available in reel and are packaged per EIA 481-D. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4000 per reel. Visit us at USA/Canada Toll Free Europe Asia: 315 432-8909 800 411-6596 +44 2392-232392 +86 512-62749282 |
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