10078554-101LF

10078554-101LF Datasheet

The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs consisting of 12 insertmolded leadframe assemblies IMLAs , each supporting 6 high-speed differential signal pairs - provides the maximum density available by delivering differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. The 6-pair ZipLine signal IMLAs can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density.

Part	Datasheet
10078554-101LF	10078554-101LF (pdf)

PDF Datasheet Preview
BACKPANEL CONNECTORS ZIPLINE HIGH-DENSITY, HIGH-PERFORMANCE CONNECTOR SYSTEM The ZipLine connector system addresses customer demand for maximum signal density a paramount requirement for future equipment platforms at data rates up to Gb/s. The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs consisting of 12 insertmolded leadframe assemblies IMLAs , each supporting 6 high-speed differential signal pairs - provides the maximum density available by delivering differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. The 6-pair ZipLine signal IMLAs can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density. The connector system leverages FCI proven AirMax technology, similar signal integrity performance, power and guide modules and Hard Metric HM equipment design practice. ZipLine connectors use AirMax VS edge-coupling technology to deliver low insertion loss and crosstalk without using costly and space-consuming metal shields. Data rates can scale up to Gb/s without requiring the redesign of a basic platform. In addition to offering superior signal density and electrical performance, the versatile ZipLine design allows for mixed differential orthogonal or backplane , single-ended or power pin assignments within a connector. Another unique feature is a special power wafer, with up to 36A capacity, which can be integrated in a 6-pair ZipLine module. Supports backplane and orthogonal midplane applications 6-pair modules with IMLAs on 1.8mm column pitch deliver differential pairs per inch of card edge while allowing a minimum 1-inch card slot pitch 6-pair modules can also be configured on 1.5mm column pitch to provide >100 pairs per inch for even more density 3-pair configuration is under development to enable use on 15mm card slot pitch Provides maximum signal density available at data rates up to Gb/s Use AirMax edge-coupling technology to deliver low insertion loss and crosstalk Allows for mixed differential orthogonal or backplane , single-ended or power pin assignments within a connector A special power wafer, with up to 36A capacity, can be integrated within a 6-pair module Compatible with Hard Metric equipment practice TARGET MARKETS / APPLICATIONS Communications • Routers • Switches • Networking • Access • Transport Data • Servers • Storage Systems Industrial • Medical • Test & Measurement ZIPLINE HIGH-DENSITY, HIGH-PERFORMANCE CONNECTOR SYSTEM TECHNICAL INFORMATION MATERIALS Contacts Copper alloy Plating • Performance-based plating at separable interface Telcordia GR-1217 CORE Central Office • Tin-lead or tin over nickel on press-fit tails Housings High-temperature thermoplastic, UL 94V-0 IMLA organizer Stainless steel MECHANICAL PERFORMANCE Mating force 0.45N maximum per contact Unmating force 0.15N minimum per contact Press-fit insertion force 25N maximum per tail ENVIRONMENTAL Telcordia GR-1217-CORE, Central Office qualification pending SPECIFICATIONS Product specification GS-12-452 Application specification GS-20-094 APPROVALS AND CERTIFICATIONS UL and CSA approvals pending ELECTRICAL PERFORMANCE Backplane connectors • Differential impedance 100 ± 60 ps 20-80% risetime • Differential insertion loss • < dB through Gb/s GHz • < dB through Gb/s GHz • NEXT 60 ps 20-80% risetime • FEXT 60 ps 20-80% risetime • In-pair skew 4 ps Orthogonal midplane connectors • Differential impedance 100 ± 60 ps 20-80% risetime • Differential insertion loss • < dB through Gb/s GHz • < dB through Gb/s GHz • NEXT • < -30 dB through Gb/s GHz • < -25 dB through Gb/s GHz • FEXT • < -30 dB through Gb/s GHz • < -25 dB through Gb/s GHz Contact resistance • Signal contact 130 initial • Power contact 4 initial Current rating with temperature rise above ambient • Signal contact 0.25A/contact with all contacts powered • 6-contact power wafer 6A/contact 36A/wafer with single wafer powered, 4.5A/contact 27A/wafer with 2 adjacent wafers powered, 2.25A/contact 13.5A/wafer with 12 adjacent wafers powered PART NUMBERS Part Number 10076197-101LF 10076209-101LF 10076222-101LF 10084164-101LF 10084164-102LF 10084166-101LF 10084166-103LF Description 6 pairs/column x 12 columns 72 differential pairs vertical backplane header 6 pairs/column x 12 columns 72 differential pairs right-angle receptacle 6 pairs/column x 12 columns 72 differential pairs orthogonal midplane header 1 power wafer + 6 pairs/column x 11 columns 66 differential pairs right-angle receptacle 2 power wafers + 6 pairs/column x 10 columns 60 differential pairs right-angle receptacle 1 power wafer + 6 pairs/column x 11 columns 66 differential pairs vertical backplane header 2 power wafers + 6 pairs/column x 10 columns 60 differential pairs vertical backplane header Printed on recyclable paper ELX1ZIPLINE0308ELT Use web link to obtain product drawings and additional technical information or contact us at FCI - Americas 1 800 237 2374 - Europe 33 1 39 49 21 83 - Asia/Pacific 65 6549 6666

PDF Datasheet Preview

BACKPANEL CONNECTORS

ZIPLINE HIGH-DENSITY, HIGH-PERFORMANCE CONNECTOR SYSTEM

The ZipLine connector system addresses customer demand for maximum signal density a paramount requirement for future equipment platforms at data rates up to Gb/s.

The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs consisting of 12 insertmolded leadframe assemblies IMLAs , each supporting 6 high-speed differential signal pairs - provides the maximum density available by delivering differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. The 6-pair ZipLine signal IMLAs can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density.

The connector system leverages FCI proven AirMax technology, similar signal integrity performance, power and guide modules and Hard Metric HM equipment design practice. ZipLine connectors use AirMax VS edge-coupling technology to deliver low insertion loss and crosstalk without using costly and space-consuming metal shields. Data rates can scale up to Gb/s without requiring the redesign of a basic platform.

In addition to offering superior signal density and electrical performance, the versatile ZipLine design allows for mixed differential orthogonal or backplane , single-ended or power pin assignments within a connector. Another unique feature is a special power wafer, with up to 36A capacity, which can be integrated in a 6-pair ZipLine module.

Supports backplane and orthogonal midplane applications 6-pair modules with IMLAs on 1.8mm column pitch deliver differential pairs per inch of card edge while allowing a minimum 1-inch card slot pitch 6-pair modules can also be configured on 1.5mm column pitch to provide >100 pairs per inch for even more density 3-pair configuration is under development to enable use on 15mm card slot pitch Provides maximum signal density available at data rates up to Gb/s Use AirMax edge-coupling technology to deliver low insertion loss and crosstalk Allows for mixed differential orthogonal or backplane , single-ended or power pin assignments within a connector A special power wafer, with up to 36A capacity, can be integrated within a 6-pair module Compatible with Hard Metric equipment practice

TARGET MARKETS / APPLICATIONS

Communications
• Routers
• Switches
• Networking
• Access
• Transport

Data
• Servers
• Storage Systems

Industrial
• Medical
• Test & Measurement

ZIPLINE HIGH-DENSITY, HIGH-PERFORMANCE CONNECTOR SYSTEM

TECHNICAL INFORMATION

MATERIALS

Contacts Copper alloy Plating
• Performance-based plating at separable interface Telcordia GR-1217 CORE Central Office
• Tin-lead or tin over nickel on press-fit tails Housings High-temperature thermoplastic, UL 94V-0 IMLA organizer Stainless steel

MECHANICAL PERFORMANCE

Mating force 0.45N maximum per contact Unmating force 0.15N minimum per contact Press-fit insertion force 25N maximum per tail

ENVIRONMENTAL

Telcordia GR-1217-CORE, Central Office qualification pending

SPECIFICATIONS

Product specification GS-12-452 Application specification GS-20-094

APPROVALS AND CERTIFICATIONS

UL and CSA approvals pending

ELECTRICAL PERFORMANCE

Backplane connectors
• Differential impedance 100 ± 60 ps 20-80% risetime
• Differential insertion loss
• < dB through Gb/s GHz
• < dB through Gb/s GHz
• NEXT 60 ps 20-80% risetime
• FEXT 60 ps 20-80% risetime
• In-pair skew 4 ps Orthogonal midplane connectors
• Differential impedance 100 ± 60 ps 20-80% risetime
• Differential insertion loss
• < dB through Gb/s GHz
• < dB through Gb/s GHz
• NEXT
• < -30 dB through Gb/s GHz
• < -25 dB through Gb/s GHz
• FEXT
• < -30 dB through Gb/s GHz
• < -25 dB through Gb/s GHz Contact resistance
• Signal contact 130 initial
• Power contact 4 initial Current rating with temperature rise above ambient
• Signal contact 0.25A/contact with all contacts powered
• 6-contact power wafer 6A/contact 36A/wafer with single wafer powered, 4.5A/contact 27A/wafer with 2 adjacent wafers powered, 2.25A/contact 13.5A/wafer with 12 adjacent wafers powered

PART NUMBERS

Part Number 10076197-101LF 10076209-101LF 10076222-101LF 10084164-101LF 10084164-102LF 10084166-101LF 10084166-103LF

Description 6 pairs/column x 12 columns 72 differential pairs vertical backplane header 6 pairs/column x 12 columns 72 differential pairs right-angle receptacle 6 pairs/column x 12 columns 72 differential pairs orthogonal midplane header 1 power wafer + 6 pairs/column x 11 columns 66 differential pairs right-angle receptacle 2 power wafers + 6 pairs/column x 10 columns 60 differential pairs right-angle receptacle 1 power wafer + 6 pairs/column x 11 columns 66 differential pairs vertical backplane header 2 power wafers + 6 pairs/column x 10 columns 60 differential pairs vertical backplane header

Printed on recyclable paper

ELX1ZIPLINE0308ELT

Use web link to obtain product drawings and additional technical information or contact us at

FCI - Americas 1 800 237 2374 - Europe 33 1 39 49 21 83 - Asia/Pacific 65 6549 6666

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 10078554-101LF Datasheet file may be downloaded here without warranties.

Datasheet ID: 10078554-101LF 635138