AS6C8016A-55ZIN

AS6C8016A-55ZIN Datasheet

AS6C8016A

Part	Datasheet
AS6C8016A-55ZIN	AS6C8016A-55ZIN (pdf)

Related Parts	Information
AS6C8016A-55ZINTR	AS6C8016A-55ZINTR

PDF Datasheet Preview
AUGUST 2010 AS6C8016A 512K X 16 BIT LOW POWER CMOS SRAM GENERAL DESCRIPTION • Process Technology 0.15um Full CMOS • Organization 512K x 16 bit • Power Supply Voltage 2.7V ~ 3.6V • Low Data Retention Voltage 1.5V Min. • Three state output and TTL Compatible • Package Type 48-FPBGA, 44-TSOP2 The AS6C8016A is fabricated by Alliance ' s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also support low data retention voltage for battery backup operation with low data retention current. PRODUCT FAMILY Product Family Operating Temperature Vcc Range Speed AS6C8016A-55BIN AS6C8016A-55ZIN Industrial -40 ~ 85oC ~ V 55 ns Power Dissipation Standby Operating ISB1, Typ. ICC1.Max. 2 uA1 PKG Type KGD 48-FPBGA 44-TSOP2 Typical values are measured at Vcc=3.3V, TA=25oC and not 100% tested. FUNCTIONAL BLOCK DIAGRAM Pre-charge Circuit A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 DQ0 ~ DQ7 DQ8 ~ DQ15 Row Select VCC VSS Memory Array 2048 x 4096 Data Cont I/O Circuit Data Cont Column Select A11 A12 A13 A14 A15 A16 A17 A18 Control Logic EM681FV16B Family Low Power, 512Kx16 SRAM AUGUST 2010 512K X 16 BIT LOW POWER CMOS SRAM AS6C8016A PIN CONFIGURATIONS ORDERING INFORMATION AS6C8016A Alliance AS6C8016A -55ZIN AS6C8016A -55BIN Organization VCC Range 512K x 16 512K x 16 - 3.6V - 3.6V Package 44pin TSOP II 48ball FBGA Operating Temp Speed ns Industrial ~ -40 C - 85 C 55 Industrial ~ -40 C - 85 C 55 PART NUMBERING SYSTEM EMLSI Memory Device Type Density Function Technology Operating Voltage Power Speed Package Version Organization AS6C 8016 Device Number power SRAM prefix 80 = 8M 16 = x16 Access Time Package Option Temperature Range Z - 44pin TSOP I = Industrial B = 48ball FBGA -40 to + 85 C N = Lead Free RoHS compliant part ORDERING INFORMATION Alliance Organization AS6C8016A -55ZIN AS6C8016A -55BIN 512K x 16 512K x 16 VCC Range - 5.5V - 5.5V Package 44pin TSOP II 48ball FBGA Operating Temp Speed ns Industrial ~ -40 C - 85 C 55 Industrial ~ -40 C - 85 C 55 PART NUMBERING SYSTEM AS6C low power SRAM prefix 8016 Device Number 80 = 8M 16 = x16 Access Time Package Option Z - 44pin TSOP B = 48ball TFBGA Temperature Range I = Industrial N = Lead Free RoHS -40 to + 85 C compliant part Alliance Memory, Inc Taylor Way, San Carlos, CA 94070, USA Phone 650-610-6800 Fax 650-620-9211 Copyright Alliance Memory All Rights Reserved Copyright 2007 Alliance Memory, Inc. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks ofAlliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to thisdocument and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The datacontained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at anytime, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information inthis product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide,any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of anyproduct described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability orwarranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to inAlliance's Terms and Conditions of Sale which are available from Alliance . All sales of Alliance products are made exclusively according to Alliance'sTerms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights mask works rights,trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components inlife-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion ofAlliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against allclaims arising from such use. Memory Component Device Type 76 ------------------------------ LSoTRwAPMower SRAM C --------------- CellularRAM 1Densit--y------------- 1M 2 --------------- 2M 4 --------------- 4M 8 --------------- 8M 3126 ------------------------------ 3126MM 64 --------------- 64M 28 --------------- 128M Option 0 --------------- Dual CS 1 --------------- Single CS TFechn-o-l--o--g-y-------- Full CMOS Operating Voltage TV ------------------------------ 35..30VV U --------------- 3.0V S --------------- 2.5V R --------------- 2.0V P --------------- 1.8V Organization 8 --------------- X8 bit 3126 ------------------------------ XX3126 bbiitt Version Blank--------------- Mother die A --------------- 2 nd generation CB ------------------------------ 43 trhd ggeenneerraattiioonn D --------------- 5 th generation E --------------- 6 th generation FG ------------------------------ 87 tthh ggeenneerraattiioonn Package Blank--------------- KGD, FBGA

PDF Datasheet Preview

AUGUST 2010

AS6C8016A
512K X 16 BIT LOW POWER CMOS SRAM GENERAL DESCRIPTION
• Process Technology 0.15um Full CMOS
• Organization 512K x 16 bit
• Power Supply Voltage 2.7V ~ 3.6V
• Low Data Retention Voltage 1.5V Min.
• Three state output and TTL Compatible
• Package Type 48-FPBGA, 44-TSOP2

The AS6C8016A is fabricated by Alliance ' s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also support low data retention voltage for battery backup operation with low data retention current.

PRODUCT FAMILY

Product Family

Operating Temperature

Vcc Range

Speed

AS6C8016A-55BIN AS6C8016A-55ZIN

Industrial -40 ~ 85oC ~ V
55 ns

Power Dissipation

Standby Operating ISB1, Typ. ICC1.Max.
2 uA1

PKG Type

KGD 48-FPBGA 44-TSOP2

Typical values are measured at Vcc=3.3V, TA=25oC and not 100% tested.

FUNCTIONAL BLOCK DIAGRAM

Pre-charge Circuit

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10

DQ0 ~ DQ7

DQ8 ~ DQ15

Row Select

VCC VSS

Memory Array
2048 x 4096

Data

Cont

I/O Circuit

Data

Cont

Column Select

A11 A12 A13 A14 A15 A16 A17 A18

Control Logic

EM681FV16B Family Low Power, 512Kx16 SRAM

AUGUST 2010
512K X 16 BIT LOW POWER CMOS SRAM

AS6C8016A

PIN CONFIGURATIONS
ORDERING INFORMATION

AS6C8016A

Alliance

AS6C8016A -55ZIN AS6C8016A -55BIN

Organization

VCC Range
512K x 16 512K x 16
- 3.6V - 3.6V

Package
44pin TSOP II 48ball FBGA

Operating Temp

Speed ns

Industrial ~ -40 C - 85 C 55 Industrial ~ -40 C - 85 C 55

PART NUMBERING SYSTEM

EMLSI Memory Device Type Density Function Technology Operating Voltage

Power Speed Package Version Organization

AS6C
8016

Device Number
power SRAM prefix
80 = 8M 16 = x16

Access Time

Package Option Temperature Range

Z - 44pin TSOP I = Industrial B = 48ball FBGA -40 to + 85 C

N = Lead Free RoHS compliant part
ORDERING INFORMATION

Alliance

Organization

AS6C8016A -55ZIN AS6C8016A -55BIN
512K x 16 512K x 16

VCC Range
- 5.5V - 5.5V

Package
44pin TSOP II 48ball FBGA

Operating Temp

Speed ns

Industrial ~ -40 C - 85 C 55 Industrial ~ -40 C - 85 C 55

PART NUMBERING SYSTEM

AS6C
low power SRAM prefix
8016

Device Number 80 = 8M 16 = x16

Access Time

Package Option Z - 44pin TSOP B = 48ball TFBGA

Temperature Range I = Industrial

N = Lead Free RoHS
-40 to + 85 C
compliant part

Alliance Memory, Inc Taylor Way, San Carlos, CA 94070, USA Phone 650-610-6800 Fax 650-620-9211

Copyright Alliance Memory All Rights Reserved

Copyright 2007 Alliance Memory, Inc. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks ofAlliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to thisdocument and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The datacontained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at anytime, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information inthis product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide,any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of anyproduct described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability orwarranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to inAlliance's Terms and Conditions of Sale which are available from Alliance . All sales of Alliance products are made exclusively according to Alliance'sTerms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights mask works rights,trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components inlife-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion ofAlliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against allclaims arising from such use.

Memory Component

Device Type
76 ------------------------------ LSoTRwAPMower SRAM C --------------- CellularRAM
1Densit--y------------- 1M 2 --------------- 2M 4 --------------- 4M 8 --------------- 8M
3126 ------------------------------ 3126MM 64 --------------- 64M 28 --------------- 128M

Option 0 --------------- Dual CS 1 --------------- Single CS

TFechn-o-l--o--g-y-------- Full CMOS

Operating Voltage

TV ------------------------------ 35..30VV U --------------- 3.0V S --------------- 2.5V R --------------- 2.0V P --------------- 1.8V

Organization 8 --------------- X8 bit
3126 ------------------------------ XX3126 bbiitt

Version Blank--------------- Mother die A --------------- 2 nd generation

CB ------------------------------ 43 trhd ggeenneerraattiioonn D --------------- 5 th generation E --------------- 6 th generation

FG ------------------------------ 87 tthh ggeenneerraattiioonn

Package Blank--------------- KGD, FBGA

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Datasheet ID: AS6C8016A-55ZIN 516140