5514-25
5514-25 Datasheet
3M Thermally Conductive Interface Silicone Pad 5514
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5514-25 |
5514-25 (pdf) |
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5514-20 |
5514-20 |
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| Preliminary Technical Data January 2011 3M Thermally Conductive Interface Silicone Pad 5514 Developmental Status Notice 3M Thermally Conductive Interface Silicone Pad 5514 is a 3M developmental product. It is currently available on a limited basis and is only provided for market and technical evaluation. The future availability, formulation, performance properties, and pricing for the material are not guaranteed and are subject to change. To discuss your evaluation, please contact your local 3M Technical Service. Product Description Note The data presented in this preliminary data sheet are 3M’s best estimates for the current product construction being evaluated. While this product is being developed for general commercialization, this product is still considered developmental at this time and changes in product construction or process conditions may occur that can cause subsequent changes in product characteristics or performance. User should consult with 3M before making any business plans in reliance upon the future availability or the current properties of this product. 3M Thermally Conductive Interface Silicone Pad 5514 has good softness for good gap filling performance and reliable dimensional stability that is useful for complicated pattern making through the die cutting process. The Pad 5514 product was originally designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. The Pad 5514 product is a thermally conductive silicone interface pad product and it consists of a highly conformable and tacky silicone elastomeric sheet filled with thermally conductive ceramic particles which provide good thermal heat transfer and electrical insulation performance. Product Uses This product can be used for heat management of electronic devices and joining/stacking parts in electronic components. 3M Thermally Conductive Interface Silicone Pad 5514 Key Features • Thin for lower thermal impedance, 0.20mm and 0.25mm thick products available • Excellent softness and conformability even to non-flat surfaces • Good dimensional stability to improve the converting process and ease to make complex die cut patterns • Good thermal conductivity • Excellent electrical insulation properties • High pressure relaxation capability • Surface tack allows pre-assembly Product Construction 3M Thermally Conductive Interface Silicone Pad 5514-20 25 Standard thickness excluding liner mm Removable Film liner Thermally conductive silicone elastomer Removable Film liner Application Ideas • IC Packaging Heat Conduction • Printed Circuit Board • Spacer for Battery Module/Pack • Heat Sink by Aluminum, other metal and ceramic • COF Chip Heat Conduction • LED Board TIM • HD TV Address IC Chip and Scan Module • Thin Gap Filling between board, module and chassis Mechanical fastening such as clamp, bracket, screw and additional tapes and adhesives bonding can be used in parallel with this pad. 3M Thermally Conductive Interface Silicone Pad 5514 Typical Physical Properties and Performance Characteristics Note The following technical information and data is based upon limited 3M testing conditions and should not be used for specification purposes. Property 3M Thermally Conductive Interface Silicone Pad 5514-20 / 5514-25 Method Value Thickness mm / ±0.025mm Thermal Conductivity W/mK * QTM-500 Flammability* UL 94 V-0 Passed 3M Internal FR Test Density g/cm3, 25°C * TS-TM-441 Hardness Shore 00 * ASTM D2240 55 ±10 Volume Resistivity ASTM D257 |
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