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SFU9220TU_F080 (pdf) |
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SFU9220TU_AM002 |
PDF Datasheet Preview |
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Advanced Power MOSFET SFR/U9220 Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current 10 µA Max. VDS = -200V Lower RDS ON Typ. BVDSS = -200 V RDS on = ID = A D-PAK I-PAK Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt TJ , TSTG Characteristic Drain-to-Source Voltage Continuous Drain Current TC=25oC Continuous Drain Current TC=100oC Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation TA=25oC * Total Power Dissipation TC=25oC Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8“ from case for 5-seconds Gate Drain Source Value -200 -12 +_ 30 256 30 - 55 to +150 Units V A V mJ A mJ V/ns W/oC Thermal Resistance Characteristic Typ. Junction-to-Case Junction-to-Ambient * Junction-to-Ambient * When mounted on the minimum pad size recommended PCB Mount . Max. 50 110 Units oC/W 1999 Fairchild Semiconductor Corporation SFR/U9220 P-CHANNEL POWER MOSFET Electrical Characteristics TC=25oC unless otherwise specified |
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