CB1C-10S-1.5H-EJR(59)

CB1C-10S-1.5H-EJR(59) Datasheet

CB1 Series

Part	Datasheet
CB1C-10S-1.5H-EJR(59)	CB1C-10S-1.5H-EJR(59) (pdf)

Related Parts	Information
CB1EB-10S-1.5H-PEJC2(52)	CB1EB-10S-1.5H-PEJC2(52)
CB1EBG-10S-1.5H-PEJC2(52)	CB1EBG-10S-1.5H-PEJC2(52)
CB1A-10S-1.5H(57)	CB1A-10S-1.5H(57)
CB1AA-10S-1.5H(57)	CB1AA-10S-1.5H(57)
CB1A-10S-1.5H(52)	CB1A-10S-1.5H(52)
CB1C-10S-1.5H-EJL(56)	CB1C-10S-1.5H-EJL(56)
CB1C-10S-1.5H-EJL(52)	CB1C-10S-1.5H-EJL(52)
CB1AC-10S-1.5H(52)	CB1AC-10S-1.5H(52)
CB1AA-10S-1.5H(52)	CB1AA-10S-1.5H(52)
CB1AC-10S-1.5H(57)	CB1AC-10S-1.5H(57)
CB1C-10S-1.5H-EJR(52)	CB1C-10S-1.5H-EJR(52)
CB1G-10S-1.5H-PEJC2	CB1G-10S-1.5H-PEJC2

PDF Datasheet Preview
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at or contact your Hirose sales representative. Memory Connectors CB1 Series Card Push Insert/Push Eject <CB1G Series> sOutline Receptacle connectors for use with the new generation of digital media devices requiring “Memory type of consumer removable memory card. Several variations are available Miniature, Low Profile and with or without ejection mechanism. sFeatures Indication of Incorrect Card Insertion Protection of the Contacts Incorrect insertion of the card will not damage the contacts. The card can be easily withdrawn and reinserted correctly. Excellent Card Handling The type that is equipped with an ejection mechanism provides a long ejection of the card which offers excellent card handling qualities. Memory Stick is a registered trademark of the Sony Corporation. q Card ejection distance of 10 mm q Mounting height of mm q Mounting area Smaller design is 78% of former size Button Touch Ejection <CB1F Series> q Card ejection with tactile button operation q Card ejection distance of 10 mm q Equipped with card ejection switch Without Card Ejection <CB1D Series> q Miniaturized, low profile design q Improved installation to the equipment is permitted using M1.7 tapping screws q Can be equipped with an ejection mechanism depending on the design of the equipment side portion Note Please position the card ejection button at the side of the equipment. The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at or contact your Hirose sales representative. sProduct Specifications Rating Current rating 0.5A Voltage rating 125V AC Operating temperature range -20ç to +85ç Note Storage temperature range -40ç to +85ç Operating humidity range Relative humidity 96% max. No condensation Item Insulation resistance Withstanding voltage Contact resistance Vibration Humidity Specification 1000 min. No flashover or insulation breakdown 100 max. No electrical discontinuity of 1 µs or more Contact resistance 40 max. from initial value Insulation resistance 100 min. Conditions 500 V DC 500 V AC / one minute 100mA DC Frequency 10 to 55 Hz, single amplitude of mm, 2 hours / 3 axis 96 hours at temperature of 40ç±2ç and humidity of 90% to 95% Temperature cycle Contact resistance 40 max. from initial value Insulation resistance 100 min. Temperature -55ç/+5ç to +35ç/+85ç/+5ç to +35ç Duration 30/5/30/5 Minutes 5 cycles Durability mating/unmating Contact resistance max. from initial value 12000 cycles at 400 to 600 cycles per hour Resistance to soldering heat No deformation of any component. No affect on contacts Reflow At the recommended temperature profile Manual soldering 300ç for 3 seconds Note :Includes temperature rise caused by current flow. sOrdering information CB 1 E - 10 S - H - PEJC - 1 Series name CB 2 Series No. 3 Ejector type C E With eject mechanism F Without eject mechanism A 4 Number of contacts 10 5 Connector type S Receptacle 6 Contact pitch mm 7 Surface mount 8 Eject mechanism codes: PEJC Card Push insert/Push eject EJL Left button eject EJR Right button eject 9 Suffix The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at or contact your Hirose sales representative. sLow Profile, Push Insert-Push Eject Memory stick card outline BPCB mounting pattern Card ejected Card fully inserted Card pushed for ejection 31 21 Part No. CB1G-10S-1.5H-PEJC2 CL No. CL689-0037-5 sButton Touch Eject Card ejected P=1.5 CONTACT No.1 P=1.5±0.03 BPCB mounting pattern Memory stick card outline 2 Eject stroke 13 Card fully inserted Part No. CB1F-10S-1.5H-TEJL-PA CL No. CL689-0028-4 sWithout Card Ejection P=1.5 CONTACT No.1 P=1.5±0.05 BPCB mounting pattern Part No. CB1D-10S-1.5H CL No. CL689-0021-5 CONTACT No.1 P=1.5 P=1.5±0.05 Card pushed for ejection

PDF Datasheet Preview

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at or contact your Hirose sales representative.

Memory Connectors

CB1 Series

Card Push Insert/Push Eject <CB1G Series>
sOutline

Receptacle connectors for use with the new generation of digital media devices requiring “Memory type of consumer removable memory card. Several variations are available Miniature, Low Profile and with or without ejection mechanism.
sFeatures

Indication of Incorrect Card Insertion

Protection of the Contacts

Incorrect insertion of the card will not damage the contacts. The card can be easily withdrawn and reinserted correctly.

Excellent Card Handling

The type that is equipped with an ejection mechanism provides a long ejection of the card which offers excellent card handling qualities.
*Memory Stick is a registered trademark of the Sony Corporation.
q Card ejection distance of 10 mm q Mounting height of mm q Mounting area Smaller design is 78% of former
size

Button Touch Ejection <CB1F Series>
q Card ejection with tactile button operation q Card ejection distance of 10 mm q Equipped with card ejection switch

Without Card Ejection <CB1D Series>
q Miniaturized, low profile design q Improved installation to the equipment is permitted
using M1.7 tapping screws q Can be equipped with an ejection mechanism
depending on the design of the equipment side portion

Note Please position the card ejection button at the side of the equipment.

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at or contact your Hirose sales representative.
sProduct Specifications

Rating

Current rating 0.5A Voltage rating 125V AC

Operating temperature range -20ç to +85ç Note Storage temperature range -40ç to +85ç

Operating humidity range Relative humidity 96% max. No condensation

Item Insulation resistance Withstanding voltage Contact resistance Vibration

Humidity

Specification 1000 min. No flashover or insulation breakdown 100 max. No electrical discontinuity of 1 µs or more Contact resistance 40 max. from initial value Insulation resistance 100 min.

Conditions 500 V DC 500 V AC / one minute 100mA DC Frequency 10 to 55 Hz, single amplitude of mm, 2 hours / 3 axis 96 hours at temperature of 40ç±2ç and humidity of 90% to 95%

Temperature cycle

Contact resistance 40 max. from initial value Insulation resistance 100 min.

Temperature -55ç/+5ç to +35ç/+85ç/+5ç to +35ç Duration 30/5/30/5 Minutes 5 cycles

Durability mating/unmating

Contact resistance max. from initial value 12000 cycles at 400 to 600 cycles per hour

Resistance to soldering heat

No deformation of any component. No affect on contacts

Reflow At the recommended temperature profile Manual soldering 300ç for 3 seconds

Note :Includes temperature rise caused by current flow.
sOrdering information

CB 1 E - 10 S - H - PEJC - *
1 Series name CB
2 Series No.
3 Ejector type

C E With eject mechanism F

Without eject mechanism A
4 Number of contacts 10
5 Connector type S Receptacle
6 Contact pitch mm 7 Surface mount 8 Eject mechanism codes:

PEJC Card Push insert/Push eject EJL Left button eject EJR Right button eject 9 Suffix

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at or contact your Hirose sales representative.
sLow Profile, Push Insert-Push Eject

Memory stick card outline

BPCB mounting pattern

Card ejected Card fully inserted Card pushed for ejection
31 21

Part No. CB1G-10S-1.5H-PEJC2

CL No. CL689-0037-5
sButton Touch Eject

Card ejected

P=1.5

CONTACT No.1

P=1.5±0.03

BPCB mounting pattern

Memory stick card outline
2 Eject stroke
13 Card fully inserted

Part No. CB1F-10S-1.5H-TEJL-PA

CL No. CL689-0028-4
sWithout Card Ejection

P=1.5

CONTACT No.1

P=1.5±0.05

BPCB mounting pattern

Part No. CB1D-10S-1.5H

CL No. CL689-0021-5

CONTACT No.1

P=1.5

P=1.5±0.05

Card pushed for ejection

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived CB1C-10S-1.5H-EJR(59) Datasheet file may be downloaded here without warranties.

Datasheet ID: CB1C-10S-1.5H-EJR(59) 636086