HUFA75344P3_F085

HUFA75344P3_F085 Datasheet

HUFA75344G3, HUFA75344P3, HUFA75344S3S, HUFA75344S3

Part	Datasheet
HUFA75344P3_F085	HUFA75344P3_F085 (pdf)

Related Parts	Information
HUFA75344S3S	HUFA75344S3S
HUFA75344S3	HUFA75344S3
HUFA75344S3ST	HUFA75344S3ST
HUFA75344P3	HUFA75344P3
HUFA75344G3	HUFA75344G3

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HUFA75344G3, HUFA75344P3, HUFA75344S3S, HUFA75344S3 Data Sheet December 2004 75A, 55V, Ohm, N-Channel UltraFET Power MOSFETs Ordering Information PACKAGE BRAND HUFA75344G3 TO-247 75344G HUFA75344P3 TO-220AB 75344P HUFA75344S3S TO-263AB 75344S HUFA75344S3 TO-262AA 75344S NOTE When ordering, use the entire part number. Add the suffix T to obtain the TO-263AB variant in tape and reel, e.g., HUFA75344S3ST. Packaging SOURCE DRAIN GATE DRAIN TAB TO-247 • 75A, 55V • Simulation Models - Temperature Compensated and SABER Models - Thermal Impedance PSPICE and SABER Models Available on the web at: • Peak Current vs Pulse Width Curve • UIS Rating Curve • Related Literature - TB334, “Guidelines for Soldering Surface Mount Components to PC Boards” DRAIN FLANGE TO-220AB SOURCE DRAIN GATE GATE DRAIN FLANGE SOURCE TO-263AB SOURCE DRAIN GATE DRAIN FLANGE TO-262AA This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the requirements, see AEC Q101 at Reliability data can be found at: All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification. 2004 Fairchild Semiconductor Corporation HUFA75344G3, HUFA75344P3, HUFA75344S3S Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified Drain to Source Voltage Note 1 VDSS Drain to Gate Voltage RGS = Note 1 VDGR Gate to Source Voltage VGS Drain Current Continuous Figure ID Pulsed Drain Current .IDM Pulsed Avalanche Rating EAS Power Dissipation Derate Above 25oC Operating and Storage Temperature TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in 1.6mm from Case for 10s. .TL Package Body for 10s, See Techbrief 334 Tpkg 55 ±20 75 Figure 4 Figure 6 285 -55 to 175 300 260 UNITS V W/oC CAUTION Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE TJ = 25oC to 150oC. Electrical Specifications TC = 25oC, Unless Otherwise Specified

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HUFA75344G3, HUFA75344P3, HUFA75344S3S, HUFA75344S3

Data Sheet

December 2004
75A, 55V, Ohm, N-Channel UltraFET Power MOSFETs
Ordering Information

PACKAGE

BRAND

HUFA75344G3

TO-247
75344G

HUFA75344P3

TO-220AB
75344P

HUFA75344S3S

TO-263AB
75344S

HUFA75344S3

TO-262AA
75344S
NOTE When ordering, use the entire part number. Add the suffix T to obtain the TO-263AB variant in tape and reel, e.g., HUFA75344S3ST.

Packaging

SOURCE DRAIN GATE

DRAIN TAB

TO-247
• 75A, 55V
• Simulation Models
- Temperature Compensated and SABER Models
- Thermal Impedance PSPICE and SABER Models Available on the web at:
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount Components to PC Boards”

DRAIN FLANGE

TO-220AB

SOURCE DRAIN GATE

GATE

DRAIN FLANGE

SOURCE

TO-263AB

SOURCE DRAIN GATE

DRAIN FLANGE

TO-262AA

This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the requirements, see AEC Q101 at Reliability data can be found at:

All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
2004 Fairchild Semiconductor Corporation

HUFA75344G3, HUFA75344P3, HUFA75344S3S

Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified

Drain to Source Voltage Note 1 VDSS Drain to Gate Voltage RGS = Note 1 VDGR Gate to Source Voltage VGS Drain Current

Continuous Figure ID

Pulsed Drain Current .IDM

Pulsed Avalanche Rating EAS

Power Dissipation Derate Above 25oC

Operating and Storage Temperature TJ, TSTG Maximum Temperature for Soldering

Leads at 0.063in 1.6mm from Case for 10s. .TL Package Body for 10s, See Techbrief 334 Tpkg
55 ±20
75 Figure 4 Figure 6
285 -55 to 175
300 260

UNITS V

W/oC

CAUTION Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE TJ = 25oC to 150oC.

Electrical Specifications TC = 25oC, Unless Otherwise Specified

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Datasheet ID: HUFA75344P3_F085 633982