HUFA75333P3

HUFA75333P3 Datasheet

HUFA75333G3, HUFA75333P3, HUFA75333S3S

Part	Datasheet
HUFA75333P3	HUFA75333P3 (pdf)

Related Parts	Information
HUFA75333S3S	HUFA75333S3S
HUFA75333S3ST	HUFA75333S3ST

PDF Datasheet Preview
HUFA75333G3, HUFA75333P3, HUFA75333S3S Data Sheet December 2001 66A, 55V, Ohm. N-Channel UltraFET Power MOSFETs Formerly developmental type TA75333. Ordering Information PACKAGE BRAND HUFA75333G3 TO-247 75333G HUFA75333P3 TO-220AB 75333P HUFA75333S3S TO-263AB 75333S NOTE When ordering, use the entire part number. Add the suffix T to obtain the TO-263AB variant in tape and reel, e.g., HUFA75333S3ST. Packaging JEDEC STYLE TO-247 SOURCE DRAIN GATE • 66A, 55V • Simulation Models - Temperature Compensated and SABER Models - SPICE and SABER Thermal Impedance Models Available on the WEB at: • Peak Current vs Pulse Width Curve • UIS Rating Curve • Related Literature - TB334, “Guidelines for Soldering Surface Mount Components to PC Boards” JEDEC TO-220AB DRAIN FLANGE SOURCE DRAIN GATE DRAIN TAB JEDEC TO-263AB GATE SOURCE DRAIN FLANGE This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the requirements, see AEC Q101 at: Reliability data can be found at All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification. 2001 Fairchild Semiconductor Corporation HUFA75333G3, HUFA75333P3, HUFA75333S3S Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified Drain to Source Voltage Note 1 VDSS Drain to Gate Voltage RGS = Note 1 VDGR Gate to Source Voltage VGS Drain Current Continuous Figure ID Pulsed Drain Current IDM Pulsed Avalanche Rating EAS Power Dissipation Derate Above 25oC Operating and Storage Temperature TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in 1.6mm from Case for 10s TL Package Body for 10s, See Techbrief 334 Tpkg 55 ±20 66 Figure 4 Figures 6, 14, 15 150 1 -55 to 175 300 260 UNITS V W/oC CAUTION Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE TJ = 25oC to 150oC. Electrical Specifications TC = 25oC, Unless Otherwise Specified PARAMETER TEST CONDITIONS OFF STATE SPECIFICATIONS

PDF Datasheet Preview

HUFA75333G3, HUFA75333P3, HUFA75333S3S

Data Sheet

December 2001
66A, 55V, Ohm. N-Channel UltraFET Power MOSFETs

Formerly developmental type TA75333.
Ordering Information

PACKAGE

BRAND

HUFA75333G3

TO-247
75333G

HUFA75333P3

TO-220AB
75333P

HUFA75333S3S

TO-263AB
75333S
NOTE When ordering, use the entire part number. Add the suffix T to obtain the TO-263AB variant in tape and reel, e.g., HUFA75333S3ST.

Packaging

JEDEC STYLE TO-247

SOURCE DRAIN GATE
• 66A, 55V
• Simulation Models
- Temperature Compensated and SABER Models
- SPICE and SABER Thermal Impedance Models Available on the WEB at:
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount Components to PC Boards”

JEDEC TO-220AB

DRAIN FLANGE

SOURCE DRAIN GATE

DRAIN TAB

JEDEC TO-263AB

GATE SOURCE

DRAIN FLANGE

This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the requirements, see AEC Q101 at:

Reliability data can be found at All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
2001 Fairchild Semiconductor Corporation

HUFA75333G3, HUFA75333P3, HUFA75333S3S

Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified

Drain to Source Voltage Note 1 VDSS Drain to Gate Voltage RGS = Note 1 VDGR Gate to Source Voltage VGS Drain Current

Continuous Figure ID

Pulsed Drain Current IDM

Pulsed Avalanche Rating EAS

Power Dissipation Derate Above 25oC

Operating and Storage Temperature TJ, TSTG Maximum Temperature for Soldering

Leads at 0.063in 1.6mm from Case for 10s TL Package Body for 10s, See Techbrief 334 Tpkg
55 ±20
66 Figure 4 Figures 6, 14, 15
150 1
-55 to 175
300 260

UNITS V

W/oC

CAUTION Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE TJ = 25oC to 150oC.

Electrical Specifications TC = 25oC, Unless Otherwise Specified

PARAMETER

TEST CONDITIONS

OFF STATE SPECIFICATIONS

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Datasheet ID: HUFA75333P3 633978