FEB156-001 User’s Guide
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FEB156-001 User’s Guide Motor Control Evaluation Board Using the Motion-SPM FSAM20SM60A in a DIP 60mm x 31mm Package 2006 Fairchild Semiconductor Page 1 of 11 Contents Product Description Circuit Designed Schematic Bill of Materials Printed Circuit Board Selection of the Recommended RSC 2006 Fairchild Semiconductor Page 2 of 11 Introduction This user’s guide supports the FSAM20SM60A, Motion-SPM in a DIP package evaluation board. It should be used in conjunction with the FSAM20SM60A data sheet. Product Description The Motion-SPMs in DIP packages provide complete adjustable-speed motor drive control and fully-integrated circuit protection for ac motors found in medium-speed low-power inverter driven applications such as washing machines and air conditioners. Fairchild’s FSAM20SM60A combines optimized circuit protection and drive matched to low-loss IGBTs. Highly effective short-circuit current detection/protection is realized through the use of advanced current sensing IGBT chips that allow continuous monitoring of the IGBTs current. System reliability is further enhanced by the built-in over-temperature monitoring and integrated undervoltage lock-out protection. The high speed built-in HVIC provides opto-coupler-less IGBT gate driving capability that further reduce the overall size of the inverter system design. In addition the incorporated HVIC facilitates the use of single-supply drive topology enabling the FSAM20SM60A to be driven by only one drive supply voltage without negative bias. Inverter current sensing application can be achieved due to the divided negative dc terminals. This Motion-SPM is available in a small 60mm x 31mm , ceramic-based transfer molded-type package that optimizes heat transfer from the IGBTs. Circuit Description The Motion-SPM is installed as the switching module in this evaluation board with direct CPU interface and without a shunt resistor. This board internally consists of Motion-SPM, protection parts including UV and short-current SC protection, single grounded power supply and opto-coupler-less interface, bootstrap components, temperature sensing part for internal thermistor, fault output part and power connection terminals DC-link input P,N as well as a motor input connection U,V,W . The DC-link P and N input terminals are connected into the corresponding terminals in MotionSPM and three-phase U,V,W output terminals from SPM are wired into motor input. Since the three HVICs are integrated in the Motion-SPM, 3 parts of bootstrap circuit are needed, which consists of bootstrap capacitor, charge resistor for charging boost capacitor, blocking diode for high voltage isolation. One shunt resistor is used for sensing short current and the related short current circuit is composed of an external shunt resistor and R-C low pass The signal of fault output pin VFO drops from high level to low when a fault, such as UV Under Voltage or SC Short Circuit , happens. A pull-up resistor and capacitor are needed to support this action. Six R-C low pass are used between input connector from a DSP controller or other controllers and gate input signal pins of Motion-SPM. Since the thermistor is integrated in the SPM, an external resistor and capacitor are used for over-temperature monitoring. 2006 Fairchild Semiconductor Page 3 of 11 Designed Solution Schematic 2006 Fairchild Semiconductor Test Board Gating UH Gating VH Gating WH Gating UL Gating VL Gating WL Fault RTH 5V line 15V line 8 RTH 10 15V 11 GND 15V 10 GND 11 5V line 15V line C25 220µF C28 104 15V line 5V line R19 100 1/8W R3 4.7K 1/8W C3 122 R18 100 1/8W R2 4.7K 1/8W C2 122 R17 100 1/8W 5V line R1 4.7K 1/8W |
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