FDS8934A

FDS8934A Datasheet

FDS8934A Dual P-Channel Enhancement Mode Field Effect Transistor

Part	Datasheet
FDS8934A	FDS8934A (pdf)

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May 1998 FDS8934A Dual P-Channel Enhancement Mode Field Effect Transistor SO-8 P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed. -4 A , -20 V, RDS ON = VGS = V, RDS ON = VGS = V. High density cell design for extremely low RDS ON . High power and current handling capability in a widely used surface mount package. Dual MOSFET in surface mount package. SOT-23 SuperSOTTM-6 SuperSOTTM-8 D2 D1 F8D9S34A SO-8 pin 1 G1 S1 SO-8 SOT-223 5 6 7 8 Absolute Maximum Ratings TA = 25oC unless otherwise noted Symbol Parameter VDSS Drain-Source Voltage VGSS Gate-Source Voltage Drain Current - Continuous - Pulsed Note 1a Power Dissipation for Dual Operation Power Dissipation for Single Operation Note 1a Note 1b Note 1c TJ,TSTG Operating and Storage Temperature Range THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Ambient Note 1a Thermal Resistance, Junction-to-Case Note 1 1998 Fairchild Semiconductor Corporation FDS8934A -20 -8 -4 -20 2 1 -55 to 150 78 40 SOIC-16 4 3 2 1 Units V A W °C °C/W °C/W Electrical Characteristics TA = 25 OC unless otherwise noted

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May 1998

FDS8934A Dual P-Channel Enhancement Mode Field Effect Transistor

SO-8 P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.
-4 A , -20 V, RDS ON = VGS = V, RDS ON = VGS = V.

High density cell design for extremely low RDS ON . High power and current handling capability in a widely used surface mount package. Dual MOSFET in surface mount package.

SOT-23

SuperSOTTM-6

SuperSOTTM-8

D2 D1

F8D9S34A

SO-8
pin 1

G1 S1

SO-8

SOT-223
5 6 7 8

Absolute Maximum Ratings TA = 25oC unless otherwise noted

Symbol Parameter

VDSS

Drain-Source Voltage

VGSS

Gate-Source Voltage

Drain Current - Continuous
- Pulsed

Note 1a

Power Dissipation for Dual Operation

Power Dissipation for Single Operation Note 1a

Note 1b

Note 1c

TJ,TSTG Operating and Storage Temperature Range THERMAL CHARACTERISTICS

Thermal Resistance, Junction-to-Ambient Note 1a

Thermal Resistance, Junction-to-Case Note 1
1998 Fairchild Semiconductor Corporation

FDS8934A -20 -8 -4 -20 2 1
-55 to 150
78 40

SOIC-16
4 3 2 1

Units V A W
°C °C/W °C/W

Electrical Characteristics TA = 25 OC unless otherwise noted

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Datasheet ID: FDS8934A 514383